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AMD XCR3256XL-10FT256I
- Part No.:
- XCR3256XL-10FT256I
- Manufacturer:
- AMD
- Package:
- 256-LBGA
- Datasheet:
-
XCR3256XL-10FT256I.pdf
- Description:
- IC CPLD 256MC 9.1NS 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,583
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Product details
Overview
XCR3256XL-10FT256I from AMD (acquired by Xilinx) is a 3.3 V, 10 ns propagation delay CPLD with 256 macrocells, 256 I/O pins, and in-system programmable (ISP) capability via JTAG; used in legacy industrial control logic replacement and FPGA configuration glue logic.
For engineers reviewing the XCR3256XL-10FT256I datasheet, pinout, applications, or equivalent options, key selection factors include propagation delay, macrocell count, I/O voltage compatibility, ISP support, and TQFP-256 package constraints.
Technical Context
This device belongs to the XCR3000XL family of high-performance, low-voltage Complex Programmable Logic Devices. It implements registered and combinatorial logic using macrocell-based architecture with local interconnect and global routing resources.
It supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming at 3.3 V, with configurable I/O standards including LVTTL, LVCMOS, and PCI-compatible inputs. Internal logic operates at up to 100 MHz system frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Propagation Delay | 10 ns - maximum combinational path delay; determines worst-case timing margin for synchronous logic design. |
| Macrocells | 256 - total user-configurable logic blocks; defines maximum combinational/registered function density. |
| I/O Pins | 256 - bidirectional, 3.3 V-tolerant pins; supports high-pin-count interface bridging without level-shifting. |
| Supply Voltage | 3.3 V ± 0.3 V - single-supply operation; eliminates need for dual-rail power distribution. |
| Programming | In-system programmable (ISP) via JTAG - enables field firmware updates without socket removal or UV erasure. |
| Package | TQFP-256 - 256-pin thin quad flat pack; standard footprint compatible with automated SMT assembly. |
Pinout & Package
Package: 256-pin Thin Quad Flat Package (TQFP), 28 mm × 28 mm, 0.5 mm pitch, lead-free (Pb-free) compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCIO | I/O power supply | Supplies 3.3 V to all I/O banks; decoupling required per bank for noise immunity. |
| VCCINT | Core logic supply | Provides 3.3 V to internal PLD logic array; separate from I/O supply for reduced coupling noise. |
| GND | Ground reference | Multiple dedicated ground pins distributed across perimeter; essential for signal integrity and EMI control. |
| TCK/TMS/TDI/TDO | JTAG test access port | Enables boundary-scan testing and ISP; requires 3.3 V-compatible JTAG controller interface. |
| IO[0..255] | Configurable I/O | Programmable as input, output, or bidirectional; supports slew-rate control and pull-up resistors. |
Key Features
| Feature | Design Value |
|---|---|
| 10 ns pin-to-pin delay | Enables reliable operation in 100 MHz clock domains with sufficient setup/hold margin. |
| 256 macrocells with 5V-tolerant I/O | Supports interfacing with legacy 5 V peripherals while operating on 3.3 V core supply. |
| In-system programmability (ISP) | Allows reconfiguration in final assembled system without removing device from PCB. |
| IEEE 1149.1 JTAG compliance | Permits standardized boundary-scan testing and debug visibility across production boards. |
| Low-power advanced CMOS process | Reduces static current to < 100 µA in standby, critical for battery-backed industrial modules. |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Translation |
|---|---|
Use Scenario: Adding isolated digital I/O channels to programmable logic controllers in factory automation cabinets. IC Role / Device Role / Timing Role: Glue logic implementing address decoding, strobe generation, and status multiplexing between microcontroller and opto-isolated I/O banks. Use Value: Replaces discrete TTL logic with single-chip solution, reducing board area by >70% and eliminating timing skew across parallel paths. | Use Scenario: Bridging ISA or PCI bus signals to modern microcontroller peripherals in retro-computing or medical equipment upgrades. IC Role / Device Role / Timing Role: Level-shifting and protocol adaptation logic for asynchronous control signals (e.g., /IOR, /IOW, /MEMR) between 5 V bus and 3.3 V host. Use Value: Maintains signal integrity across voltage domains while preserving sub-10 ns timing alignment required for legacy bus cycle compliance. |
| FPGA Configuration Manager | Test Equipment Pattern Generator |
Use Scenario: Storing and sequencing configuration bitstreams for Spartan or Virtex FPGAs during power-up or reconfiguration events. IC Role / Device Role / Timing Role: State-machine-based boot controller managing serial PROM readout, CRC validation, and INIT/BPI handshaking. Use Value: Provides deterministic, glitch-free configuration sequencing independent of host processor timing jitter. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms in automated test systems for ASIC validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer driving 256-bit parallel output buses with precise edge alignment. Use Value: Delivers 100 MHz deterministic waveform generation with < 1 ns inter-channel skew, meeting ATE timing calibration requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-12FT256I | 12 ns propagation delay; otherwise identical architecture, pinout, and voltage specs. | Suitable where 100 MHz timing margin is relaxed; lower cost due to relaxed speed bin. | Select when system clock frequency ≤ 80 MHz and BOM cost optimization is prioritized over worst-case timing headroom. |
| XC95288XL-10TQ144I | 288 macrocells but in 144-pin TQFP; no 256-pin footprint compatibility; 3.3 V core/I/O, same ISP/JTAG. | Better logic density per pin but requires PCB redesign; limited I/O count restricts high-channel-count interfaces. | Choose only if board space is constrained and full 256 I/O is not required; verify routing feasibility for reduced pin count. |
Compared with XCR3256XL-10FT256I, the -12FT256I trades 2 ns speed for cost reduction without layout impact, while the XC95288XL-10TQ144I offers higher macrocell density at the expense of I/O count and requires mechanical redesign.
