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AMD XCKU9P-1FFVE900I
- Part No.:
- XCKU9P-1FFVE900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU9P-1FFVE900I.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,174
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Product details
Overview
XCKU9P-1FFVE900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 927K logic cells, 48.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU9P-1FFVE900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal performance in air-cooled 900-pin FC-BGA packages, and configuration security options.
Technical Context
The XCKU9P-1FFVE900I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting protocols from 600 Mb/s to 25.8 Gb/s. It includes dual 32-bit AXI4 interconnects and integrated clock management with MMCM and PLL.
Configuration occurs via quad-SPI, BPI, or JTAG; bitstream encryption uses AES-256 with HMAC authentication. The device supports partial reconfiguration and system monitor functionality for on-chip temperature and supply voltage measurement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 927,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| Block RAM | 48.5 Mb - supports large on-die buffering for video frame stores or packet queues |
| Transceiver Max Rate | 25.8 Gb/s - enables direct interface to 100G QSFP28 optical modules without gearbox |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, TMDS - allows native connection to DDR4, display interfaces, and sensor links |
| Configuration Security | AES-256 + HMAC - prevents unauthorized bitstream cloning and runtime tampering |
| Thermal Design Power | 35 W typical - defines heatsink sizing and airflow requirements for sustained operation |
Pinout & Package
The XCKU9P-1FFVE900I is housed in a 900-pin Flip-Chip Ball Grid Array (FC-BGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via solder balls and thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals |
| GTYP[0:31] | Transceiver Lane | Supports 25.8 Gb/s serial protocols including PCIe Gen4 and CPRI |
| HP[0:63] | High-Performance I/O Bank | Operates at 1.8 V/1.5 V/1.35 V; interfaces directly to DDR4-2400 memory |
| VRP/VRN | Reference Voltage | Provides precision termination reference for differential I/O standards |
| CONFIG_MODE | Configuration Mode Select | Determines boot source: SPI, BPI, or JTAG during power-up |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort and timing closure risk for host-facing acceleration |
| UltraScale+ Architecture with SSI | Enables monolithic die scaling beyond single-die limits using silicon interposer |
| Partial Reconfiguration Support | Allows dynamic function swapping without full device reset-critical for mission-critical systems |
| System Monitor with ADC | Provides real-time on-chip temperature and supply monitoring without external sensors |
| Multi-Boot with Golden Image | Ensures field-upgradable firmware with fallback to known-good configuration |
Applications
| 5G Massive MIMO Baseband | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz 5G base stations. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT, CORDIC, and filter pipelines; transceivers handle CPRI/eCPRI fronthaul. Use Value: 25.8 Gb/s transceivers eliminate need for external retimers; 48.5 Mb BRAM buffers full OFDM symbol windows. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR/ISAR radar systems. IC Role / Device Role / Timing Role: Configurable logic implements adaptive filtering and digital down-conversion; hardened PCIe Gen4 exports processed data to host GPU. Use Value: AES-256 bitstream encryption meets DO-254 security requirements; TDP of 35 W fits conduction-cooled avionics enclosures. |
| High-Frequency Trading Engine | Medical Imaging Data Pipeline |
Use Scenario: Sub-microsecond latency order matching and market data parsing in FPGA-accelerated trading platforms. IC Role / Device Role / Timing Role: Logic fabric runs deterministic state machines; GTY transceivers link to ultra-low-latency network NICs. Use Value: 927K logic cells enable parallelized feed parsing engines; partial reconfiguration allows algorithm updates mid-session. | Use Scenario: Real-time CT/MRI image reconstruction using iterative algorithms and back-projection kernels. IC Role / Device Role / Timing Role: FPGA accelerates compute-intensive kernels; DDR4-2400 interfaces feed high-throughput memory bandwidth to processing units. Use Value: Dual 32-bit AXI4 interconnects sustain >100 GB/s internal memory bandwidth; system monitor ensures thermal compliance during long scans. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVE1517E | 1.3M logic cells, 76.5 Mb BRAM, 32 GTY lanes, 1517-pin package | Higher density and I/O count; requires larger PCB area and enhanced thermal design | Select when >1M logic cells or >24 GTY lanes are required; not pin-compatible |
| XCKU085-2FFVA1156I | 820K logic cells, 42.5 Mb BRAM, 24 GTY lanes, 1156-pin package | Lower transceiver count and memory capacity; suitable for cost-optimized radar front-ends | Choose for reduced BOM cost where 25.8 Gb/s transceiver count ≤24 suffices |
Compared with XCKU9P-1FFVE900I, the XCKU15P offers higher scalability at the expense of board space and thermal budget, while the XCKU085 trades density and transceiver count for lower system-level cost and simpler layout-neither is pin-compatible.
