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AMD XCR3256XL-10FTG256I
- Part No.:
- XCR3256XL-10FTG256I
- Manufacturer:
- AMD
- Package:
- 256-LBGA
- Datasheet:
-
XCR3256XL-10FTG256I.pdf
- Description:
- IC CPLD 256MC 9.1NS 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,517
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Product details
Overview
XCR3256XL-10FTG256I from AMD (acquired by Xilinx) is a 3.3V CMOS CPLD with 256 macrocells, 10 ns maximum pin-to-pin delay, and 192 user I/O pins in a 256-pin FTBGA package; used in legacy industrial control logic replacement and FPGA configuration glue logic.
For engineers reviewing the XCR3256XL-10FTG256I datasheet, pinout, applications, or equivalent options, key selection factors include propagation delay, I/O count, voltage tolerance, and legacy JTAG programming support.
Technical Context
This device belongs to the XCR3000XL family of in-system programmable CPLDs built on 0.35 µm CMOS technology. It implements registered and combinatorial logic using sum-of-products architecture with up to 40 product terms per macrocell and global/local clocking resources.
The XCR3256XL-10FTG256I supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming via dedicated ISP pins. Its I/Os are configurable for LVTTL/LVCMOS standards with programmable slew rate and pull-up resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocell Count | 256 macrocells provide combinational and registered logic capacity for medium-complexity glue logic functions. |
| Propagation Delay | 10 ns max ensures timing-critical path compatibility with 100 MHz system clocks in synchronous designs. |
| User I/O Pins | 192 user-programmable I/Os enable interface bridging between multiple legacy parallel buses or peripheral controllers. |
| Supply Voltage | 3.3 V ±0.3 V operation allows direct interfacing with 3.3 V microcontrollers and FPGAs without level translation. |
| Package Type | 256-pin Fine-Pitch Thin BGA (FTBGA) with 1.0 mm pitch supports high-density PCB layouts and thermal dissipation up to 1.2 W. |
| JTAG Support | IEEE 1149.1-compliant boundary-scan enables board-level testability and in-system reprogramming without external programmers. |
Pinout & Package
256-pin Fine-Pitch Thin BGA (FTBGA), 1.0 mm pitch, 17 mm × 17 mm body size, bottom-side solder balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TCK | JTAG Test Clock | Synchronizes JTAG state machine transitions during boundary-scan or ISP operations. |
| TMS | JTAG Test Mode Select | Controls JTAG TAP controller state transitions for instruction and data register access. |
| TDO | JTAG Test Data Out | Serial output for boundary-scan register or device ID readback during debug or test. |
| TDI | JTAG Test Data In | Serial input for loading instructions or test data into JTAG instruction/data registers. |
| VCCIO | I/O Power Supply | Supplies 3.3 V to all I/O banks; decoupling required per AMD XCR3000XL layout guidelines. |
| GND | Ground Reference | Provides common return path for I/O and core logic; multiple GND balls ensure low-impedance grounding. |
Key Features
| Feature | Design Value |
|---|---|
| In-System Programmability | Enables field firmware updates and logic revisions without device removal or socket programming. |
| Programmable Slew Rate | Reduces EMI and signal integrity issues on high-speed I/O traces by limiting edge rates per pin group. |
| Individual Pin Pull-Up | Allows selective weak pull-up activation on unused or open-drain I/Os to prevent floating inputs. |
| Global Clock Networks | Dedicated low-skew routing paths support synchronous logic across all 256 macrocells with minimal clock skew. |
| Multi-Voltage I/O Banks | Supports mixed-voltage interfaces (e.g., 3.3 V core + 2.5 V or 1.8 V peripherals) via bank-specific VCCIO settings. |
Applications
| Industrial PLC Logic | FPGA Configuration Manager |
|---|---|
Use Scenario: Replacing discrete TTL logic in legacy programmable logic controller backplanes requiring long-lifecycle support. IC Role / Device Role / Timing Role: Glue logic sequencer implementing address decoding, bus arbitration, and status multiplexing. Use Value: 10 ns propagation delay meets cycle-time requirements of 8-bit/16-bit microcontroller buses operating at ≤25 MHz. | Use Scenario: Managing bitstream loading and startup sequencing for Spartan-3 and Virtex-II FPGAs in embedded systems. IC Role / Device Role / Timing Role: Configuration state machine coordinating power-on reset, PROM read, and INIT/BUSY handshaking. Use Value: 192 I/Os allow parallel interface to flash memory, FPGA configuration pins, and system status LEDs. |
| Legacy Bus Bridge | Test Equipment Control |
Use Scenario: Interfacing ISA-bus peripherals with modern PCI Express host controllers in automated test equipment. IC Role / Device Role / Timing Role: Protocol translator converting strobe-based ISA timing to packetized PCIe transaction layer signals. Use Value: Programmable slew rate and I/O voltage flexibility accommodate both 5 V tolerant ISA slots and 3.3 V PCIe bridge chips. | Use Scenario: Implementing digital stimulus/response logic in benchtop oscilloscopes and signal generators. IC Role / Device Role / Timing Role: Real-time trigger sequencer capturing edge events and generating calibrated pulse outputs. Use Value: 256 macrocells provide sufficient logic depth for multi-stage state machines with sub-10 ns timing resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-12FTG256I | 12 ns propagation delay vs. 10 ns; otherwise identical architecture, pinout, and feature set. | Lower maximum operating frequency (≤83 MHz vs. ≤100 MHz); suitable where timing margin is relaxed. | Select when design tolerates 2 ns slower path delay and cost sensitivity outweighs performance headroom. |
| XC95288XL-10TQG144I | Smaller 144-pin TQFP package, 288 macrocells, same 10 ns speed grade but lower I/O count (117 vs. 192). | Limited I/O availability restricts use in wide-bus bridging; better suited for compact control logic modules. | Choose when board space is constrained and full 192 I/Os are unnecessary for target function. |
Compared with XCR3256XL-10FTG256I, the -12 speed grade trades 2 ns delay for potential cost reduction, while the XC95288XL variant offers higher macrocell density in a smaller footprint at the expense of I/O scalability.
