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AMD XCKU5P-3SFVB784E
- Part No.:
- XCKU5P-3SFVB784E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCBGA
- Datasheet:
-
XCKU5P-3SFVB784E.pdf
- Description:
- IC FPGA 304 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,821
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Product details
Overview
XCKU5P-3SFVB784E from AMD is a Kintex UltraScale+ FPGA featuring 376K logic cells, 24.9 Mb of block RAM, 2,520 DSP slices, and 48 transceivers supporting up to 32.75 Gb/s. It is housed in a 784-pin flip-chip BGA (FCBGA) package with 0.8 mm pitch and operates across extended temperature range (–40°C to +100°C). This device targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU5P-3SFVB784E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O voltage support (1.2 V/1.35 V/1.8 V), thermal performance in air-cooled systems, and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XCKU5P-3SFVB784E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DDR4 controller), and high-speed serial transceivers. Its UltraScale+ architecture uses 16 nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.
This device supports dual-boot configuration via quad-SPI flash and includes integrated bitstream encryption (AES-256) and authentication (SHA-256). Configuration is performed through dedicated configuration pins compatible with IEEE 1532 and JTAG boundary-scan standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 376,000 - determines maximum combinational and sequential logic capacity for custom datapaths |
| Block RAM | 24.9 Mb - enables large on-die buffering for video frame stores or packet queues |
| DSP Slices | 2,520 - supports parallel multiply-accumulate operations for FIR filters and FFT engines |
| Transceivers | 48 × 32.75 Gb/s - provides native support for CPRI, eCPRI, and JESD204C interfaces |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing to ADCs, DACs, and memory devices |
| Configuration Interface | JTAG, SelectMAP, Quad-SPI - allows flexible programming and field updates without external microcontroller |
Pinout & Package
The XCKU5P-3SFVB784E is packaged in a 784-pin flip-chip BGA (FCBGA) with 0.8 mm pitch, 29 mm × 29 mm body size, and exposed thermal pad for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O bank | Configurable as GPIO, SDIO, UART, SPI, or I²C for peripheral control and debug |
| GTYP[0:47] | Transceiver quad bank | Each GTYP supports two transceiver channels with independent reference clocks and power domains |
| PL_CLK[0:3] | Programmable logic clock input | Dedicated differential inputs for global clock distribution with sub-100 ps skew |
| CONFIG_M[0:2] | Configuration mode select | Determines boot source (SPI, BPI, or JTAG) and data width during power-up |
| VCCINT | Core supply | 1.0 V ±3% supply for fabric and CLB logic; requires low-noise regulation |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 controller | Reduces RTL integration effort and ensures compliance with PCIe 3.1 electrical and protocol requirements |
| Integrated DDR4 memory controller | Supports up to 4 banks × 72-bit wide interfaces at 2400 MT/s with ECC capability |
| UltraScale+ architecture | Delivers 1.5× higher logic density and 2× more DSP throughput per mm² than previous generation |
| AES-256 bitstream encryption | Prevents unauthorized cloning and reverse engineering of configured logic functionality |
| Partial reconfiguration support | Enables runtime swapping of functional modules without system reset or interrupting active I/O paths |
Applications
| 5G Radio Unit (RU) | Phased Array Radar Processing |
|---|---|
Use Scenario: Real-time beamforming and digital pre-distortion in massive MIMO base stations. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filter algorithms while transceivers handle CPRI/eCPRI fronthaul links. Use Value: 48 × 32.75 Gb/s transceivers enable full-bandwidth IQ data transport from 64+ antenna elements. | Use Scenario: High-resolution target tracking using synthetic aperture techniques in airborne radar systems. IC Role / Device Role / Timing Role: Configurable logic processes pulse-Doppler FFTs; hardened 100G Ethernet MAC exports processed data to mission computers. Use Value: 2,520 DSP slices deliver >2.1 TMAC/s for real-time Doppler spectrum analysis at update rates >1 kHz. |
| High-Speed Test Equipment | Medical Imaging Data Acquisition |
Use Scenario: Multi-channel waveform generation and acquisition in automated test systems for semiconductor validation. IC Role / Device Role / Timing Role: FPGA implements pattern generators, jitter injectors, and error analyzers synchronized to ultra-low-jitter clocks. Use Value: 24.9 Mb block RAM buffers >128 million samples per channel for deep memory capture and playback. | Use Scenario: Real-time preprocessing of raw sensor data from CT and MRI scanner detector arrays. IC Role / Device Role / Timing Role: Logic fabric performs pixel correction, noise filtering, and compression before sending to GPU-accelerated reconstruction engines. Use Value: LVDS and MIPI I/O standards allow direct connection to high-speed analog front-end ASICs without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2SFVB784E | Fewer logic cells (336K), lower transceiver count (32), reduced DSP slices (2,160), same package | Suitable for cost-optimized 5G small cells where full RU bandwidth is not required | Select when system-level bandwidth and compute load are 20–25% lower than XCKU5P-3SFVB784E capabilities |
| XCKU085-2FFVA1156E | Larger 1156-pin FCBGA package, higher logic count (1.04M), 64 transceivers, but no hardened 100G Ethernet MAC | Better suited for multi-function baseband processing where PCIe host interface and memory bandwidth dominate over fronthaul density | Choose when board layout accommodates larger footprint and application demands greater logic capacity over transceiver density |
Compared with XCKU15P-2SFVB784E and XCKU085-2FFVA1156E, the XCKU5P-3SFVB784E delivers optimal balance of transceiver count, DSP throughput, and I/O flexibility for compact, thermally constrained 5G and radar platforms requiring native fronthaul and hardened IP.
