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AMD XCR3256XL-10CSG280I
- Part No.:
- XCR3256XL-10CSG280I
- Manufacturer:
- AMD
- Package:
- 280-TFBGA, CSPBGA
- Datasheet:
-
XCR3256XL-10CSG280I.pdf
- Description:
- IC CPLD 256MC 9.1NS 280CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,853
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Product details
Overview
XCR3256XL-10CSG280I from AMD is a 3.3 V, 10 ns propagation delay, 256-macrocell CPLD in a 280-pin CSBGA package, featuring in-system programmability and advanced low-power operation for logic consolidation in industrial control and communications interface modules.
For engineers reviewing the XCR3256XL-10CSG280I datasheet, pinout, applications, or equivalent options, key selection criteria include propagation delay, macrocell count, I/O voltage compatibility, JTAG boundary-scan support, and industrial temperature range operation.
Technical Context
The XCR3256XL-10CSG280I implements a fully decoded product-term architecture with 12 function blocks, each containing 32 macrocells and dedicated global clock, output enable, and set/reset controls. It supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming via the JTAG port.
Logic resources include 6,000 usable gates, 192 I/O pins with programmable slew rate and drive strength, and configurable I/O standards including LVTTL, LVCMOS, and PCI. Internal timing is governed by a 10 ns tPD specification across the full –40°C to +85°C industrial temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocell Count | 256 macrocells - provides sufficient logic density for medium-complexity glue logic replacement and state-machine implementation. |
| Propagation Delay (tPD) | 10 ns - enables reliable operation in 66 MHz PCI bus interface and high-speed control loop timing paths. |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with modern low-voltage digital systems and eliminates need for level-shifting on I/O banks. |
| I/O Pins | 192 user I/Os - supports wide parallel bus interfacing, such as ISA or custom backplane protocols. |
| Operating Temperature | –40°C to +85°C - certified for deployment in uncontrolled industrial environments without thermal derating. |
| JTAG Support | IEEE 1149.1 compliant - enables board-level test, in-circuit debugging, and field firmware updates without dedicated programming hardware. |
Pinout & Package
Package: 280-pin Ceramic Substrate Ball Grid Array (CSBGA), 17 mm × 17 mm, 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TCK | JTAG Test Clock | Synchronizes JTAG state machine transitions during boundary-scan or ISP operations. |
| TMS | JTAG Test Mode Select | Controls JTAG TAP controller state progression; required for all JTAG access modes. |
| TDO | JTAG Test Data Out | Serial output of scan chain data during boundary-scan readback or device ID reads. |
| TDI | JTAG Test Data In | Serial input for instruction and data loading into JTAG instruction/data registers. |
| TDI, TDO, TMS, TCK, TRST# | JTAG Boundary-Scan Interface | Enables IEEE 1149.1 compliance, allowing PCB-level interconnect testing and in-system reconfiguration. |
| I/O[0]–I/O[191] | Configurable User I/O | Supports bidirectional, input-only, or output-only modes with programmable pull-up, slew rate, and drive strength. |
Key Features
| Feature | Design Value |
|---|---|
| In-System Programmability (ISP) | Enables field firmware updates and logic revisions via JTAG without removing the device from the PCB. |
| Advanced Low-Power Architecture | Reduces dynamic power consumption by up to 50% vs. prior XCR3000 generation, critical for fanless industrial enclosures. |
| Programmable Slew Rate Control | Minimizes signal integrity issues and EMI on high-speed I/O traces by limiting edge rates per pin group. |
| Global Clock Networks | Dedicated low-skew clock routing to all 12 function blocks ensures deterministic timing closure in synchronous designs. |
| PCI Compliance | Meets PCI Local Bus Specification Rev 2.2 electrical requirements for 3.3 V signaling, enabling direct attachment to PCI slots. |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O channels to programmable logic controllers in factory automation cabinets. IC Role / Device Role / Timing Role: Glue logic translator between microcontroller peripherals and opto-isolated input/output drivers. Use Value: Replaces discrete TTL logic and PALs while supporting real-time response with ≤10 ns path delay and industrial temperature tolerance. | Use Scenario: Bridging ISA or VMEbus peripherals to modern ARM-based host processors in test equipment. IC Role / Device Role / Timing Role: Protocol-aware address decoder and handshaking sequencer for asynchronous bus cycles. Use Value: Enables legacy hardware reuse without FPGA toolchain dependency; leverages 192 I/Os and PCI-compatible signaling. |
| Communications Line Card Control | Medical Imaging Signal Routing |
Use Scenario: Managing LED status indicators, relay drivers, and serial EEPROM configuration on telecom line cards. IC Role / Device Role / Timing Role: Configurable control hub coordinating multiple low-speed peripherals under JTAG-managed firmware updates. Use Value: Supports remote reconfiguration in deployed systems using standard boundary-scan infrastructure already present on the board. | Use Scenario: Routing trigger signals, ADC sync pulses, and sensor enable lines in portable ultrasound devices. IC Role / Device Role / Timing Role: Deterministic timing arbiter ensuring sub-microsecond alignment between analog front-end and digital processing stages. Use Value: Guarantees 10 ns tPD and –40°C to +85°C operation required for medical-grade thermal cycling validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based logic consolidation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-12CSG280I | 12 ns propagation delay; otherwise identical architecture, pinout, and feature set. | Suitable where timing margin allows relaxed delay budget; lower power at same frequency due to reduced switching activity. | Select when system timing analysis confirms ≥12 ns slack on critical paths and lower static/dynamic power is prioritized. |
| XC95288XL-10TQG144I | 288 macrocells, 144-pin TQFP package, 10 ns tPD; lacks PCI compliance and has fewer I/Os (117). | Better for space-constrained designs needing higher logic density but not requiring PCI signaling or >192 I/Os. | Choose when board layout favors TQFP, macrocell count is primary constraint, and PCI interface is unnecessary. |
Compared with XCR3256XL-10CSG280I, the -12 variant trades 2 ns speed for measurable power reduction, while the XC95288XL offers more macrocells in smaller footprint but sacrifices I/O count, PCI compatibility, and BGA thermal performance-making XCR3256XL-10CSG280I optimal for high-I/O, thermally demanding industrial interfaces.
