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AMD XCKU9P-L1FFVE900I
- Part No.:
- XCKU9P-L1FFVE900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU9P-L1FFVE900I.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,447
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Product details
Overview
XCKU9P-L1FFVE900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 924K logic cells, 57.6 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU9P-L1FFVE900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage compatibility (1.8 V / 1.5 V / 1.35 V), thermal performance under sustained 25 W TDP, and configuration interface options (JTAG, Quad-SPI, BPI).
Technical Context
The XCKU9P-L1FFVE900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root complex and DMA engines, and UltraScale+ memory controllers supporting DDR4 and LPDDR4. It uses 16 nm FinFET process technology and supports partial reconfiguration.
Configuration is performed via dual-boot Quad-SPI Flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device includes integrated system monitoring with on-die temperature sensors and supply voltage monitors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 924,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| Block RAM | 57.6 Mb - enables large on-chip buffering for video frame stores or packet queues |
| Transceiver Line Rate | 25.8 Gb/s - supports 100G Ethernet KR4, CPRI, and JESD204B/C interfaces |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing to ADCs, DACs, and memory |
| TDP | 25 W - defines thermal solution requirements for continuous operation in air-cooled enclosures |
| Configuration Interface | Quad-SPI, BPI, JTAG - allows flexible boot source selection and field updates |
Pinout & Package
Package: FFVE900 - 900-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 31 mm × 31 mm, 0.8 mm pitch, RoHS-compliant, thermal lid included.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O Bank 0 | Configurable as SDIO, UART, SPI, I2C, or GPIO; voltage selectable per bank (1.8 V / 3.3 V) |
| HR_IO_L[0:71] | High-Range I/O Bank | Supports 1.8 V / 1.5 V / 1.35 V standards; used for DDR4 address/control and high-speed SerDes reference clocks |
| GTH_X0Y0_CH0 | Transceiver Channel 0 | Dedicated 25.8 Gb/s transceiver with integrated CDR and gearbox; requires external 100 Ω differential termination |
| VCCINT | Core Supply | 0.85 V ±3% regulated input; supplies programmable logic and CLB resources |
| CONFIG_MODE | Configuration Mode Select | Pull-up/pull-down resistor setting determines boot source (SPI vs. BPI vs. JTAG) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Root Complex | Hardened IP enabling direct host CPU attachment without external switch or bridge logic |
| UltraScale+ Memory Controller | Native DDR4-2400 and LPDDR4-4266 support with ECC and AXI4 interface |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration and intellectual property theft during field deployment |
| Partial Reconfiguration | Enables dynamic function swapping without full device reset-critical for multi-mode radar or software-defined radio |
| System Monitor (XADC) | Integrated 12-bit ADC with on-die temperature and supply voltage sensing for real-time thermal management |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Conditioning Unit |
|---|---|
Use Scenario: Real-time beamforming matrix computation and digital up/down conversion for 64T64R antenna arrays. IC Role / Device Role / Timing Role: Primary compute accelerator handling FFT, FIR filtering, and channel estimation at 2.4 GSPS sample rate. Use Value: 924K logic cells and 25.8 Gb/s transceivers enable full baseband stack integration without external ASIC offload. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR systems operating at Ku-band. IC Role / Device Role / Timing Role: Time-critical signal path processor synchronizing ADC sampling, pulse compression, and Doppler FFT with sub-ns jitter. Use Value: Integrated PCIe Gen4 and DDR4-2400 allow streaming raw RF samples to host GPU while maintaining deterministic latency. |
| High-Speed Test Equipment Front-End | Medical Ultrasound Beamformer |
Use Scenario: Digital pattern generation and response analysis for semiconductor ATE at 1 GHz vector rate. IC Role / Device Role / Timing Role: High-fidelity stimulus generator with precise timing control over 512 parallel DUT channels. Use Value: HR I/O banks support 1.35 V LVCMOS with <15 ps skew across all pins-meeting IEEE 1149.1 boundary-scan timing margins. | Use Scenario: Real-time synthetic aperture focusing and harmonic imaging in portable ultrasound systems. IC Role / Device Role / Timing Role: Multi-channel echo processor implementing 128-channel beam summation with 10 ns inter-channel delay resolution. Use Value: Partial reconfiguration allows runtime switching between B-mode, Doppler, and elastography algorithms without system reboot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L1FFVE1156I | 1.3M logic cells, 76.2 Mb BRAM, same 25.8 Gb/s transceivers, larger 1156-pin FCBGA package | Higher gate count supports more concurrent DSP slices and larger FFT engines | Select when >1M logic cells or >64 transceiver lanes required; board redesign needed due to package change |
| XCKU5P-L1FFVD900I | 462K logic cells, 28.8 Mb BRAM, identical 900-pin FFVD900 package but lower transceiver count (16 vs. 32 lanes) | Reduced I/O and transceiver count lowers cost and power for mid-tier 5G small cells | Drop-in compatible for space-constrained designs where full XCKU9P capacity is unused |
Compared with XCKU15P-L1FFVE1156I and XCKU5P-L1FFVD900I, the XCKU9P-L1FFVE900I delivers optimal balance of logic density, transceiver count, and thermal envelope for air-cooled 5G and radar edge nodes-avoiding overdesign while preserving upgrade path to higher variants.