Availability
XCKU5P-3SFVB784E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test instrumentation requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XCKU5P-3SFVB784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Kintex UltraScale+ family targets high-throughput, low-latency signal processing in communications infrastructure and defense electronics where transceiver density and hardened IP accelerate time-to-market.
FAQ
What is the maximum supported transceiver line rate for XCKU5P-3SFVB784E?
The XCKU5P-3SFVB784E supports a maximum transceiver line rate of 32.75 Gb/s per channel. This enables native implementation of JESD204C, CPRI, and eCPRI protocols. All 48 transceivers in the XCKU5P-3SFVB784E are rated for this speed under standard operating conditions, and the device includes built-in equalization and clock recovery circuitry optimized for these data rates.
Does XCKU5P-3SFVB784E support partial reconfiguration?
Yes, the XCKU5P-3SFVB784E supports partial reconfiguration through its UltraScale+ architecture. This capability allows specific logic regions to be updated dynamically without resetting the entire device or halting I/O operations. The XCKU5P-3SFVB784E implements this using frame-based bitstream loading and hierarchical design partitioning tools in Vivado Design Suite.
What configuration modes are supported by XCKU5P-3SFVB784E?
The XCKU5P-3SFVB784E supports JTAG, SelectMAP, and Quad-SPI flash configuration modes. Mode selection is controlled by CONFIG_M[0:2] pins at power-up. Quad-SPI is commonly used for single-image boot, while SelectMAP enables high-speed parallel programming via microcontroller or host processor. JTAG remains available for debugging and boundary-scan testing throughout the product lifecycle.
What is the I/O voltage range supported by XCKU5P-3SFVB784E?
The XCKU5P-3SFVB784E supports multiple I/O standards with corresponding voltage ranges: LVCMOS (1.2 V, 1.35 V, 1.5 V, 1.8 V), SSTL (1.2 V, 1.35 V, 1.5 V), and HSTL (1.2 V, 1.5 V). Each I/O bank is independently configurable, allowing mixed-voltage operation across different peripherals. The XCKU5P-3SFVB784E does not support 2.5 V or 3.3 V I/O standards.
Is XCKU5P-3SFVB784E qualified for extended temperature operation?
Yes, the XCKU5P-3SFVB784E is specified for extended temperature operation from –40°C to +100°C. This rating applies to the commercial-grade (-3) speed grade and is validated per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life tests. The device's thermal pad and FCBGA packaging support reliable operation in fanless or convection-cooled enclosures typical in outdoor 5G and avionics applications.
XCKU5P-3SFVB784E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 784-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (23x23)
XCKU5P-3SFVB784E FAQ
1.How can I place an order for XCKU5P-3SFVB784E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-3SFVB784E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-3SFVB784E reliable?
The price and inventory of XCKU5P-3SFVB784E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-3SFVB784E is usually 5 days.
3.What payment methods are accepted for XCKU5P-3SFVB784E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-3SFVB784E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-3SFVB784E?
XCKU5P-3SFVB784E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-3SFVB784E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-3SFVB784E?
For technical support, including XCKU5P-3SFVB784E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-3SFVB784E requirements.
6.How does Aetrix verify that XCKU5P-3SFVB784E is sourced from the original manufacturer or authorized distributors?
All XCKU5P-3SFVB784E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-3SFVB784E meets industry standards.
7.What is the process for return or replacement of XCKU5P-3SFVB784E?
All XCKU5P-3SFVB784E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-3SFVB784E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-3SFVB784E part is unused and in its original packaging.
Return procedure for XCKU5P-3SFVB784E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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