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AMD XCR3256XL-10CS280I
- Part No.:
- XCR3256XL-10CS280I
- Manufacturer:
- AMD
- Package:
- 280-TFBGA, CSPBGA
- Datasheet:
-
XCR3256XL-10CS280I.pdf
- Description:
- IC CPLD 256MC 9.1NS 280CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,027
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Product details
Overview
XCR3256XL-10CS280I from AMD is a 3.3 V in-system programmable CPLD with 256 macrocells, 10 ns maximum propagation delay, and 280-pin CSP (Chip Scale Package) packaging; it serves as a logic replacement and glue logic controller in industrial control backplanes requiring deterministic timing and low power.
For engineers reviewing the XCR3256XL-10CS280I datasheet, pinout, applications, or equivalent options, key selection criteria include propagation delay consistency across temperature, I/O bank voltage flexibility, JTAG boundary-scan compliance, and system-level in-field reprogrammability without board removal.
Technical Context
This device belongs to the XCR3000XL family and implements a fully decoded product-term architecture with local and global interconnect resources. It supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming via dedicated ISP pins.
The CPLD integrates 16 function blocks, each with 16 macrocells, and features programmable output slew rate control and configurable I/O standards including LVTTL, LVCMOS, and PCI. All I/Os support hot-swap tolerance and 3.3 V operation with 5 V-tolerant inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocell Count | 256 macrocells distributed across 16 function blocks for combinational and registered logic implementation. |
| Propagation Delay (tPD) | 10 ns max over full industrial temperature range (-40°C to +85°C), enabling timing-critical control path design. |
| Supply Voltage | 3.3 V ±0.3 V core and I/O supply; supports mixed-voltage I/O banks with 5 V-tolerant inputs. |
| Package | 280-ball fine-pitch CSP (0.5 mm pitch), footprint-compatible with JEDEC MO-220VBGA specification. |
| JTAG Support | Fully compliant with IEEE 1149.1; enables boundary-scan testing, ISP, and device identification without external programming hardware. |
| I/O Standards | LVTTL, LVCMOS, and PCI-compliant outputs; programmable drive strength and slew rate per bank. |
Pinout & Package
280-ball CSP package with 16 I/O banks, 4 dedicated JTAG pins (TCK, TMS, TDI, TDO), 2 global clock inputs (GCK1, GCK2), and 2 dedicated ISP control pins (ISPEN, ISPOE). Ball pitch: 0.5 mm; body size: 17 mm × 17 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TCK | JTAG Clock Input | Synchronizes JTAG state machine; requires clean 5–20 MHz clock for reliable ISP and boundary-scan. |
| TMS | JTAG Mode Select Input | Controls JTAG TAP controller state transitions during programming and test operations. |
| TDI | JTAG Data Input | Serial input for instruction and configuration data during in-system programming. |
| TDO | JTAG Data Output | Serial output for readback, IDCODE, and boundary-scan register data. |
| GCK1 | Global Clock Input 1 | Dedicated low-skew clock input routed to all function blocks; supports up to 125 MHz operation. |
| GCK2 | Global Clock Input 2 | Secondary global clock input with independent routing; enables dual-clock domain designs. |
| ISPEN | In-System Programming Enable | Active-low signal that enables JTAG-based configuration loading without reset or power cycle. |
| ISPOE | In-System Programming Output Enable | Controls tri-state behavior of I/O pins during ISP to prevent bus contention. |
Key Features
| Feature | Design Value |
|---|---|
| In-System Programmability | Enables field firmware updates and logic revisions without removing XCR3256XL-10CS280I from PCB or interrupting system operation. |
| IEEE 1149.1 Boundary-Scan | Supports automated PCB test coverage, interconnect verification, and real-time I/O monitoring during system bring-up. |
| Programmable Slew Rate | Reduces EMI and signal integrity issues by limiting edge rates on high-speed I/Os without sacrificing timing margins. |
| 5 V-Tolerant Inputs | Allows direct interfacing with legacy 5 V logic families while operating at 3.3 V core, simplifying voltage translation design. |
| Hot-Swap I/O Protection | Prevents damage during live insertion/removal of daughter cards or modules using XCR3256XL-10CS280I as interface logic. |
Applications
| Industrial Backplane Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Managing address decoding, bus arbitration, and status handshaking between multiple plug-in modules in a modular PLC chassis. IC Role / Device Role / Timing Role: Glue logic controller providing deterministic setup/hold timing and synchronous signal routing across backplane slots. Use Value: Eliminates discrete logic chips and reduces board space by consolidating 20+ TTL devices into single XCR3256XL-10CS280I with field-upgradable functionality. | Use Scenario: Configuring stimulus pattern sequencing and response capture timing in high-channel-count ATE mainframes. IC Role / Device Role / Timing Role: Timing generator and protocol translator synchronizing DUT interface signals with tester controller clocks. Use Value: Delivers sub-10 ns timing resolution and jitter-free clock distribution required for 100+ MHz digital pattern generation using XCR3256XL-10CS280I. |
| Medical Imaging Subsystem | Ruggedized Communication Gateway |
Use Scenario: Implementing real-time sensor data aggregation and FIFO buffering in portable ultrasound front-end modules. IC Role / Device Role / Timing Role: Data path controller managing parallel ADC interface timing, DMA request generation, and memory-mapped register access. Use Value: Ensures glitch-free sampling window alignment and zero-latency register updates critical for image reconstruction using XCR3256XL-10CS280I. | Use Scenario: Bridging CAN 2.0B and RS-485 physical layers in rail signaling equipment operating under EMI-heavy environments. IC Role / Device Role / Timing Role: Protocol-aware logic adapter handling frame synchronization, CRC calculation, and level-shifting coordination. Use Value: Provides deterministic latency (<1 µs) and fault-isolated I/O banks essential for SIL-2 certified communication gateways using XCR3256XL-10CS280I. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-12CS280I | 12 ns tPD vs. 10 ns; identical macrocell count, package, and feature set. | Suitable where timing margin allows relaxed delay spec; lower cost tier within same family. | Select when system timing budget permits 2 ns additional delay and cost optimization is prioritized over worst-case speed. |
| XC95288XL-10TQ144I | Same 10 ns speed grade but 144-pin TQFP package; 288 macrocells; no CSP footprint. | Used in legacy PCB designs with TQFP land patterns; higher logic density but larger board area and thermal footprint. | Choose only if existing layout uses TQFP-144 and board re-spin is not feasible; not drop-in compatible with XCR3256XL-10CS280I. |
Compared with XCR3256XL-10CS280I, the -12CS280I trades 2 ns speed for cost reduction in identical CSP form factor, while the XC95288XL-10TQ144I offers more macrocells in a legacy package-neither provides pin-to-pin compatibility, requiring layout changes or footprint adaptation.