Availability
XCR3256XL-10FTG256I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and legacy system refurbishment requiring stable component supply over extended production lifecycles.
Supply support for XCR3256XL-10FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, inheriting its legacy programmable logic portfolio including the CoolRunner-II CPLD family.
The XCR3256XL series was designed for low-power, high-reliability logic replacement in industrial and telecom infrastructure where long-term availability and in-system reprogrammability are critical.
FAQ
What is the maximum operating frequency supported by XCR3256XL-10FTG256I?
The XCR3256XL-10FTG256I supports a maximum system clock frequency of 100 MHz, derived from its 10 ns pin-to-pin propagation delay specification under worst-case conditions. This rating assumes proper PCB layout, decoupling, and signal integrity practices as defined in AMD's XCR3000XL design guidelines. The actual achievable frequency depends on internal logic depth and routing congestion in the implemented design.
Does XCR3256XL-10FTG256I support in-system programming via JTAG?
Yes, XCR3256XL-10FTG256I fully supports IEEE 1149.1 JTAG boundary-scan and in-system programming through dedicated TCK, TMS, TDI, and TDO pins. No external programming hardware is required beyond a standard JTAG adapter, and configuration bitstreams can be updated in the field without removing the device from the PCB.
Can XCR3256XL-10FTG256I operate with 5 V-tolerant I/Os?
No, XCR3256XL-10FTG256I is a 3.3 V-only device with LVTTL/LVCMOS I/O standards. Its inputs are not 5 V tolerant, and applying 5 V signals may damage the device. External level-shifting circuitry is required when interfacing with 5 V buses such as legacy ISA or PCI.
What development tools are compatible with XCR3256XL-10FTG256I?
XCR3256XL-10FTG256I is supported by Xilinx ISE Design Suite 14.7 and earlier versions. Synthesis, fitting, and bitstream generation are fully functional within this toolchain. AMD does not provide active tool support for this legacy device, and newer Vivado software does not support CoolRunner-II CPLDs.
Is XCR3256XL-10FTG256I RoHS compliant?
Yes, XCR3256XL-10FTG256I is RoHS 6/6 compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FTBGA package uses matte tin surface finish on solder balls, and the device carries the "Pb-Free" marking per AMD's packaging documentation for this speed-grade and package combination.
XCR3256XL-10FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 9.1 ns
- Voltage Supply - Internal:
- 2.7V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 164
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FTBGA (17x17)
XCR3256XL-10FTG256I FAQ
1.How can I place an order for XCR3256XL-10FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-10FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-10FTG256I reliable?
The price and inventory of XCR3256XL-10FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-10FTG256I is usually 5 days.
3.What payment methods are accepted for XCR3256XL-10FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-10FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-10FTG256I?
XCR3256XL-10FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-10FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-10FTG256I?
For technical support, including XCR3256XL-10FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-10FTG256I requirements.
6.How does Aetrix verify that XCR3256XL-10FTG256I is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-10FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-10FTG256I meets industry standards.
7.What is the process for return or replacement of XCR3256XL-10FTG256I?
All XCR3256XL-10FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-10FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-10FTG256I part is unused and in its original packaging.
Return procedure for XCR3256XL-10FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-10FTG256I Tags
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Intel
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Microchip Technology
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Microchip Technology
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Lattice Semiconductor Corporation
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Microchip Technology
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