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AMD XCKU5P-L2FFVB676E

Part No.:
XCKU5P-L2FFVB676E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXCKU5P-L2FFVB676E.pdf
Description:
IC FPGA 280 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,503

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Product details

Overview

XCKU5P-L2FFVB676E from AMD is a Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, and 2,640 DSP slices, operating at -2L speed grade with 0.85V core voltage; used in high-throughput data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU5P-L2FFVB676E datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (324 HP I/Os), transceiver line rate (32.75 Gb/s), thermal design power (29W), and PCIe Gen4 x16 support for compute-accelerated edge platforms.

Technical Context

The XCKU5P-L2FFVB676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including dual 100G Ethernet MACs, PCIe Gen4 x16 root port/endpoint, and 24 GTY transceivers supporting PAM4 and NRZ modulation. It integrates ARM Cortex-R5F processors for real-time control and configuration management.

It supports JTAG, SelectMAP, and Quad-SPI configuration modes, and includes integrated system monitoring with on-die temperature and supply sensors. Configuration security includes AES-256 bitstream encryption and HMAC authentication.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells443,000 - determines maximum combinational and sequential logic capacity for custom datapaths
Block RAM28.8 Mb - enables large on-chip buffering for streaming data pipelines and FIFOs
DSP Slices2,640 - supports parallel multiply-accumulate operations for radar, AI inference, and filter banks
GTY Transceivers24 × 32.75 Gb/s - provides high-speed serial connectivity to ADCs, DACs, and optical modules
I/O Pins (HP)324 - delivers high-performance single-ended and differential signaling across multiple voltage standards
TDP29 W - defines thermal envelope requiring active cooling in dense compute blades or rack-mounted systems
PCIe InterfaceGen4 x16 - enables direct host CPU attachment with up to 31.5 GB/s bidirectional bandwidth

Pinout & Package

Package: Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) with 676 balls, 27 mm × 27 mm footprint, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:15]Multiplexed I/OConfigurable as GPIO, SDIO, SPI, UART, or I2C for peripheral interfacing
HP[0:323]High-Performance I/OSupports LVDS, SSTL, HSTL, and MIPI at up to 1.6 Gb/s per pin
GTY_TX/RX[0:23]Transceiver LaneEach pair handles full-duplex 32.75 Gb/s serial links with built-in clock recovery
VCCINTCore Supply0.85 V ±3% regulated input powering logic fabric and CLBs
VCCAUXAuxiliary Supply1.8 V supply for configuration logic, transceiver analog circuitry, and I/O banks

Key Features

FeatureDesign Value
Hardened PCIe Gen4 x16Reduces RTL integration effort and ensures compliance without external PHY or link-layer logic
Dual 100G Ethernet MACEnables line-rate packet processing for 5G fronthaul and time-sensitive networking without soft-core overhead
AES-256 + HMAC SecurityProtects bitstream integrity and prevents unauthorized reprogramming in field-deployed systems
ARM Cortex-R5F Dual-CoreProvides deterministic real-time control for configuration, monitoring, and safety-critical subsystem management
System Monitor (XADC)Delivers real-time die temperature, supply voltage, and current telemetry via dedicated analog front-end

Applications

5G Massive MIMO Baseband ProcessingRadar Signal Processing Unit

Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz and mmWave bands.

IC Role / Device Role / Timing Role: Primary compute accelerator executing FFT, matrix inversion, and precoding algorithms with deterministic latency.

Use Value: 2,640 DSP slices and 32.75 Gb/s GTY lanes enable simultaneous multi-band processing and high-speed fronthaul interface to RU units.

Use Scenario: Pulse-Doppler processing, CFAR detection, and SAR image formation in airborne and ground-based radar platforms.

IC Role / Device Role / Timing Role: High-precision timing engine synchronizing ADC sampling, waveform generation, and FFT execution across multiple channels.

Use Value: 28.8 Mb block RAM buffers full chirp sequences; hardened 100G Ethernet supports sensor fusion data aggregation over deterministic networks.

AI Inference Accelerator CardIndustrial Vision Inspection System

Use Scenario: Low-latency inferencing of CNN models on edge servers for video analytics and anomaly detection.

IC Role / Device Role / Timing Role: Programmable inference engine replacing fixed-function ASICs, configured via PCIe Gen4 host interface.

Use Value: 443K logic cells implement custom quantized convolution pipelines; 31.5 GB/s PCIe bandwidth sustains real-time 4K video frame ingestion.

Use Scenario: Sub-millisecond defect classification on PCB assemblies using high-resolution line-scan cameras and multi-lighting profiles.

IC Role / Device Role / Timing Role: Real-time image preprocessor and classifier co-located with camera interface and I/O control logic.

