AMD XCKU5P-2SFVB784I
- Part No.:
- XCKU5P-2SFVB784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCBGA
- Datasheet:
-
XCKU5P-2SFVB784I.pdf
- Description:
- IC FPGA 304 I/O 784FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,990
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU5P-2SFVB784I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 420K logic cells, 28.8 Gb/s GTY transceivers, and integrated 100G Ethernet MAC blocks. It implements real-time signal processing in 5G radio units, supports deterministic latency for industrial TSN networks, and delivers hardened PCIe Gen4 x16 root complex functionality.
For engineers reviewing the XCKU5P-2SFVB784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility (1.2V/1.35V/1.8V), and availability of hardened IP for 100G Ethernet and PCIe Gen4.
Technical Context
The XCKU5P-2SFVB784I integrates 24 GTY transceiver quads operating up to 28.8 Gb/s with PAM4 support, and includes 12 hardened 100G Ethernet MACs with RS-FEC. Its programmable logic fabric uses 6-input LUTs with distributed RAM and shift registers, and the device supports AXI4-Stream and AXI4-Lite interfaces for high-throughput data movement.
It features dual 64-bit DDR4 memory controllers running at 2400 MT/s, 2,160 DSP slices optimized for complex multiply-accumulate operations, and configuration via Quad-SPI or BPI with AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 420,000 - Enables implementation of multi-channel 5G baseband processing or real-time AI inference pipelines. |
| GTY Transceivers | 24 quads @ 28.8 Gb/s - Supports 100G/200G/400G optical interconnects with PAM4 encoding. |
| Hardened 100G MAC | 12 instances - Offloads full line-rate 100GbE packet processing from soft logic, reducing resource usage. |
| PCIe Gen4 Interface | Root Complex x16 - Provides native host CPU connectivity without external bridge ICs. |
| DDR4 Memory Controller | Dual 64-bit @ 2400 MT/s - Delivers 38.4 GB/s aggregate bandwidth for frame buffering and data staging. |
| DSP Slices | 2,160 - Accelerates FFT, filtering, and beamforming algorithms in wireless infrastructure. |
Pinout & Package
The XCKU5P-2SFVB784I is housed in a 784-pin Flip-Chip Ball Grid Array (FCBGA) package with 35×35 mm body size, 0.8 mm ball pitch, and thermal lid. I/O banks are organized into 12 groups supporting mixed-voltage operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals in Zynq UltraScale+ MPSoC hybrid mode. |
| GTYP/GTYN | High-speed differential transceiver pairs | Supports 28.8 Gb/s PAM4 or NRZ; each pair routes to dedicated SerDes lanes with on-die termination. |
| HP[0:71] | High-performance I/O bank | Operates at 1.2V/1.35V/1.8V; supports MIPI D-PHY, LVDS, and SSTL-12 for memory and sensor interfaces. |
| VRP/VRN | Voltage reference pins | Provide precision reference for differential input standards across adjacent HP I/O banks. |
| CONFIG_* / INIT_B | Configuration control | Manage boot mode selection, configuration status, and fallback recovery during bitstream loading. |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | 6-input LUTs with carry chain and distributed RAM enable efficient arithmetic and state-machine logic. |
| Hardened 100G Ethernet MAC | Reduces soft logic utilization by ~35% versus equivalent RTL implementation; supports IEEE 802.3bj RS-FEC. |
| PCIe Gen4 x16 Root Complex | Eliminates need for external switch or bridge IC in accelerator cards targeting GPU/CPU host systems. |
| AES-256 + HMAC Security | Ensures authenticated, encrypted bitstream loading to prevent cloning and reverse engineering. |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of logic regions while system remains operational, critical for radar waveform updates. |
Applications
| 5G Massive MIMO Radio Unit | Industrial Time-Sensitive Networking (TSN) |
|---|---|
Use Scenario: Real-time beamforming and precoding across 64+ antenna elements with sub-microsecond latency constraints. IC Role / Device Role / Timing Role: Primary signal processing engine implementing Layer 1 PHY functions and deterministic timing synchronization. Use Value: Hardened GTY transceivers and DSP slices deliver 28.8 Gb/s fronthaul interface and 128-point FFT acceleration without external co-processors. | Use Scenario: Synchronized motion control across distributed PLCs and servo drives in semiconductor manufacturing equipment. IC Role / Device Role / Timing Role: Deterministic packet scheduling node with hardware timestamping and time-aware shaper. Use Value: Sub-100 ns time synchronization accuracy and <1 µs jitter using IEEE 802.1AS-2020-compliant TSN IP blocks. |
| Data Center SmartNIC Acceleration | Radar Signal Processing Platform |
Use Scenario: Offloading RDMA, TLS encryption, and packet classification in cloud server NICs. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint with integrated 100G Ethernet MAC and DMA engines. Use Value: Line-rate 100GbE processing with zero-copy host memory access via AXI4-Stream to DDR4 controller. | Use Scenario: Pulse-Doppler and SAR imaging processing in airborne radar systems requiring radiation tolerance. IC Role / Device Role / Timing Role: Reconfigurable digital backend handling ADC sampling, pulse compression, and CFAR detection. Use Value: 2,160 DSP slices and 420K logic cells support concurrent multi-band radar modes with dynamic partial reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVD900I | Higher logic density (920K cells), larger 900-pin FCBGA, no hardened 100G MAC | Better suited for compute-intensive workloads where soft 100G MAC is acceptable | Select when maximum logic capacity outweighs need for hardened Ethernet IP |
| XCKU060-2FFVA1156I | Fewer GTY quads (16), lower transceiver speed (25.78 Gb/s), same 100G MAC count | Targeted at cost-sensitive 40G/100G line cards with reduced channel count | Select when 28.8 Gb/s PAM4 is not required and board space allows larger 1156-pin package |
Compared with XCKU15P-2FFVD900I and XCKU060-2FFVA1156I, the XCKU5P-2SFVB784I uniquely balances 420K logic cells, 28.8 Gb/s GTY transceivers, and 12 hardened 100G MACs in a compact 784-pin package-making it optimal for space-constrained 5G RU and SmartNIC designs requiring both high-speed serial I/O and deterministic Ethernet processing.