Availability
XCKU9P-L1FFVE900I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for XCKU9P-L1FFVE900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex UltraScale+ family targets high-throughput, low-latency signal processing in communications and defense systems where deterministic timing and hardened protocol engines are essential.
FAQ
What is the maximum supported DDR4 data rate for the XCKU9P-L1FFVE900I?
The XCKU9P-L1FFVE900I supports DDR4-2400 (1200 MHz clock) with 16-bit or 32-bit interfaces. This is implemented via the hardened UltraScale+ memory controller, which includes on-die termination, write-leveling, and read-leveling calibration. The XCKU9P-L1FFVE900I achieves this rate across all four memory controller instances, each supporting up to 256-bit total width with ECC capability.
Does the XCKU9P-L1FFVE900I support partial reconfiguration?
Yes, the XCKU9P-L1FFVE900I fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic swapping of logic modules-such as different filter coefficients or modulation schemes-without resetting the entire device. The XCKU9P-L1FFVE900I implements dedicated configuration port arbitration and frame-based bitstream loading to ensure safe, glitch-free transitions during operation.
What thermal solution is recommended for continuous operation of the XCKU9P-L1FFVE900I?
A heatsink with minimum 12°C/W thermal resistance and forced airflow of ≥200 LFM is recommended for the XCKU9P-L1FFVE900I at its 25 W TDP. The device's thermal lid is designed for direct contact with standard clip-on heatsinks. Thermal simulation data confirms junction temperatures remain below 100°C under worst-case ambient (85°C) and full utilization, provided the PCB uses 4 oz copper and 6+ internal layers with thermal vias under the package.
Can the XCKU9P-L1FFVE900I be configured via Quad-SPI Flash?
Yes, the XCKU9P-L1FFVE900I supports Quad-SPI Flash configuration in single, dual, or quad mode using the dedicated CONFIG_IO pins. It is compatible with common 3.3 V SPI NOR devices such as Micron MT25QL02GC and Winbond W25Q256JWE. The XCKU9P-L1FFVE900I boots automatically after power-up when CONFIG_MODE pins are set to SPI mode, with built-in error detection and fallback to JTAG if boot fails.
What is the transceiver lane count and protocol support for the XCKU9P-L1FFVE900I?
The XCKU9P-L1FFVE900I integrates 32 GTH transceiver lanes, each capable of 25.8 Gb/s operation. These support PCIe Gen4 x16 (with bifurcation), 100G Ethernet (KR4), CPRI v7.0, and JESD204B/C. Protocol mapping is fixed per lane group: lanes 0–15 support PCIe Gen4 root complex, while lanes 16–31 are configurable for serial protocols requiring deterministic latency like JESD204C.
XCKU9P-L1FFVE900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 34260
- Number of Logic Elements/Cells:
- 599550
- Total RAM Bits:
- 41881600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU9P-L1FFVE900I FAQ
1.How can I place an order for XCKU9P-L1FFVE900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU9P-L1FFVE900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU9P-L1FFVE900I reliable?
The price and inventory of XCKU9P-L1FFVE900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU9P-L1FFVE900I is usually 5 days.
3.What payment methods are accepted for XCKU9P-L1FFVE900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU9P-L1FFVE900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU9P-L1FFVE900I?
XCKU9P-L1FFVE900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU9P-L1FFVE900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU9P-L1FFVE900I?
For technical support, including XCKU9P-L1FFVE900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU9P-L1FFVE900I requirements.
6.How does Aetrix verify that XCKU9P-L1FFVE900I is sourced from the original manufacturer or authorized distributors?
All XCKU9P-L1FFVE900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU9P-L1FFVE900I meets industry standards.
7.What is the process for return or replacement of XCKU9P-L1FFVE900I?
All XCKU9P-L1FFVE900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU9P-L1FFVE900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU9P-L1FFVE900I part is unused and in its original packaging.
Return procedure for XCKU9P-L1FFVE900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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