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AMD XCKU5P-L1FFVB676I
- Part No.:
- XCKU5P-L1FFVB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU5P-L1FFVB676I.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,372
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Product details
Overview
XCKU5P-L1FFVB676I from AMD is a Kintex UltraScale+ FPGA featuring 481,536 logic cells, 2,496 DSP slices, and 32.1 Mb of block RAM. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates across -40°C to +100°C industrial temperature range. Used in high-throughput data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU5P-L1FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (32 GTY), I/O voltage support (1.2V/1.35V/1.8V), and configuration interface (SPIx4/BPI).
Technical Context
The XCKU5P-L1FFVB676I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 controllers and 100G Ethernet MACs, and multi-rate GTY transceivers supporting 64 Gbps PAM4. It uses 16nm FinFET process technology and integrates dual ARM Cortex-R5 processors for real-time control.
Configuration is performed via master SPI or BPI mode using external flash; bitstream encryption and HMAC authentication are supported. Power management includes dynamic power gating per SLR and dedicated power rails for core, I/O, and transceiver domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 481,536 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 2,496 - enables high-performance arithmetic pipelines for FFT, filtering, and matrix operations |
| Block RAM | 32.1 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 32 × 64 Gbps - supports 100G/200G/400G Ethernet, CPRI, and high-speed serial backplane links |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing with DDR4, sensors, ADCs, and FPGAs |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
| Package | FFVB676 - 27×27 mm flip-chip BGA with 676 pins and 0.8 mm pitch for thermal and signal integrity optimization |
Pinout & Package
The XCKU5P-L1FFVB676I is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVB676) package with 27×27 mm body size, designed for high-density routing and thermal dissipation in compact PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85V to FPGA logic fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power rail | Provides 1.8V to configuration logic, clocking, and SelectIO banks; shared across multiple I/O banks |
| MGTAVCC | Transceiver analog supply | Delivers 0.95V to GTY transceiver analog circuitry; sensitive to ripple and must be isolated from digital supplies |
| CONFIG_IO | Configuration I/O bank | Dedicated bank for SPI/BPI configuration interface; supports 1.8V only and must be powered before configuration begins |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential reference clocks up to 1.2 GHz for PLL/MMCM clock synthesis |
| INIT_B | Configuration status | Open-drain output indicating bitstream load readiness; pulled high externally during valid configuration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces latency and resource usage vs soft IP; supports root complex and endpoint modes with AXI4 streaming interface |
| Hard 100G Ethernet MAC | Offloads MAC/PCS layer processing; integrates RS-FEC and supports IEEE 802.3bj/bs standards |
| ARM Cortex-R5 Dual Core | Enables real-time firmware control alongside programmable logic; runs standalone or coherently with PL via AXI Coherency Extensions |
| Bitstream Encryption | Prevents reverse engineering and unauthorized cloning using AES-256 keys stored in eFUSE |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions without resetting entire device or halting operation |
Applications
| Radar Signal Processing | 5G Baseband Unit (BBU) |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTY transceivers interface with RFICs at JESD204B/C rates. Use Value: 32 GTY lanes enable full-duplex JESD204C connectivity to 16-channel ADC/DACs while maintaining deterministic latency. | Use Scenario: Layer 1 physical layer processing in massive MIMO 5G NR base stations. IC Role / Device Role / Timing Role: Implements FFT/iFFT, channel coding (LDPC/Polar), and precoding in parallel hardware pipelines. Use Value: 2,496 DSP slices deliver >2 TeraMAC/s throughput for real-time 5G numerology scaling across sub-6 GHz and mmWave bands. |
| High-Performance Computing Accelerator | Industrial Vision Inspection System |
Use Scenario: Offloading compute-intensive workloads such as genomic alignment or financial risk modeling. IC Role / Device Role / Timing Role: Acts as PCIe-attached accelerator with coherent host memory access via CXL-compatible AXI interconnect. Use Value: PCIe Gen4 x16 interface provides 32 GB/s bidirectional bandwidth to match GPU-class memory subsystems. | Use Scenario: Sub-millisecond defect detection on high-speed production lines using multi-camera synchronized capture. IC Role / Device Role / Timing Role: Synchronizes eight 12-bit CMOS image sensors via MIPI CSI-2 and performs real-time CNN inference on pixel streams. Use Value: FFVB676 package supports dense I/O fanout for sensor timing signals and 1.2V I/O compatibility with latest global shutter imagers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L1FFVA1156E | Higher logic density (936K LC), larger FFVA1156 package, no integrated R5 cores | Better suited for pure logic-intensive tasks without embedded control; lacks hard R5 for real-time firmware | Select when maximum fabric resources outweigh need for integrated processor subsystem |
| XCVU9P-L2FLGA2104E | Virtex UltraScale+ variant with 2588 DSP slices, 48 GTY transceivers, and identical R5 dual-core | Superior transceiver count and bandwidth for 400G+ optical transport; higher power envelope | Choose for ultra-high-speed serial infrastructure where GTY count and bandwidth exceed XCKU5P requirements |
Compared with XCKU5P-L1FFVB676I, the XCKU15P offers greater logic capacity but sacrifices integrated ARM control, while the XCVU9P delivers more transceivers and DSP resources at higher power and cost-making XCKU5P-L1FFVB676I optimal for balanced compute, I/O, and embedded control in space-constrained industrial systems.
