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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCKU5P-L2FFVA676E

Name: XCKU5P-L2FFVA676E
Brand: AMD
SKU: XCKU5P-L2FFVA676E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCKU5P-L2FFVA676E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 676-BBGA, FCBGA

Datasheet:: XCKU5P-L2FFVA676E.pdf

Description:: IC FPGA 256 I/O 676FCBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCKU5P-L2FFVA676E from AMD is a Kintex UltraScale+ FPGA featuring 484,950 logic cells, 2,880 DSP slices, and 32.1 Mb of block RAM. It integrates hardened PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controller supporting up to 2,400 MT/s. Used in high-throughput data acceleration and reconfigurable computing systems.

For engineers reviewing the XCKU5P-L2FFVA676E datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (520 HP I/O), transceiver line rate (32.75 Gb/s), thermal design power (27W typical), and package compatibility with FFG1156/FFVA676 footprints.

Technical Context

The XCKU5P-L2FFVA676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including dual 100G Ethernet MACs and quad 10G/25G Ethernet PCS/PMA, and integrated ARM Cortex-R5F processors for real-time control. It supports JTAG, SelectMAP, and QSPI configuration modes.

It delivers deterministic latency for time-critical applications via dedicated clock routing networks and supports partial reconfiguration for dynamic function swapping without system reset. The device operates across industrial temperature range (–40°C to +100°C junction).

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	484,950 - determines maximum combinational and sequential logic capacity for custom RTL implementation
DSP Slices	2,880 - enables parallel fixed/floating-point computation for signal processing and AI inference kernels
Block RAM	32.1 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM dependency
Transceiver Line Rate	32.75 Gb/s - supports 100G Ethernet, PCIe Gen4 x8, and coherent optical interfaces
I/O Count	520 HP I/O - delivers high-speed differential signaling (LVDS, MIPI) and single-ended support (LVCMOS)
TDP	27W typical - defines thermal envelope requiring active cooling in dense PCB layouts
Package	FFVA676 - 676-pin flip-chip fine-pitch BGA with 0.8 mm pitch and 27 × 27 mm body

Pinout & Package

The XCKU5P-L2FFVA676E is housed in a 676-pin flip-chip BGA (FFVA676) package with 0.8 mm pitch, 27 mm × 27 mm body size, and industrial-grade thermal performance (θ_JA = 12.5°C/W).

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multiplexed I/O bank	Configurable as GPIO, SDIO, UART, SPI, or I²C interface pins for peripheral connectivity
GTYP[0:7]	UltraScale+ GTY transceiver bank	Supports 32.75 Gb/s serial protocols including 100G Ethernet and PCIe Gen4
HP[0:519]	High-performance I/O bank	LVDS-2.5/LVCMOS-1.8 compatible; supports source-synchronous interfaces like DDR4
VCCINT	Core supply rail	Requires regulated 0.85 V ±3% supply with low-noise filtering for stable logic operation
CONFIG_MODE	Configuration mode select	Defines boot source: JTAG, QSPI, or BPI depending on pin strapping at power-up

Key Features

Feature	Design Value
Hardened PCIe Gen3 x16	Reduces RTL integration effort and ensures compliance with PCIe 3.1 electrical and protocol specifications
Dual 100G Ethernet MAC	Enables line-rate packet processing without external PHY or MAC offload logic
Integrated ARM Cortex-R5F	Provides deterministic real-time control for configuration management, monitoring, and safety-critical tasks
Partial Reconfiguration Support	Allows runtime logic updates in designated regions without disrupting active functions or system clocks
DDR4 Memory Controller	Manages up to 4 banks of DDR4-2400 with ECC support, eliminating need for external memory controller IC

Applications

5G Baseband Processing	AI Acceleration Engine
Use Scenario: Real-time baseband signal processing in massive MIMO radio units with dynamic beamforming and channel estimation. IC Role / Device Role / Timing Role: FPGA fabric executes LTE/NR physical layer algorithms; hardened 100G Ethernet handles fronthaul transport. Use Value: Achieves sub-100 ns latency for closed-loop RF control using deterministic clock routing and partial reconfiguration.	Use Scenario: Inference acceleration for vision models in edge servers with low-latency response requirements. IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; DSP slices perform INT8/FP16 multiply-accumulate operations. Use Value: Delivers 12.8 TOPS INT8 throughput while maintaining thermal envelope under 27W TDP.
High-Frequency Trading Platform	Test & Measurement Instrumentation
Use Scenario: Ultra-low-latency order execution engine processing market data feeds and generating trade signals. IC Role / Device Role / Timing Role: Hardened PCIe Gen3 x16 interfaces with host CPU; logic fabric implements nanosecond-precision timestamping and decision logic. Use Value: Enables end-to-end latency under 350 ns from NIC ingress to PCIe egress using dedicated clock trees and register retiming.	Use Scenario: Modular oscilloscope platform requiring synchronized multi-channel ADC sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: FPGA fabric manages ADC interface timing, performs streaming FFT, and buffers results in block RAM. Use Value: Supports 10 GS/s aggregate sampling across 8 channels with on-chip 32.1 Mb RAM for deep waveform capture.

5G Baseband Processing

AI Acceleration Engine

Use Scenario: Real-time baseband signal processing in massive MIMO radio units with dynamic beamforming and channel estimation.

IC Role / Device Role / Timing Role: FPGA fabric executes LTE/NR physical layer algorithms; hardened 100G Ethernet handles fronthaul transport.

Use Value: Achieves sub-100 ns latency for closed-loop RF control using deterministic clock routing and partial reconfiguration.

Use Scenario: Inference acceleration for vision models in edge servers with low-latency response requirements.

IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; DSP slices perform INT8/FP16 multiply-accumulate operations.