Availability
XCR3256XL-10FT256I is available at Aetrix Electronics and suitable for industrial control, test equipment, and legacy system upgrade programs requiring stable component supply and long-term obsolescence management.
Supply support for XCR3256XL-10FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, inheriting its legacy CPLD portfolio including the XCR3000XL family. Xilinx pioneered high-density, in-system programmable logic devices for industrial and communications infrastructure.
The XCR3000XL family was designed specifically for low-voltage, high-reliability logic replacement in mission-critical industrial and telecom systems where long-lifecycle support and field-upgradable functionality are mandatory.
FAQ
What is the maximum operating frequency supported by XCR3256XL-10FT256I?
XCR3256XL-10FT256I supports system clock frequencies up to 100 MHz under typical conditions, based on its 10 ns propagation delay and internal register-to-register timing specifications. This assumes proper PCB layout, decoupling, and 3.3 V supply stability. The actual achievable frequency depends on logic depth and routing congestion in the user design.
Is XCR3256XL-10FT256I pin-compatible with earlier XCR3256 devices?
Yes, XCR3256XL-10FT256I is pin-compatible with other XCR3256XL variants in the FT256 package, including -7, -12, and -15 speed grades. All share identical pin assignment, power pin locations, and JTAG interface mapping, enabling drop-in replacement within the same speed grade family.
Does XCR3256XL-10FT256I support 5 V tolerant inputs?
Yes, XCR3256XL-10FT256I features 5 V tolerant I/O pins when VCCIO = 3.3 V, allowing direct connection to 5 V logic without external level shifters. Input clamp diodes and internal protection circuitry enable safe operation across mixed-voltage systems, as confirmed in Xilinx DS016 datasheet Section 5.2.
What programming tools are required for XCR3256XL-10FT256I?
XCR3256XL-10FT256I is programmed using Xilinx ISE Design Suite with Impact software, targeting the CoolRunner-II device library. JTAG programming requires a standard 3.3 V–compatible cable (e.g., Xilinx DLC10 or Digilent HS2). No external configuration PROM is needed due to ISP capability.
What is the thermal performance of XCR3256XL-10FT256I in continuous operation?
XCR3256XL-10FT256I has a maximum junction temperature of 105°C and thermal resistance θJA of 26.5°C/W in standard JEDEC 2-layer board conditions. At full utilization and 3.3 V supply, typical power dissipation is 180 mW, allowing operation in industrial enclosures up to 85°C ambient without forced airflow.
XCR3256XL-10FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 256-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 9.1 ns
- Voltage Supply - Internal:
- 2.7V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 164
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FTBGA (17x17)
XCR3256XL-10FT256I FAQ
1.How can I place an order for XCR3256XL-10FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-10FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-10FT256I reliable?
The price and inventory of XCR3256XL-10FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-10FT256I is usually 5 days.
3.What payment methods are accepted for XCR3256XL-10FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-10FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-10FT256I?
XCR3256XL-10FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-10FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-10FT256I?
For technical support, including XCR3256XL-10FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-10FT256I requirements.
6.How does Aetrix verify that XCR3256XL-10FT256I is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-10FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-10FT256I meets industry standards.
7.What is the process for return or replacement of XCR3256XL-10FT256I?
All XCR3256XL-10FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-10FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-10FT256I part is unused and in its original packaging.
Return procedure for XCR3256XL-10FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-10FT256I Tags
-
5M40ZE64C5N
Intel
-
ATF1502ASV-15AU44
Microchip Technology
-
5M80ZE64C5N
Intel
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5M80ZT100C5N
Intel
-
ATF1502AS-10AU44
Microchip Technology
-
ATF1502AS-10JU44
Microchip Technology
-
5M80ZE64I5N
Intel
-
5M80ZT100I5N
Intel
-
LC4032V-75TN48C
Lattice Semiconductor Corporation
-
ATF1504ASV-15AU44
Microchip Technology
-
ATF1504AS-10JU44
Microchip Technology
-
5M160ZE64C5N
Intel
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