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AMD XCKU5P-L2SFVB784E

Part No.:
XCKU5P-L2SFVB784E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
784-BFBGA, FCBGA
Datasheet:
AetrixXCKU5P-L2SFVB784E.pdf
Description:
IC FPGA 304 I/O 784FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,529

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Product details

Overview

XCKU5P-L2SFVB784E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.

For engineers reviewing the XCKU5P-L2SFVB784E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal envelope (100°C junction), and configuration security options including AES-256 bitstream encryption.

Technical Context

The XCKU5P-L2SFVB784E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting protocols from 600 Mb/s to 25.8 Gb/s. It integrates dual ARM Cortex-A53 processors for real-time control and system management.

Configuration is supported via quad-SPI, BPI, or JTAG, with fallback capability and secure boot using HMAC-SHA-256 authentication. The device operates across -40°C to +100°C junction temperature range with configurable I/O standards per bank (LVCMOS, SSTL, HSTL, MIPI).

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells443,200 - determines maximum combinational/sequential logic capacity for custom datapaths
Block RAM28.8 Mb - supports large on-die buffering for video frame stores or packet queues
Transceiver Max Rate25.8 Gb/s - enables direct interface to 100G QSFP28 optical modules without gearbox
PCIe InterfaceGen4 x16 - provides 32 GB/s bidirectional bandwidth for host CPU offload acceleration
DDR4 Support2400 MT/s - allows connection to standard industrial DDR4 memory subsystems
Junction Temp Range-40°C to +100°C - validated for deployment in outdoor base stations and avionics enclosures

Pinout & Package

Package: 784-pin Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:15]Multiplexed I/OConfigurable as GPIO, SDIO, UART, SPI, or I²C for peripheral control and debug
GTYP[0:31]Transceiver LaneDual-purpose pins supporting 25.8 Gb/s serial I/O with built-in CDR and PRBS generator
PL_CLK[0:3]Programmable Logic ClockDedicated differential inputs for high-fanout clock distribution to logic fabric
VCCINTCore Supply0.85 V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling
CONFIG_IOConfiguration I/OQuad-SPI master interface for boot flash access; supports dual-boot and failover

Key Features

FeatureDesign Value
UltraScale+ ArchitectureEnables time-multiplexed logic and routing for higher effective LUT density vs. prior generations
AES-256 Bitstream EncryptionPrevents reverse engineering and unauthorized cloning of configured logic functionality
HMAC-SHA-256 Secure BootEnsures only authenticated bitstreams execute after power-on reset
Hardened PCIe Gen4 ControllerReduces RTL integration effort and timing closure risk for high-speed host interfaces
ARM Cortex-A53 Dual-Core SubsystemProvides embedded Linux-capable processing for real-time system management and firmware services

Applications

5G Massive MIMO BasebandRadar Digital Beamforming

Use Scenario: Real-time uplink/downlink precoding and channel estimation on massive antenna arrays.

IC Role / Device Role / Timing Role: Programmable baseband processor handling FFT, filtering, and MIMO matrix operations at sub-μs latency.

Use Value: 443K logic cells and 25.8 Gb/s transceivers enable full-bandwidth 5G NR carrier aggregation without external DSP offload.

Use Scenario: Adaptive beam steering and clutter suppression in ground-based phased array radar systems.

IC Role / Device Role / Timing Role: High-throughput digital signal processor synchronizing hundreds of RF channels with deterministic timing.

Use Value: Integrated DDR4-2400 interface and 28.8 Mb block RAM support real-time STAP and CFAR algorithms on-chip.

High-Speed Test EquipmentAvionics Data Concentrator

Use Scenario: Protocol-aware pattern generation and analysis for PCIe Gen4 and USB4 compliance testing.

IC Role / Device Role / Timing Role: Reconfigurable protocol engine implementing link training, LTSSM, and error injection with cycle-accurate timing.

Use Value: Hardened PCIe Gen4 x16 controller and deterministic transceiver calibration reduce test setup complexity and validation time.

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation across multiple avionics line-replaceable units.

IC Role / Device Role / Timing Role: Deterministic network switch and gateway with time-triggered scheduling and end-to-end latency guarantees.

