AMD XCKU9P-2FFVE900I

Overview

XCKU9P-2FFVE900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 924K logic cells, 5,480 DSP slices, and 64.2 Mb of block RAM. It integrates dual ARM Cortex-A53 processors, PCIe Gen3 x16 interface, and supports DDR4 memory up to 2400 MT/s. It is deployed in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU9P-2FFVE900I datasheet, pinout, applications, or equivalent options, key selection considerations include programmable logic density, integrated processor subsystem capability, transceiver line rates up to 32.75 Gb/s, and thermal performance in air-cooled 900-pin flip-chip BGA packaging.

Technical Context

The XCKU9P-2FFVE900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MACs), and dual-core ARM Cortex-A53 application processing unit running at up to 1.5 GHz. It supports partial reconfiguration and AXI4 interconnect for system-level integration.

It delivers 32.75 Gb/s PAM4-capable GTY transceivers across 40 lanes, configurable I/O banks supporting LVDS, SSTL, HSTL, and MIPI standards, and operates over industrial temperature range (–40°C to +100°C junction).

Key Specifications

Pinout & Package

Package: 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVE900), 31 mm × 31 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-2FFVD900I and XCKU5P-2FFVB676I, the XCKU9P-2FFVE900I delivers optimal balance of logic density, DSP throughput, and high-speed I/O for industrial-grade acceleration-without over-provisioning resources or exceeding thermal limits in convection-cooled enclosures.

Availability

XCKU9P-2FFVE900I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and AI edge inference requiring stable component supply across long-life industrial programs.

Supply support for XCKU9P-2FFVE900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications.

The Kintex UltraScale+ family targets high-performance, cost-optimized FPGA applications demanding hardened processors, high-speed transceivers, and scalable logic resources for real-time embedded acceleration.

FAQ

What is the maximum supported DDR4 data rate for XCKU9P-2FFVE900I?

The XCKU9P-2FFVE900I supports DDR4 memory interfaces up to 2400 MT/s using its hardened memory controller. This rate is validated with JEDEC-compliant DIMMs and requires strict PCB layout adherence to AMD UG586 timing and routing guidelines. The XCKU9P-2FFVE900I's memory controller includes write leveling, read leveling, and training sequences to ensure reliable operation at this speed.

Does XCKU9P-2FFVE900I support partial reconfiguration?

Yes, the XCKU9P-2FFVE900I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module updates without resetting the entire device. This capability is implemented in the UltraScale+ architecture and verified in UG909. The XCKU9P-2FFVE900I allows runtime swapping of PL regions while PS remains operational-essential for fault-tolerant and adaptive systems.

What transceiver protocol standards does XCKU9P-2FFVE900I natively support?

The XCKU9P-2FFVE900I GTY transceivers natively support PCIe Gen3, 10/25/100G Ethernet (KR/KR4), CPRI, JESD204B/C, and OTN. These protocols are implemented via hardened logic in the transceiver PHY and PMA layers. The XCKU9P-2FFVE900I does not require soft IP for basic compliance-reducing latency and resource overhead compared to soft transceiver implementations.

Is XCKU9P-2FFVE900I qualified for industrial temperature operation?

Yes, the XCKU9P-2FFVE900I is rated for industrial temperature range: –40°C to +100°C junction temperature. This qualification is documented in AMD's official Kintex UltraScale+ FPGA Data Sheet (DS892). The XCKU9P-2FFVE900I's thermal lid and FFVE900 package enable reliable convection-cooled operation in harsh environments without forced airflow.

How many ARM Cortex-A53 cores are integrated into XCKU9P-2FFVE900I?

The XCKU9P-2FFVE900I integrates two ARM Cortex-A53 application processor cores, each capable of running at up to 1.5 GHz. These cores are part of the Processing System (PS) and run independently of the Programmable Logic (PL). The XCKU9P-2FFVE900I supports symmetric multiprocessing (SMP) Linux configurations and bare-metal execution on both cores.