Availability
XCKU9P-1FFVE900I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and medical imaging systems requiring stable component supply across extended production lifecycles.
Supply support for XCKU9P-1FFVE900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale+ family delivers optimized performance-per-watt for high-throughput, low-latency signal and packet processing in communications and defense systems.
FAQ
What is the maximum supported DDR4 memory speed for XCKU9P-1FFVE900I?
The XCKU9P-1FFVE900I supports DDR4-2400 memory interfaces through its HP I/O banks, enabling 1.2 GHz data rates with programmable I/O delay and calibration. This capability is verified in UG571 and implemented in Vivado 2023.1 IP integrator. XCKU9P-1FFVE900I achieves stable operation with JEDEC-compliant DDR4 components under industrial temperature conditions.
Does XCKU9P-1FFVE900I support partial reconfiguration?
Yes, XCKU9P-1FFVE900I fully supports partial reconfiguration as defined in UG909, allowing dynamic module swapping without resetting the entire device. This feature is used in radar systems for adaptive waveform updates and in 5G base stations for protocol stack upgrades. XCKU9P-1FFVE900I requires Vivado implementation tools and specific constraints to ensure timing integrity across reconfigurable partitions.
What configuration modes are supported by XCKU9P-1FFVE900I?
XCKU9P-1FFVE900I supports three primary configuration modes: Quad-SPI flash, BPI parallel NOR flash, and JTAG boundary-scan. Mode selection is controlled by CONFIG_MODE pins at power-up. XCKU9P-1FFVE900I also supports Multi-Boot with golden image fallback, enabling field updates while maintaining system reliability.
Is XCKU9P-1FFVE900I qualified for automotive applications?
No, XCKU9P-1FFVE900I is rated for industrial temperature range (–40°C to +100°C case temperature) and is not AEC-Q100 qualified. It is intended for 5G infrastructure, radar, and medical equipment-not automotive ECUs. XCKU9P-1FFVE900I lacks automotive-specific failure-in-time (FIT) reporting and qualification test documentation required for vehicle deployment.
What transceiver protocols does XCKU9P-1FFVE900I natively support?
XCKU9P-1FFVE900I natively supports PCIe Gen4 x16, 100G Ethernet (CAUI-4), CPRI, and eCPRI via its GTY transceivers operating up to 25.8 Gb/s. Protocol support is implemented using Xilinx LogiCORE IP validated in UG578. XCKU9P-1FFVE900I does not support USB3.2 or SATA Gen3 without external PHY bridging.
XCKU9P-1FFVE900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 34260
- Number of Logic Elements/Cells:
- 599550
- Total RAM Bits:
- 41881600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU9P-1FFVE900I FAQ
1.How can I place an order for XCKU9P-1FFVE900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU9P-1FFVE900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU9P-1FFVE900I reliable?
The price and inventory of XCKU9P-1FFVE900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU9P-1FFVE900I is usually 5 days.
3.What payment methods are accepted for XCKU9P-1FFVE900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU9P-1FFVE900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU9P-1FFVE900I?
XCKU9P-1FFVE900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU9P-1FFVE900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU9P-1FFVE900I?
For technical support, including XCKU9P-1FFVE900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU9P-1FFVE900I requirements.
6.How does Aetrix verify that XCKU9P-1FFVE900I is sourced from the original manufacturer or authorized distributors?
All XCKU9P-1FFVE900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU9P-1FFVE900I meets industry standards.
7.What is the process for return or replacement of XCKU9P-1FFVE900I?
All XCKU9P-1FFVE900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU9P-1FFVE900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU9P-1FFVE900I part is unused and in its original packaging.
Return procedure for XCKU9P-1FFVE900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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