Use Value: -40°C to +100°C junction rating and ECC-protected block RAM ensure reliability in unpressurized aircraft bays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU15P-L2FFVD900EHigher logic count (740K cells), larger package (900-pin FCBGA), 32.75 Gb/s transceiversBetter suited for multi-100G optical transport and AI inference accelerationSelect when >500K logic cells or >25.8 Gb/s serial I/O are required
XCKU3P-L2FFVA676EFewer logic cells (299K), smaller 676-pin FCBGA, same 25.8 Gb/s transceiversOptimized for cost-sensitive radar front-ends and compact test instrumentationSelect when footprint, power, or BOM cost constraints outweigh raw capacity needs

Compared with XCKU5P-L2SFVB784E, the XCKU15P offers greater scalability for future bandwidth growth but increases PCB area and thermal design complexity; the XCKU3P reduces system size and power at the expense of logic headroom for complex signal chains.

Availability

XCKU5P-L2SFVB784E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test equipment requiring stable component supply over extended production lifecycles.

Supply support for XCKU5P-L2SFVB784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and client devices.

The Kintex UltraScale+ family delivers optimized performance-per-watt for high-throughput, low-latency signal and packet processing in communications and defense applications.

FAQ

What is the maximum supported DDR4 data rate for XCKU5P-L2SFVB784E?

The XCKU5P-L2SFVB784E supports DDR4 memory interfaces up to 2400 MT/s across its dedicated memory controller banks. This rate is validated with JEDEC-compliant DDR4 SDRAM components and includes built-in write leveling, read leveling, and gate training for reliable operation in industrial temperature ranges.

Does XCKU5P-L2SFVB784E include a hard processor system?

Yes, the XCKU5P-L2SFVB784E integrates a dual-core ARM Cortex-A53 processor subsystem with NEON and floating-point units, 32 KB L1 instruction and data caches per core, and 1 MB shared L2 cache. This subsystem runs bare-metal firmware or Linux and manages configuration, monitoring, and real-time control tasks independently of the programmable logic fabric.

What transceiver protocols are natively supported by XCKU5P-L2SFVB784E?

The XCKU5P-L2SFVB784E transceivers natively support PCIe Gen4, 100G Ethernet (CAUI-4), CPRI/eCPRI, and JESD204B/C at rates up to 25.8 Gb/s. Protocol support is implemented in hardened logic blocks, eliminating the need for soft IP and reducing timing closure risk in high-speed serial designs.

Is XCKU5P-L2SFVB784E qualified for automotive applications?

No, the XCKU5P-L2SFVB784E is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for industrial and extended temperature operation (-40°C to +100°C junction), making it suitable for base station, avionics, and test equipment environments where automotive-grade qualification is not required.

What configuration security features does XCKU5P-L2SFVB784E provide?

XCKU5P-L2SFVB784E provides AES-256 bitstream encryption for confidentiality and HMAC-SHA-256 authentication for secure boot. These features prevent unauthorized configuration loading and ensure only cryptographically signed bitstreams execute, protecting intellectual property and system integrity throughout the device's operational life.

XCKU5P-L2SFVB784E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale+™
Package/Case:
784-BFBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Total RAM Bits:
41984000
Number of I/O:
304
Number of Gates:
-
Voltage - Supply:
0.698V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
784-FCBGA (23x23)

XCKU5P-L2SFVB784E FAQ

1.How can I place an order for XCKU5P-L2SFVB784E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU5P-L2SFVB784E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU5P-L2SFVB784E reliable?

The price and inventory of XCKU5P-L2SFVB784E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-L2SFVB784E is usually 5 days.

3.What payment methods are accepted for XCKU5P-L2SFVB784E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-L2SFVB784E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU5P-L2SFVB784E?

XCKU5P-L2SFVB784E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU5P-L2SFVB784E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU5P-L2SFVB784E?

For technical support, including XCKU5P-L2SFVB784E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-L2SFVB784E requirements.

6.How does Aetrix verify that XCKU5P-L2SFVB784E is sourced from the original manufacturer or authorized distributors?

All XCKU5P-L2SFVB784E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-L2SFVB784E meets industry standards.

7.What is the process for return or replacement of XCKU5P-L2SFVB784E?

All XCKU5P-L2SFVB784E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-L2SFVB784E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU5P-L2SFVB784E part is unused and in its original packaging.

Return procedure for XCKU5P-L2SFVB784E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU5P-L2SFVB784E Tags

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