Use Value: HP I/Os drive industrial camera triggers and lighting strobes with <5 ns jitter; on-chip R5F manages calibration and pass/fail reporting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU15P-L2FFVA1156EHigher logic density (742K cells), larger package (1156-ball), higher TDP (42W)Better suited for multi-100G packet processing and full-stack AI training accelerationSelect when >500K logic cells or >36 GTY transceivers are required; requires larger PCB area and enhanced thermal solution
XCKU3P-L2FFVA676EFewer logic cells (242K), same 676-ball package, lower TDP (19W)Targeted at cost-optimized radar front-ends and mid-tier vision systemsChoose for reduced BOM cost and simpler thermal design where 443K cells and 24 GTY lanes exceed requirements

Compared with XCKU15P-L2FFVA1156E and XCKU3P-L2FFVA676E, the XCKU5P-L2FFVB676E delivers optimal balance of logic capacity, transceiver count, and thermal envelope for compact, high-throughput edge accelerators requiring PCIe Gen4 and hardened 100G Ethernet.

Availability

XCKU5P-L2FFVB676E is available at Aetrix Electronics and suitable for 5G infrastructure, radar systems, and AI edge inference applications requiring stable component supply and long-term production support.

Supply support for XCKU5P-L2FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Kintex UltraScale+ family targets high-performance, power-efficient compute acceleration in space-constrained edge and network equipment, emphasizing hardened interfaces and system-level integration.

FAQ

What is the core voltage requirement for the XCKU5P-L2FFVB676E?

The XCKU5P-L2FFVB676E requires a tightly regulated 0.85 V ±3% core supply (VCCINT) delivered to its dedicated power rails. This voltage powers the programmable logic fabric, CLBs, and interconnect resources. Deviation beyond tolerance risks timing violations or functional failure. The XCKU5P-L2FFVB676E datasheet specifies strict transient response and ripple limits to ensure reliable operation under dynamic logic switching loads.

Does the XCKU5P-L2FFVB676E support PCIe Gen4 x16 in endpoint mode?

Yes, the XCKU5P-L2FFVB676E includes a hardened PCIe Gen4 x16 endpoint block compliant with PCI Express Base Specification Revision 4.0. It supports all standard transaction types, MSI/MSI-X interrupt delivery, and ASPM L0s/L1 power states. The XCKU5P-L2FFVB676E can operate as either root port or endpoint without external PHY, enabling direct attachment to host CPUs or downstream devices in accelerator cards.

How many GTY transceivers does the XCKU5P-L2FFVB676E have, and what is their maximum line rate?

The XCKU5P-L2FFVB676E integrates 24 GTY transceivers, each capable of NRZ operation up to 32.75 Gb/s and PAM4 operation up to 58 Gb/s. These transceivers support protocols including 100G Ethernet, CPRI/eCPRI, and proprietary high-speed serial links. The XCKU5P-L2FFVB676E's GTY lanes are distributed across eight quads, with independent reference clock inputs per quad for flexible board-level routing.

Is the XCKU5P-L2FFVB676E pin-compatible with other Kintex UltraScale+ devices in the same package?

No, the XCKU5P-L2FFVB676E is not pin-compatible with other Kintex UltraScale+ devices in the FFVB676 package. While physical ball count and footprint match, I/O bank assignments, transceiver locations, and power rail allocations differ across speed grades and density variants. Migration between XCKU3P-L2FFVB676E and XCKU5P-L2FFVB676E requires PCB redesign due to incompatible pin functions and voltage domain mapping.

What configuration modes does the XCKU5P-L2FFVB676E support?

The XCKU5P-L2FFVB676E supports JTAG, Master SelectMAP, Slave SelectMAP, and Quad-SPI configuration modes. JTAG is used for boundary scan and debug; SelectMAP enables high-speed parallel loading via microcontroller or processor; Quad-SPI allows boot from serial flash with fast read speeds. The XCKU5P-L2FFVB676E also supports secure fallback configuration and dual-bitstream redundancy for mission-critical deployments.

XCKU5P-L2FFVB676E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale+™
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Total RAM Bits:
41984000
Number of I/O:
280
Number of Gates:
-
Voltage - Supply:
0.698V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XCKU5P-L2FFVB676E FAQ

1.How can I place an order for XCKU5P-L2FFVB676E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU5P-L2FFVB676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU5P-L2FFVB676E reliable?

The price and inventory of XCKU5P-L2FFVB676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-L2FFVB676E is usually 5 days.

3.What payment methods are accepted for XCKU5P-L2FFVB676E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-L2FFVB676E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU5P-L2FFVB676E?

XCKU5P-L2FFVB676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU5P-L2FFVB676E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU5P-L2FFVB676E?

For technical support, including XCKU5P-L2FFVB676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-L2FFVB676E requirements.

6.How does Aetrix verify that XCKU5P-L2FFVB676E is sourced from the original manufacturer or authorized distributors?

All XCKU5P-L2FFVB676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-L2FFVB676E meets industry standards.

7.What is the process for return or replacement of XCKU5P-L2FFVB676E?

All XCKU5P-L2FFVB676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-L2FFVB676E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU5P-L2FFVB676E part is unused and in its original packaging.

Return procedure for XCKU5P-L2FFVB676E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU5P-L2FFVB676E Tags

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