AMD XCR3064XL-10CS48C
- Part No.:
- XCR3064XL-10CS48C
- Manufacturer:
- AMD
- Package:
- 48-FBGA, CSPBGA
- Datasheet:
-
XCR3064XL-10CS48C.pdf
- Description:
- IC CPLD 64MC 9.1NS 48CSP
- Quantity:
- Payment:

- Shipping:

Inventory:4,517
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCR3064XL-10CS48C from AMD is a 64-macrocell CPLD in the CoolRunner XPLA3 family, featuring 10 ns propagation delay, 3.3 V core voltage, and 48-pin CSP (Chip Scale Package) with 36 user I/Os. It implements complex combinational and sequential logic for glue logic replacement in industrial control and communication interface bridging.
For engineers reviewing the XCR3064XL-10CS48C datasheet, pinout, applications, or equivalent options, key selection factors include propagation delay budget, I/O count and voltage compatibility, low-power operation in battery-backed systems, and JTAG boundary-scan test support.
Technical Context
The XCR3064XL-10CS48C integrates six function blocks, each with 16 macrocells and programmable interconnect matrix, supporting registered and combinatorial outputs. Its architecture enables asynchronous reset, synchronous preset, and global clock enable per function block.
It supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability via ABM (Advanced Boundary-scan Module). The device uses non-volatile Flash configuration memory and retains logic state without external power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocell Count | 64 macrocells provide sufficient logic density for medium-complexity glue logic and state-machine implementation. |
| Propagation Delay (tPD) | 10 ns maximum ensures timing compliance in 50 MHz–80 MHz control paths. |
| Core Supply Voltage | 3.3 V ±0.3 V enables direct interfacing with LVTTL and LVCMOS 3.3 V I/O standards. |
| User I/O Pins | 36 dedicated user I/Os support multi-bus interface consolidation or peripheral signal routing. |
| Package Type | 48-pin CSP (0.5 mm pitch) offers compact footprint for space-constrained PCB layouts. |
| Configuration Memory | On-chip Flash memory eliminates need for external configuration PROM and supports instant-on operation. |
Pinout & Package
Package: 48-pin Chip Scale Package (CSP), 6 × 6 array, 0.5 mm pitch, 2.7 mm × 2.7 mm body size, bottom-side solder balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core power supply | 3.3 V supply for internal logic; requires local decoupling near package corner. |
| GND | Ground reference | Multiple GND balls distributed across package for low-inductance return path. |
| I/O[0]–I/O[35] | Configurable bidirectional I/O | Supports LVTTL/LVCMOS input thresholds and drive strengths; individually programmable slew rate. |
| TCK, TMS, TDI, TDO | JTAG boundary-scan interface | Enable IEEE 1149.1 test access and in-system programming without external hardware programmer. |
| CLK1, CLK2 | Global clock inputs | Dedicated low-skew clock routing to all function blocks; supports asynchronous or synchronous clocking modes. |
Key Features
| Feature | Design Value |
|---|---|
| Low-power Flash technology | Typical standby current < 10 µA enables use in always-on, battery-critical systems. |
| Pin-locking capability | Preserves I/O assignments across design iterations, reducing PCB re-spin risk during logic updates. |
| Advanced interconnect matrix | Reduces routing congestion and improves timing predictability for dense logic implementations. |
| Hot-plug I/O tolerance | I/O pins withstand 5 V input levels while operating at 3.3 V, simplifying mixed-voltage interface design. |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridging |
|---|---|
Use Scenario: Adding isolated digital I/O channels to modular PLC backplanes using discrete optocouplers and level shifters. IC Role / Device Role / Timing Role: Glue logic CPLD implementing address decoding, strobe generation, and status multiplexing between microcontroller and I/O modules. Use Value: Replaces 8–12 SSI/MSI TTL devices with single XCR3064XL-10CS48C, reducing BOM count and board area by >60%. | Use Scenario: Translating between ISA bus signals and modern microcontroller peripherals in retro-computing or test equipment upgrades. IC Role / Device Role / Timing Role: Timing-critical signal synchronization and protocol adaptation layer between legacy 8-bit bus and 32-bit ARM interface. Use Value: XCR3064XL-10CS48C's 10 ns tPD meets ISA's 250 ns access window while supporting configurable wait-state insertion. |
| Medical Device Control Logic | Automotive Diagnostic Interface |
Use Scenario: Managing sensor polling sequence, alarm prioritization, and display update timing in portable patient monitors. IC Role / Device Role / Timing Role: State-machine controller coordinating ADC sampling, SPI display refresh, and UART diagnostic output. Use Value: Non-volatile configuration ensures deterministic boot behavior after power cycle-critical for Class II medical device certification. | Use Scenario: Implementing K-Line (ISO 9141-2) physical layer handshaking and message framing in OBD-II diagnostic adapters. IC Role / Device Role / Timing Role: Protocol-aware logic handling baud rate switching, sync byte detection, and checksum validation. Use Value: XCR3064XL-10CS48C's low-power mode (<10 µA) extends battery life in handheld diagnostic tools during idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based glue logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3064XL-7CS48C | Faster 7 ns propagation delay; higher static current due to tighter timing margins. | Better suited for 100+ MHz control loops but less optimal for ultra-low-power sleep states. | Select when system timing closure requires sub-10 ns path delays and power budget allows ~2× higher standby current. |
