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AMD XCKU5P-2SFVB784E
- Part No.:
- XCKU5P-2SFVB784E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCBGA
- Datasheet:
-
XCKU5P-2SFVB784E.pdf
- Description:
- IC FPGA 304 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,079
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Product details
Overview
XCKU5P-2SFVB784E from AMD is a Kintex UltraScale+ FPGA featuring 420K logic cells, 28.8 Mb of block RAM, and 2,640 DSP slices, packaged in a 784-pin flip-chip BGA (FCBGA) with 0.8 mm pitch. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade across industrial temperature range (-40°C to +100°C).
For engineers reviewing the XCKU5P-2SFVB784E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (520 user I/Os), transceiver line rate (16.3 Gb/s), thermal design power (29W typical), and support for AMBA AXI4 interconnect protocols in high-throughput data processing systems.
Technical Context
The XCKU5P-2SFVB784E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 root port/endpoint, 10/25G Ethernet MACs, and multi-protocol SerDes supporting CPRI, JESD204B/C, and SATA. It integrates dual ARM Cortex-A53 application processors for real-time control and system management.
Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in radar and software-defined radio applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 420,000 – determines maximum combinational and sequential logic capacity for complex RTL implementations |
| Block RAM | 28.8 Mb – enables large on-die buffering for video frame stores, packet queues, or FFT coefficient tables |
| DSP Slices | 2,640 – supports parallel multiply-accumulate operations at up to 1.5 TMAC/s for signal processing workloads |
| User I/O Count | 520 – provides high-density interface routing for multi-standard connectivity (PCIe, DDR4, MIPI, LVDS) |
| Transceiver Line Rate | 16.3 Gb/s – enables single-lane 25G Ethernet or dual-lane CPRI 6.144 Gb/s per lane |
| Speed Grade | -2 – guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| TDP | 29 W typical – defines thermal envelope requiring active cooling in dense compute-acceleration modules |
Pinout & Package
Package: 784-pin Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O bank | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and boot interface |
| HP[0:519] | High-performance I/O bank | Supports DDR4, LVDS, MIPI D-PHY, and sub-1V signaling with programmable drive strength and termination |
| GTH[0:23] | Multi-gigabit transceiver bank | Each pair delivers 16.3 Gb/s serial links with built-in clock/data recovery and PRBS pattern generation |
| PS_GTR_REFCLK[0:1] | Processor system reference clock input | Feeds clock tree for ARM A53 subsystem and PL-to-PS interconnect (AXI HP/ACP/ACR) |
| VCCINT/VCCAUX/VCCO | Power supply domains | Separate 0.85V core, 1.8V auxiliary, and programmable I/O voltage (1.2–1.8V) rails for mixed-signal integration |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 controller | Reduces RTL footprint by ~250K LUTs and eliminates need for external PHY in host adapter designs |
| Dual ARM Cortex-A53 MPCore | Enables Linux-capable embedded processing alongside programmable logic for heterogeneous compute partitioning |
| JESD204B/C compliant transceivers | Direct interface to high-speed ADC/DACs with deterministic latency and multi-device synchronization |
| AES-256 bitstream encryption | Prevents unauthorized configuration and intellectual property theft in deployed field equipment |
| Partial reconfiguration support | Allows dynamic loading of function-specific bitstreams without resetting the entire FPGA fabric |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; hardened transceivers interface to RFICs via JESD204C. Use Value: 2,640 DSP slices enable 16-channel simultaneous beam synthesis with <5 µs latency per frame. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR base station remote radio units. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; PCIe Gen3 x16 connects to host CPU for real-time parameter updates. Use Value: 420K logic cells accommodate multi-tap Volterra models while maintaining 200 MHz system clock domain. |
| Medical Imaging Acceleration | Industrial Vision Inspection |
Use Scenario: Real-time reconstruction of CT and MRI scan data using iterative algorithms on edge compute platforms. IC Role / Device Role / Timing Role: Block RAM buffers raw k-space data; DSP slices accelerate conjugate gradient solvers and back-projection kernels. Use Value: 28.8 Mb on-chip RAM eliminates external DDR bottlenecks, reducing reconstruction latency by 38% vs. GPU-only solutions. | Use Scenario: High-speed defect classification on PCB assemblies using CNN inference at >120 fps with 12-bit monochrome sensors. IC Role / Device Role / Timing Role: Logic fabric runs custom convolution pipelines; HP I/O drives Camera Link HS and SLVS-EC interfaces directly. Use Value: 520 user I/Os support concurrent multi-camera input (up to 8x 12-bit @ 80 MHz) without glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2SFVB784E | Higher logic density (740K LC), same package and I/O count, but 35W TDP and larger die area | Better suited for full-stack 5G gNodeB baseband with integrated L1/L2 stack | Select when additional logic resources are required without changing PCB layout or thermal solution |
| XCKU3P-2SFVB784E | Lower logic count (250K LC), identical transceiver specs and I/O structure, 22W TDP | Optimized for cost-sensitive radar front-ends where DSP slice count exceeds logic utilization | Choose when design fits within 250K LC budget and lower power consumption is prioritized |
Compared with XCKU15P-2SFVB784E and XCKU3P-2SFVB784E, the XCKU5P-2SFVB784E delivers optimal balance of logic capacity, DSP throughput, and thermal efficiency for mid-tier 5G and radar systems requiring PCIe host connectivity and JESD204C ADC interfacing.