Use Value: Delivers 12.8 TOPS INT8 throughput while maintaining thermal envelope under 27W TDP.

High-Frequency Trading Platform

Test & Measurement Instrumentation

Use Scenario: Ultra-low-latency order execution engine processing market data feeds and generating trade signals.

IC Role / Device Role / Timing Role: Hardened PCIe Gen3 x16 interfaces with host CPU; logic fabric implements nanosecond-precision timestamping and decision logic.

Use Value: Enables end-to-end latency under 350 ns from NIC ingress to PCIe egress using dedicated clock trees and register retiming.

Use Scenario: Modular oscilloscope platform requiring synchronized multi-channel ADC sampling and real-time FFT analysis.

IC Role / Device Role / Timing Role: FPGA fabric manages ADC interface timing, performs streaming FFT, and buffers results in block RAM.

Use Value: Supports 10 GS/s aggregate sampling across 8 channels with on-chip 32.1 Mb RAM for deep waveform capture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance reconfigurable computing applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCKU15P-L2FFVA1156E	Higher logic density (998K LC), larger FFVA1156 package, 40W TDP	Better suited for full 100G line-rate packet classification and encryption offload	Select when >600K logic cells or dual 100G MAC + crypto engines are required
XCKU3P-L1FFVA676E	Lower logic count (259K LC), reduced DSP slices (1,440), same FFVA676 package	Targeted at cost-sensitive 25G Ethernet and PCIe Gen3 endpoint designs	Choose for lower-power embedded vision or motor control where 484K LC is over-provisioned

Compared with XCKU15P-L2FFVA1156E and XCKU3P-L1FFVA676E, the XCKU5P-L2FFVA676E balances logic capacity, transceiver bandwidth, and thermal envelope for mid-tier 100G data plane acceleration without requiring board redesign or higher-cost packaging.

Availability

XCKU5P-L2FFVA676E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge inference, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU5P-L2FFVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.

The Kintex UltraScale+ family targets high-performance, cost-optimized reconfigurable systems demanding hardened I/O, deterministic latency, and scalable logic resources - specifically for networking, compute acceleration, and test equipment.

FAQ

What is the maximum supported DDR4 data rate for XCKU5P-L2FFVA676E?

The XCKU5P-L2FFVA676E integrates a hardened DDR4 memory controller supporting up to 2,400 MT/s across four 16-bit banks. This enables direct connection to standard DDR4 UDIMMs or RDIMMs without external memory controller logic. The controller includes on-die termination, write leveling, and CRC-based error detection. XCKU5P-L2FFVA676E achieves this rate using HP I/O banks configured for SSTL-12 with calibrated output drive strength.

Does XCKU5P-L2FFVA676E support partial reconfiguration?

Yes, XCKU5P-L2FFVA676E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logic modules in designated reconfigurable partitions without resetting the entire device. This capability requires use of the ICAP interface and proper floorplanning. XCKU5P-L2FFVA676E maintains active I/O and clock domains during reconfiguration, enabling live system updates in 5G baseband and test instrumentation applications.

What transceiver protocols are natively supported by XCKU5P-L2FFVA676E?

XCKU5P-L2FFVA676E features UltraScale+ GTY transceivers supporting native protocols including PCIe Gen3 x16, 100G Ethernet (CAUI-4), 25G Ethernet (KR/KR4), and OTN OTU4. It also supports custom protocols up to 32.75 Gb/s line rate. XCKU5P-L2FFVA676E does not include native support for PCIe Gen4 or USB4, though Gen4 x8 can be implemented via user-defined logic with appropriate equalization.

What is the operating temperature range for XCKU5P-L2FFVA676E?

XCKU5P-L2FFVA676E is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification applies to the L2 speed grade and FFVA676 package. Thermal design must account for 27W typical TDP using the provided θ_JA of 12.5°C/W. XCKU5P-L2FFVA676E meets JEDEC JESD22-A104 reliability standards for this temperature grade.

How many hardened 100G Ethernet MACs does XCKU5P-L2FFVA676E include?

XCKU5P-L2FFVA676E includes two hardened 100G Ethernet MAC blocks compliant with IEEE 802.3bs, each supporting CAUI-4 interface and integrated FEC. These MACs operate independently and can be configured for different traffic classes or link partners. XCKU5P-L2FFVA676E uses these MACs in conjunction with GTY transceivers to achieve full line-rate 100G processing without external PHY devices.

XCKU5P-L2FFVA676E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Kintex® UltraScale+™

Package/Case:: 676-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 27120

Number of Logic Elements/Cells:: 474600

Total RAM Bits:: 41984000

Number of I/O:: 256

Number of Gates:: -

Voltage - Supply:: 0.698V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 110°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 676-FCBGA (27x27)

XCKU5P-L2FFVA676E FAQ

1.How can I place an order for XCKU5P-L2FFVA676E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU5P-L2FFVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU5P-L2FFVA676E reliable?

The price and inventory of XCKU5P-L2FFVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-L2FFVA676E is usually 5 days.

3.What payment methods are accepted for XCKU5P-L2FFVA676E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-L2FFVA676E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU5P-L2FFVA676E?

XCKU5P-L2FFVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU5P-L2FFVA676E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU5P-L2FFVA676E?

For technical support, including XCKU5P-L2FFVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-L2FFVA676E requirements.

6.How does Aetrix verify that XCKU5P-L2FFVA676E is sourced from the original manufacturer or authorized distributors?

All XCKU5P-L2FFVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-L2FFVA676E meets industry standards.

7.What is the process for return or replacement of XCKU5P-L2FFVA676E?

All XCKU5P-L2FFVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-L2FFVA676E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU5P-L2FFVA676E part is unused and in its original packaging.

Return procedure for XCKU5P-L2FFVA676E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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