AMD XCKU5P-3FFVB676E

Overview

XCKU5P-3FFVB676E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 420K logic cells, 28.8 Gb/s GTY transceivers, and integrated 100G Ethernet MAC blocks. It operates at -3 speed grade, supports DDR4 memory interfaces up to 2400 Mbps, and is deployed in 5G radio unit baseband processing.

For engineers reviewing the XCKU5P-3FFVB676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, programmable logic density, memory interface support, thermal design power budget, and package I/O count for high-speed PCB routing.

Technical Context

The XCKU5P-3FFVB676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DMA engines), and multi-rate GTY transceivers supporting PAM4 and NRZ modulation. It integrates dual ARM Cortex-A53 processors for real-time control and system management.

Configuration is performed via quad-SPI or BPI flash, with secure bitstream encryption and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation in telecom infrastructure.

Key Specifications

Pinout & Package

The XCKU5P-3FFVB676E uses a 676-pin FCBGA package (27×27 mm, 0.8 mm pitch) with 332 user I/Os, including 160 high-speed differential pairs compatible with LVDS, SSTL, and HSTL standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based high-speed signal processing applications.

Compared with XCKU15P-2FFVA1156I and XCKU060-2FFVA1156E, the XCKU5P-3FFVB676E delivers optimal balance of transceiver bandwidth, logic capacity, and thermal envelope for single-slot 100G baseband and test equipment designs-avoiding overdesign while maintaining headroom for future feature upgrades.

Availability

XCKU5P-3FFVB676E is available at Aetrix Electronics and suitable for 5G infrastructure, high-speed test instrumentation, and AI acceleration applications requiring stable component supply across multi-year production cycles.

Supply support for XCKU5P-3FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, test & measurement, and compute acceleration where performance-per-watt and integration density are critical.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU5P-3FFVB676E?

The XCKU5P-3FFVB676E supports GTY transceivers rated up to 28.8 Gb/s per lane. This enables full compliance with IEEE 802.3bj (100GBASE-CR4) and OTU4 (112 Gb/s) protocols. The XCKU5P-3FFVB676E achieves this rate using PAM4 signaling with built-in decision feedback equalization and continuous-time linear equalization.

Does the XCKU5P-3FFVB676E include hardened PCIe Gen4 controllers?

No, the XCKU5P-3FFVB676E integrates hardened PCIe Gen3 x16 controllers only. PCIe Gen4 support requires external retimers or use of UltraScale+ Virtex devices. The XCKU5P-3FFVB676E's Gen3 controller delivers 8 GT/s per lane with full ASO and AER capabilities, validated for CXL 1.1 compatibility.

Can the XCKU5P-3FFVB676E operate in industrial temperature range?

Yes, the XCKU5P-3FFVB676E with suffix 'E' is rated for industrial temperature range (-40°C to +100°C junction). Thermal design must maintain junction temperature within specification using the documented thermal resistance (θJA = 5.2°C/W) and appropriate heatsinking. The XCKU5P-3FFVB676E meets JEDEC JESD22-A104 reliability standards for industrial environments.

How many DDR4 memory interfaces does the XCKU5P-3FFVB676E support simultaneously?

The XCKU5P-3FFVB676E supports up to two independent DDR4 memory interfaces, each configurable for 72-bit width (64 data + 8 ECC) at 2400 Mbps. Each interface uses dedicated HP I/O banks with programmable output drive strength and input termination. The XCKU5P-3FFVB676E provides separate clocking and calibration logic for each interface.

Is partial reconfiguration supported on the XCKU5P-3FFVB676E?

Yes, the XCKU5P-3FFVB676E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules while keeping other portions of the design operational. The XCKU5P-3FFVB676E implements frame-based reconfiguration with CRC-protected bitstream loading and error detection for field-upgradable functions.