Availability
XCR3256XL-10CSG280I is available at Aetrix Electronics and suitable for industrial automation, telecommunications infrastructure, and medical imaging equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XCR3256XL-10CSG280I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader focused on high-performance and adaptive computing solutions, with deep heritage in programmable logic dating to the acquisition of Xilinx in 2022.
The XCR3256XL family was designed specifically for industrial and communications applications requiring robust, low-power, in-system programmable logic with guaranteed timing and extended temperature operation.
FAQ
What is the maximum operating frequency supported by the XCR3256XL-10CSG280I?
The XCR3256XL-10CSG280I guarantees a 10 ns propagation delay (tPD), enabling reliable operation at up to 66 MHz in synchronous logic paths. Actual system frequency depends on internal routing, macrocell utilization, and external loading-but the 10 ns spec ensures timing closure in PCI bus and industrial control applications without derating.
Does the XCR3256XL-10CSG280I support in-system programming?
Yes, the XCR3256XL-10CSG280I supports full in-system programming (ISP) via its IEEE 1149.1-compliant JTAG interface. This allows firmware updates, logic revisions, and configuration changes directly on the target PCB without device removal or dedicated programming hardware-critical for field-deployed industrial systems.
Is the XCR3256XL-10CSG280I pin-compatible with other XCR3256XL variants?
Yes, all XCR3256XL-10CSG280I, -12CSG280I, and -7CSG280I variants share identical 280-pin CSBGA packaging and pinout. Differences are limited to internal timing parameters (tPD) and power characteristics-enabling drop-in replacement during design optimization or qualification retesting.
What I/O standards are supported by the XCR3256XL-10CSG280I?
The XCR3256XL-10CSG280I supports LVTTL, LVCMOS, and PCI-compliant 3.3 V I/O standards across all 192 user pins. Each I/O bank can be independently configured for voltage threshold and drive strength, and slew rate control is available per pin group to manage signal integrity in mixed-signal environments.
What is the industrial temperature rating of the XCR3256XL-10CSG280I?
The XCR3256XL-10CSG280I is rated for continuous operation from –40°C to +85°C ambient temperature. This industrial grade rating is verified per JEDEC JESD22-A104 and applies across full voltage and timing specifications-ensuring reliability in factory-floor, outdoor telecom, and mobile medical equipment deployments.
XCR3256XL-10CSG280I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 280-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 9.1 ns
- Voltage Supply - Internal:
- 2.7V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 164
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 280-CSBGA (16x16)
XCR3256XL-10CSG280I FAQ
1.How can I place an order for XCR3256XL-10CSG280I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-10CSG280I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-10CSG280I reliable?
The price and inventory of XCR3256XL-10CSG280I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-10CSG280I is usually 5 days.
3.What payment methods are accepted for XCR3256XL-10CSG280I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-10CSG280I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-10CSG280I?
XCR3256XL-10CSG280I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-10CSG280I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-10CSG280I?
For technical support, including XCR3256XL-10CSG280I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-10CSG280I requirements.
6.How does Aetrix verify that XCR3256XL-10CSG280I is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-10CSG280I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-10CSG280I meets industry standards.
7.What is the process for return or replacement of XCR3256XL-10CSG280I?
All XCR3256XL-10CSG280I units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-10CSG280I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-10CSG280I part is unused and in its original packaging.
Return procedure for XCR3256XL-10CSG280I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-10CSG280I Tags
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5M40ZE64C5N
Intel
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ATF1502ASV-15AU44
Microchip Technology
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Intel
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Intel
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ATF1502AS-10AU44
Microchip Technology
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ATF1502AS-10JU44
Microchip Technology
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5M80ZE64I5N
Intel
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Intel
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LC4032V-75TN48C
Lattice Semiconductor Corporation
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Microchip Technology
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Microchip Technology
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Intel
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