AMD XCKU5P-L2FFVD900E

Overview

XCKU5P-L2FFVD900E from AMD is a Kintex UltraScale+ FPGA featuring 471K logic cells, 28.8 Mb of block RAM, and 2,640 DSP slices, packaged in a 900-pin FCBGA with 0.8 mm pitch. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates across industrial temperature range (–40°C to +100°C) for high-throughput data acceleration in edge compute systems.

For engineers reviewing the XCKU5P-L2FFVD900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (32 GTY), I/O voltage support (1.2V/1.35V/1.8V), and configuration interface (x4/x8 BPI, SPI x4).

Technical Context

The XCKU5P-L2FFVD900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 Root Port/Endpoint, 100G Ethernet MAC, and integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and AXI4-Stream interconnects for dynamic system adaptation.

GTY transceivers deliver 32.75 Gb/s line rates with built-in PRBS generators/checkers and adaptive equalization. The device uses 16nm FinFET process technology and supports JTAG, SelectMAP, and QSPI configuration modes.

Key Specifications

Pinout & Package

Package: 900-pin Flip-Chip Ball Grid Array (FCBGA), 31×31 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU5P-L2FFVD900E, the XCKU15P offers greater scalability for multi-lane 100G systems but increases thermal and layout complexity, while the XCKU3P reduces cost and size at the expense of transceiver count and memory bandwidth headroom.

Availability

XCKU5P-L2FFVD900E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge accelerators, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCKU5P-L2FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Kintex UltraScale+ family targets high-performance, cost-optimized applications demanding advanced I/O, hardened IP, and power efficiency in communications, test & measurement, and aerospace systems.

FAQ

What is the maximum supported DDR4 data rate for XCKU5P-L2FFVD900E?

XCKU5P-L2FFVD900E supports DDR4-2400 (1200 MHz) with 16-bit or 32-bit interfaces using its hardened memory controller IP. This delivers up to 12.8 GB/s peak bandwidth with on-die termination, write leveling, and read/write leveling calibration. The XCKU5P-L2FFVD900E memory controller also supports ECC and address/command bus training for robust operation in mission-critical systems.

Does XCKU5P-L2FFVD900E include hardened PCIe Gen4 logic?

Yes, XCKU5P-L2FFVD900E integrates hardened PCIe Gen4 Root Port and Endpoint blocks supporting x1, x2, x4, x8, and x16 configurations. These blocks handle physical layer, data link layer, and transaction layer functions with no soft-core resource consumption. The XCKU5P-L2FFVD900E PCIe interface complies with PCI-SIG specifications and supports ASPM L0s/L1 power states and SR-IOV virtualization.

What configuration modes does XCKU5P-L2FFVD900E support?

XCKU5P-L2FFVD900E supports multiple configuration modes including Quad-SPI (x4), BPI x4/x8, JTAG, and SelectMAP. Configuration can be initiated via dedicated configuration pins or through the processor system (PS) using the ICAP interface. The XCKU5P-L2FFVD900E also supports secure boot with AES-GCM decryption and HMAC authentication for protected bitstream loading.

Is partial reconfiguration supported on XCKU5P-L2FFVD900E?

Yes, XCKU5P-L2FFVD900E fully supports dynamic partial reconfiguration (PR) using Vivado Design Suite tools. This allows runtime swapping of logical partitions without resetting the entire device or disrupting active I/O and memory interfaces. The XCKU5P-L2FFVD900E PR capability is validated for use cases such as multi-standard radio protocols and adaptive compute workloads.

What is the operating temperature range for XCKU5P-L2FFVD900E?

XCKU5P-L2FFVD900E is rated for industrial temperature range: –40°C to +100°C case temperature. This rating applies to the L2 speed grade and FFVD900E package variant. Thermal design must account for power dissipation up to 25W typical under full GTY and DSP utilization. The XCKU5P-L2FFVD900E thermal lid facilitates efficient heat transfer to external heatsinks in conduction-cooled enclosures.