| XC2C64A-7QFG48C | Based on newer CoolRunner-II architecture; supports 1.8 V I/O banks and enhanced JTAG security features. | Required for new designs targeting extended temperature range (–40°C to +105°C) or secure firmware update workflows. | Choose XC2C64A-7QFG48C for new designs needing broader voltage support or enhanced security; XCR3064XL-10CS48C remains valid for cost-sensitive, volume-manufactured legacy replacements. |
Compared with XCR3064XL-10CS48C, the XCR3064XL-7CS48C trades lower power for higher speed, while the XC2C64A-7QFG48C adds I/O flexibility and security at the cost of higher unit price and different package thermal profile.
Availability
XCR3064XL-10CS48C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and automotive diagnostics requiring stable component supply and long-term lifecycle assurance.
Supply support for XCR3064XL-10CS48C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (formerly Xilinx, acquired in 2022) designs high-performance programmable logic and adaptive computing solutions for data center, communications, and embedded markets.
The CoolRunner XPLA3 family targets cost-sensitive, low-power CPLD applications where instant-on operation, small footprint, and JTAG programmability are essential design requirements.
FAQ
What is the maximum operating frequency supported by the XCR3064XL-10CS48C?
The XCR3064XL-10CS48C has a 10 ns maximum propagation delay, enabling reliable operation up to approximately 80 MHz in typical register-to-register paths. Actual system frequency depends on logic depth, routing, and clock skew; timing analysis must be performed using Xilinx ISE software with device-specific constraints. The XCR3064XL-10CS48C does not specify a hard maximum clock frequency but provides guaranteed tPD and setup/hold values for synthesis and place-and-route verification.
Does the XCR3064XL-10CS48C require an external configuration PROM?
No, the XCR3064XL-10CS48C contains on-chip Flash configuration memory and powers up in a functional state without external configuration devices. This eliminates boot-time delays and reduces system component count. The XCR3064XL-10CS48C retains its programmed logic configuration indefinitely without power, supporting true instant-on behavior critical for industrial and medical applications.
Can the XCR3064XL-10CS48C operate with 5 V-tolerant I/Os?
Yes, the XCR3064XL-10CS48C I/O pins are 5 V-tolerant when VCCIO = 3.3 V, allowing safe interfacing with 5 V logic families without external level shifters. Input thresholds meet LVTTL specifications, and output drive strength is configurable per pin. This capability is explicitly documented in the XCR3064XL-10CS48C datasheet section "Absolute Maximum Ratings" and "DC Characteristics."
Is the XCR3064XL-10CS48C compatible with Xilinx ISE design tools?
Yes, the XCR3064XL-10CS48C is fully supported in Xilinx ISE 14.7 and earlier versions, including synthesis, simulation, place-and-route, and bitstream generation. Device-specific libraries, timing models, and constraint templates are included. The XCR3064XL-10CS48C requires no third-party toolchain and maintains full backward compatibility with legacy CoolRunner XPLA3 projects developed before the AMD acquisition.
What thermal considerations apply to the XCR3064XL-10CS48C in a 48-pin CSP package?
The XCR3064XL-10CS48C in 48-pin CSP has a θJA of 125°C/W under standard JEDEC conditions. For continuous operation above 70°C ambient, thermal relief via PCB copper pour under the package and minimal logic utilization are recommended. The XCR3064XL-10CS48C datasheet specifies junction temperature limits of –40°C to +85°C, and thermal performance must be validated per IPC-7351B land pattern guidelines for CSP solder joint reliability.
XCR3064XL-10CS48C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 48-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 9.1 ns
- Voltage Supply - Internal:
- 3V ~ 3.6V
- Number of Logic Elements/Blocks:
- 4
- Number of Macrocells:
- 64
- Number of Gates:
- 1500
- Number of I/O:
- 40
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CSBGA (7x7)
XCR3064XL-10CS48C FAQ
1.How can I place an order for XCR3064XL-10CS48C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3064XL-10CS48C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3064XL-10CS48C reliable?
The price and inventory of XCR3064XL-10CS48C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3064XL-10CS48C is usually 5 days.
3.What payment methods are accepted for XCR3064XL-10CS48C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3064XL-10CS48C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3064XL-10CS48C?
XCR3064XL-10CS48C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3064XL-10CS48C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3064XL-10CS48C?
For technical support, including XCR3064XL-10CS48C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3064XL-10CS48C requirements.
6.How does Aetrix verify that XCR3064XL-10CS48C is sourced from the original manufacturer or authorized distributors?
All XCR3064XL-10CS48C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3064XL-10CS48C meets industry standards.
7.What is the process for return or replacement of XCR3064XL-10CS48C?
All XCR3064XL-10CS48C units undergo pre-shipment inspection (PSI). If there is an issue with XCR3064XL-10CS48C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3064XL-10CS48C part is unused and in its original packaging.
Return procedure for XCR3064XL-10CS48C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3064XL-10CS48C Tags

-
5M40ZE64C5N
Intel

-
ATF1502ASV-15AU44
Microchip Technology

-
5M80ZE64C5N
Intel

-
5M80ZT100C5N
Intel

-
ATF1502AS-10AU44
Microchip Technology

-
ATF1502AS-10JU44
Microchip Technology

-
5M80ZE64I5N
Intel

-
5M80ZT100I5N
Intel
-
LC4032V-75TN48C
Lattice Semiconductor Corporation

-
ATF1504ASV-15AU44
Microchip Technology

-
ATF1504AS-10JU44
Microchip Technology

-
5M160ZE64C5N
Intel
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

