AMD XCKU5P-L1SFVB784I

Overview

XCKU5P-L1SFVB784I from AMD is a Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, 2,640 DSP slices, and 48 transceivers supporting up to 32.75 Gb/s. It is housed in a 784-pin Flip-Chip Ball Grid Array (FCBGA) package with -1 speed grade and industrial temperature range (-40°C to +100°C), deployed in high-bandwidth data acquisition systems.

For engineers reviewing the XCKU5P-L1SFVB784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic cell density, on-chip memory capacity, thermal performance under sustained 28W typical power, and I/O bank voltage flexibility (1.2V/1.35V/1.8V).

Technical Context

The XCKU5P-L1SFVB784I implements a heterogeneous architecture integrating programmable logic fabric, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers with PMA/PMD layers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path acceleration.

Configuration is performed via quad-SPI or BPI flash, with secure boot using AES-256 encryption and HMAC authentication. The device uses SelectIO technology with support for SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.

Key Specifications

Pinout & Package

Package: 784-pin Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU5P-L1SFVB784I, the XCKU15P offers higher logic and memory resources for complex SoC-like integration, while the XCKU3P delivers identical I/O and transceiver capability at reduced logic density and power-enabling tiered design reuse across product families.

Availability

XCKU5P-L1SFVB784I is available at Aetrix Electronics and suitable for 5G infrastructure, avionics data concentrators, and high-channel-count test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU5P-L1SFVB784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened connectivity, scalable logic, and industrial-grade reliability-especially in wireless infrastructure and intelligent instrumentation.

FAQ

What is the maximum supported data rate per transceiver lane in XCKU5P-L1SFVB784I?

The XCKU5P-L1SFVB784I supports up to 32.75 Gb/s per transceiver lane using its GTH transceiver architecture. This rate is validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and JESD204B subclass 1. The device achieves this performance with integrated clock data recovery (CDR), adaptive equalization, and forward error correction (FEC) enabled.

Does XCKU5P-L1SFVB784I support DDR4 memory interfaces?

Yes, XCKU5P-L1SFVB784I integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s across up to eight 72-bit interfaces. It includes full ECC support, address/command bus inversion, and write leveling calibration. The controller is accessible via native AXI4 interface and requires no external PHY or glue logic.

What configuration modes are supported by XCKU5P-L1SFVB784I?

XCKU5P-L1SFVB784I supports master SPI, slave SPI, BPI, and JTAG configuration modes. Quad-SPI flash is the most common method, enabling fast, secure, and single-image boot. Configuration can be initiated from external processor or internal fallback mode after power-on reset, with support for dual-image fallback and golden image recovery.

Is XCKU5P-L1SFVB784I qualified for industrial temperature operation?

Yes, XCKU5P-L1SFVB784I is rated for industrial temperature range (-40°C to +100°C) and undergoes extended burn-in and HTOL testing per JEDEC JESD22-A108. Its thermal design supports operation at 28W typical power dissipation in sealed enclosures without forced airflow, meeting EN 50155 and IEC 60068-2 environmental compliance requirements.

How many PCIe Gen3 lanes does XCKU5P-L1SFVB784I support?

XCKU5P-L1SFVB784I includes one hardened PCIe Gen3 x16 endpoint/root port block. It supports full x16, x8, x4, or x1 link widths with automatic negotiation, ASPM L0s/L1 power states, and MSI/MSI-X interrupt delivery. The block operates independently of fabric logic and requires no user RTL for basic enumeration and DMA transfers.