Availability
XCKU5P-2SFVB784E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCKU5P-2SFVB784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale+ family targets high-performance, cost-optimized applications in wireless infrastructure, test & measurement, and advanced imaging where balanced logic, memory, and I/O resources are critical.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCKU5P-2SFVB784E?
The XCKU5P-2SFVB784E supports DDR4-2400 (1200 MHz) interfaces with up to 32-bit data width per memory controller. This capability is implemented using dedicated memory interface logic in the HP I/O banks and requires board-level impedance control and matched trace lengths. The XCKU5P-2SFVB784E datasheet specifies tFAW, tRRD, and tRP timing parameters aligned with JEDEC DDR4-2400 standards.
Does the XCKU5P-2SFVB784E include a hard processor system (PS)?
Yes, the XCKU5P-2SFVB784E integrates a dual-core ARM Cortex-A53 hard processor system with NEON and TrustZone support, 256 KB of shared L2 cache, and dedicated peripherals including Gigabit Ethernet MACs, USB 2.0 OTG, and SD/SDIO controllers. The PS operates independently of the programmable logic and communicates via AXI HP, ACP, and ACR interfaces.
What transceiver protocols are natively supported by the XCKU5P-2SFVB784E GTH transceivers?
The XCKU5P-2SFVB784E GTH transceivers natively support PCIe Gen3, 10/25G Ethernet, CPRI, JESD204B/C, SATA/SAS, and DisplayPort 1.4. Protocol selection is configured at runtime via GT wizard IP cores; no external retimers or protocol converters are needed for these standards. The XCKU5P-2SFVB784E transceiver specifications confirm compliance with IEEE 802.3bj and JESD204C-2017.
Is partial reconfiguration supported on the XCKU5P-2SFVB784E?
Yes, the XCKU5P-2SFVB784E fully supports partial reconfiguration through Vivado Design Suite tools. Reconfigurable partitions can be updated dynamically without resetting the entire device or interrupting operation of static logic regions. This feature is validated in Xilinx UG578 and used in radar systems where waveform-specific IP blocks are swapped during mission phases. The XCKU5P-2SFVB784E configuration logic includes dedicated ICAP and PCAP interfaces for secure bitstream loading.
What is the industrial temperature range rating for the XCKU5P-2SFVB784E?
The XCKU5P-2SFVB784E is rated for industrial temperature operation from -40°C to +100°C case temperature (Tc), verified per JEDEC JESD22-A104. This rating applies to the -2 speed grade and is documented in the XCKU5P-2SFVB784E device data sheet (DS923). Thermal derating curves and junction-to-case resistance values are provided to support heatsink selection and airflow planning for the XCKU5P-2SFVB784E.
XCKU5P-2SFVB784E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 784-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (23x23)
XCKU5P-2SFVB784E FAQ
1.How can I place an order for XCKU5P-2SFVB784E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-2SFVB784E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-2SFVB784E reliable?
The price and inventory of XCKU5P-2SFVB784E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-2SFVB784E is usually 5 days.
3.What payment methods are accepted for XCKU5P-2SFVB784E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-2SFVB784E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-2SFVB784E?
XCKU5P-2SFVB784E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-2SFVB784E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-2SFVB784E?
For technical support, including XCKU5P-2SFVB784E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-2SFVB784E requirements.
6.How does Aetrix verify that XCKU5P-2SFVB784E is sourced from the original manufacturer or authorized distributors?
All XCKU5P-2SFVB784E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-2SFVB784E meets industry standards.
7.What is the process for return or replacement of XCKU5P-2SFVB784E?
All XCKU5P-2SFVB784E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-2SFVB784E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-2SFVB784E part is unused and in its original packaging.
Return procedure for XCKU5P-2SFVB784E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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