Availability
XCKU5P-2SFVB784I is available at Aetrix Electronics and suitable for 5G infrastructure, industrial TSN gateways, and data center SmartNICs requiring stable component supply across extended product lifecycles.
Supply support for XCKU5P-2SFVB784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through its Adaptive SoC and FPGA portfolio.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, test & measurement, and aerospace systems where hardened IP and power efficiency are critical.
FAQ
What is the maximum data rate supported by the GTY transceivers on the XCKU5P-2SFVB784I?
The XCKU5P-2SFVB784I supports GTY transceivers operating up to 28.8 Gb/s per lane using PAM4 modulation. This enables 100G, 200G, and 400G Ethernet implementations with RS-FEC. The transceiver architecture includes built-in clock data recovery, equalization, and PRBS pattern generation for compliance testing. Each GTY quad contains four transceiver lanes with independent TX/RX calibration.
Does the XCKU5P-2SFVB784I include hardened PCIe Gen4 support?
Yes, the XCKU5P-2SFVB784I integrates a hardened PCIe Gen4 x16 root complex block. It supports link training, error reporting, and Advanced Error Reporting (AER) without consuming programmable logic resources. The block interfaces directly with the AXI4-Stream fabric and supports MSI-X interrupt delivery. This eliminates the need for external PCIe switches in accelerator card designs.
How many hardened 100G Ethernet MAC blocks does the XCKU5P-2SFVB784I provide?
The XCKU5P-2SFVB784I includes 12 hardened 100G Ethernet MAC blocks compliant with IEEE 802.3bj RS-FEC. Each MAC supports full line-rate 100GbE processing with integrated CRC generation, flow control, and statistics collection. These blocks reduce logic utilization by approximately 35% compared to soft RTL implementations and operate independently across multiple I/O banks.
What memory interface standards are supported by the XCKU5P-2SFVB784I?
The XCKU5P-2SFVB784I integrates dual 64-bit DDR4 memory controllers supporting data rates up to 2400 MT/s. It also supports LPDDR4 at 4266 MT/s and RLDRAM3 at 2133 MT/s. All controllers include ECC support, programmable read/write leveling, and dynamic calibration. The memory subsystem connects directly to the AXI4-Stream interconnect fabric with configurable burst lengths and priority arbitration.
Is the XCKU5P-2SFVB784I suitable for radiation-tolerant applications?
The XCKU5P-2SFVB784I is not a radiation-hardened device. It is qualified for industrial temperature range (–40°C to +100°C) and meets JESD22-A108 reliability standards. For aerospace or satellite applications requiring TID tolerance or SEE mitigation, AMD offers the XQRKU060 and XQKU060Q radiation-tolerant variants-neither of which share the same hardened 100G MAC or GTY transceiver specifications as the XCKU5P-2SFVB784I.
XCKU5P-2SFVB784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 784-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (23x23)
XCKU5P-2SFVB784I FAQ
1.How can I place an order for XCKU5P-2SFVB784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-2SFVB784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-2SFVB784I reliable?
The price and inventory of XCKU5P-2SFVB784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-2SFVB784I is usually 5 days.
3.What payment methods are accepted for XCKU5P-2SFVB784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-2SFVB784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-2SFVB784I?
XCKU5P-2SFVB784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-2SFVB784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-2SFVB784I?
For technical support, including XCKU5P-2SFVB784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-2SFVB784I requirements.
6.How does Aetrix verify that XCKU5P-2SFVB784I is sourced from the original manufacturer or authorized distributors?
All XCKU5P-2SFVB784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-2SFVB784I meets industry standards.
7.What is the process for return or replacement of XCKU5P-2SFVB784I?
All XCKU5P-2SFVB784I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-2SFVB784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-2SFVB784I part is unused and in its original packaging.
Return procedure for XCKU5P-2SFVB784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU5P-2SFVB784I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