Availability
XCKU5P-L1FFVB676I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and industrial vision inspection systems requiring stable component supply across long product lifecycles.
Supply support for XCKU5P-L1FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions through FPGA, adaptive SoC, and AI engine technologies for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-performance, cost-optimized applications demanding balanced logic, DSP, memory, and I/O resources-especially in aerospace, defense, and 5G infrastructure.
FAQ
What is the maximum data rate supported by the GTY transceivers on the XCKU5P-L1FFVB676I?
The XCKU5P-L1FFVB676I features 32 GTY transceivers each capable of up to 64 Gbps using PAM4 signaling. This enables native support for 100G, 200G, and 400G Ethernet protocols, as well as JESD204C interfaces for high-speed data converters. The transceivers are fully compliant with IEEE 802.3bs and OIF CEI-11G-SR specifications. XCKU5P-L1FFVB676I design implementations must observe AC coupling, proper equalization settings, and board-level impedance control to achieve rated performance.
Does the XCKU5P-L1FFVB676I include embedded processors?
Yes, the XCKU5P-L1FFVB676I integrates two ARM Cortex-R5 processors operating at up to 600 MHz, with tightly coupled L1 cache, ECC-protected TCM, and AXI4 interconnect to the programmable logic. These processors run bare-metal firmware or FreeRTOS and support lockstep operation for functional safety applications. XCKU5P-L1FFVB676I enables hybrid software-hardware architectures where real-time control coexists with hardware-accelerated datapaths.
What configuration modes does the XCKU5P-L1FFVB676I support?
The XCKU5P-L1FFVB676I supports master SPI (x1/x2/x4), slave SPI, BPI (x8/x16), and JTAG configuration modes. Master SPIx4 is the most common for fast parallel bitstream loading from quad-SPI flash. Configuration security features include AES-256 bitstream encryption and HMAC authentication using eFUSE-stored keys. XCKU5P-L1FFVB676I also supports fallback configuration and multi-boot with golden image recovery.
What is the I/O voltage range supported by the XCKU5P-L1FFVB676I?
The XCKU5P-L1FFVB676I supports I/O standards across 1.2V, 1.35V, and 1.8V VCCO rails, enabling direct interfacing with DDR4 memory, MIPI-compliant image sensors, and legacy LVCMOS peripherals. Each SelectIO bank is independently configurable for voltage and standard. XCKU5P-L1FFVB676I requires strict sequencing between VCCINT, VCCAUX, and VCCO supplies to prevent latch-up during power-up.
Is the XCKU5P-L1FFVB676I suitable for automotive applications?
The XCKU5P-L1FFVB676I is rated for industrial temperature (-40°C to +100°C) and meets JESD22-A108 reliability testing, but it is not AEC-Q100 qualified and lacks automotive-specific failure-in-time (FIT) data or ASIL certification. While used in some automotive test equipment and ADAS prototyping platforms, XCKU5P-L1FFVB676I is not recommended for safety-critical vehicle ECUs without additional system-level qualification and redundancy.
XCKU5P-L1FFVB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU5P-L1FFVB676I FAQ
1.How can I place an order for XCKU5P-L1FFVB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-L1FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-L1FFVB676I reliable?
The price and inventory of XCKU5P-L1FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-L1FFVB676I is usually 5 days.
3.What payment methods are accepted for XCKU5P-L1FFVB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-L1FFVB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-L1FFVB676I?
XCKU5P-L1FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-L1FFVB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-L1FFVB676I?
For technical support, including XCKU5P-L1FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-L1FFVB676I requirements.
6.How does Aetrix verify that XCKU5P-L1FFVB676I is sourced from the original manufacturer or authorized distributors?
All XCKU5P-L1FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-L1FFVB676I meets industry standards.
7.What is the process for return or replacement of XCKU5P-L1FFVB676I?
All XCKU5P-L1FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-L1FFVB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-L1FFVB676I part is unused and in its original packaging.
Return procedure for XCKU5P-L1FFVB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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