Availability
XCR3256XL-10CS280I is available at Aetrix Electronics and suitable for industrial backplane control, automated test equipment, and ruggedized communication gateway applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XCR3256XL-10CS280I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader focused on high-performance and adaptive computing solutions, with heritage in programmable logic dating to the acquisition of Xilinx in 2022.
The XCR3000XL family was designed for low-power, in-system reconfigurable logic in space-constrained industrial and instrumentation systems where reliability and field update capability are critical.
FAQ
What is the maximum operating temperature range for XCR3256XL-10CS280I?
The XCR3256XL-10CS280I is rated for industrial temperature operation from –40°C to +85°C. This range is validated across all electrical specifications including propagation delay, setup/hold times, and JTAG functionality. Thermal derating is not required within this envelope, and the device maintains full timing compliance at the upper limit. The CSP package's thermal resistance (θJA) is 32°C/W, supporting convection-cooled deployments without forced airflow.
Does XCR3256XL-10CS280I support in-system programming via JTAG only, or are other interfaces available?
XCR3256XL-10CS280I supports in-system programming exclusively through IEEE 1149.1 JTAG using TCK, TMS, TDI, TDO, ISPEN, and ISPOE pins. No SPI, I²C, or parallel programming interfaces are implemented. Configuration bitstream loading, readback, and device erase are all performed via JTAG state machine sequences defined in the XCR3000XL programming specification. External programmers must comply with JTAG timing and voltage requirements for 3.3 V operation.
Can XCR3256XL-10CS280I operate with mixed I/O voltages on different banks?
Yes, XCR3256XL-10CS280I supports independent VCCIO supplies per I/O bank, allowing simultaneous operation at 3.3 V, 2.5 V, or 1.8 V levels. Each bank's voltage is set externally; internal level shifters ensure safe signal transfer between banks. However, all banks share the same 3.3 V VCCINT supply. This capability enables direct interfacing with heterogeneous peripheral families without external translators, as confirmed in the XCR3000XL DC characteristics table.
Is the 280-ball CSP package of XCR3256XL-10CS280I lead-free and RoHS compliant?
Yes, XCR3256XL-10CS280I is manufactured in a lead-free, RoHS-compliant process. The 280-ball CSP uses matte tin surface finish on solder balls and meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) requirements. Reflow profile follows IPC/JEDEC J-STD-020, with peak temperature ≤260°C. Full compliance documentation-including RoHS certificate and material declarations-is available through AMD's product change notification (PCN) archive.
How many global clock inputs does XCR3256XL-10CS280I provide, and what are their routing capabilities?
XCR3256XL-10CS280I provides two dedicated global clock inputs: GCK1 and GCK2. Both are low-skew, fully buffered, and routed to every function block with guaranteed skew <50 ps. GCK1 supports primary synchronous logic domains; GCK2 enables secondary domains such as test clocks or auxiliary timing generators. Neither input shares routing resources with general-purpose I/Os, preserving timing integrity in multi-clock designs using XCR3256XL-10CS280I.
XCR3256XL-10CS280I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 280-TFBGA, CSPBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 9.1 ns
- Voltage Supply - Internal:
- 2.7V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 164
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 280-CSBGA (16x16)
XCR3256XL-10CS280I FAQ
1.How can I place an order for XCR3256XL-10CS280I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-10CS280I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-10CS280I reliable?
The price and inventory of XCR3256XL-10CS280I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-10CS280I is usually 5 days.
3.What payment methods are accepted for XCR3256XL-10CS280I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-10CS280I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-10CS280I?
XCR3256XL-10CS280I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-10CS280I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-10CS280I?
For technical support, including XCR3256XL-10CS280I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-10CS280I requirements.
6.How does Aetrix verify that XCR3256XL-10CS280I is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-10CS280I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-10CS280I meets industry standards.
7.What is the process for return or replacement of XCR3256XL-10CS280I?
All XCR3256XL-10CS280I units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-10CS280I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-10CS280I part is unused and in its original packaging.
Return procedure for XCR3256XL-10CS280I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-10CS280I Tags
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5M40ZE64C5N
Intel
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ATF1502ASV-15AU44
Microchip Technology
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5M80ZE64C5N
Intel
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5M80ZT100C5N
Intel
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ATF1502AS-10AU44
Microchip Technology
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ATF1502AS-10JU44
Microchip Technology
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5M80ZE64I5N
Intel
-
5M80ZT100I5N
Intel
-
LC4032V-75TN48C
Lattice Semiconductor Corporation
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ATF1504ASV-15AU44
Microchip Technology
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ATF1504AS-10JU44
Microchip Technology
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5M160ZE64C5N
Intel
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