AMD XCR3256XL-12PQ208I
- Part No.:
- XCR3256XL-12PQ208I
- Manufacturer:
- AMD
- Package:
- 208-BFQFP
- Datasheet:
-
XCR3256XL-12PQ208I.pdf
- Description:
- IC CPLD 256MC 10.8NS 208QFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,746
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCR3256XL-12PQ208I from AMD (formerly Xilinx) is a 3.3 V, 12 ns propagation delay CPLD featuring 256 macrocells, 208-pin PQFP package, and in-system programmability via JTAG. It targets glue logic replacement and control-plane interface bridging in industrial I/O modules.
For engineers reviewing the XCR3256XL-12PQ208I datasheet, pinout, applications, or equivalent options, key selection criteria include propagation delay, macrocell count, I/O pin count, JTAG compliance, and 3.3 V core voltage compatibility with legacy 5 V tolerant I/Os.
Technical Context
The XCR3256XL-12PQ208I implements a fully decoded product-term architecture with 128 function blocks per logic block, distributed global clock and reset resources, and configurable output slew rate control. Each macrocell supports registered or combinatorial output modes with individual OE control.
It supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming at 3.3 V, with I/O pins rated for 5 V tolerance and programmable pull-up resistors. The device uses non-volatile EEPROM-based configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Propagation Delay | 12 ns typical – ensures timing-critical control path alignment in real-time PLC backplanes. |
| Macrocells | 256 – provides sufficient logic density for multi-channel digital I/O expansion and protocol translation. |
| I/O Pins | 172 user I/Os – supports high-pin-count interface bridging between microcontrollers and peripheral ASICs. |
| Supply Voltage | 3.3 V core / 5 V tolerant I/Os – enables direct interfacing with both modern low-voltage controllers and legacy 5 V peripherals. |
| Configuration | EEPROM-based non-volatile – eliminates external configuration PROM and enables instant-on operation after power-up. |
| JTAG Support | IEEE 1149.1 compliant – allows standardized boundary-scan test and field firmware updates without dedicated programming hardware. |
Pinout & Package
208-pin Plastic Quad Flat Package (PQFP), 28 × 28 mm body, 0.5 mm pitch, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK3 | Global Clock Inputs | Dedicated low-skew clock inputs routed to all function blocks for synchronous control logic. |
| GTS0–GTS3 | Global Three-State Inputs | Enable/disable output drivers across multiple macrocells simultaneously for bus arbitration. |
| TDI/TDO/TCK/TMS | JTAG Boundary-Scan Interface | Standardized test and programming interface supporting IEEE 1149.1 compliance and ISP. |
| I/O[0]–I/O[171] | User I/O Pins | Configurable as input, output, or bidirectional with programmable pull-up and slew rate control. |
| VCCINT | Core Power Supply | 3.3 V supply for internal logic; requires local decoupling near package corner pins. |
| VCCIO | I/O Power Supply | 3.3 V or 5 V selectable per bank; determines I/O voltage level and drive strength. |
Key Features
| Feature | Design Value |
|---|---|
| In-System Programmability (ISP) | Enables field firmware updates and logic reconfiguration via JTAG without removing the device from the PCB. |
| 5 V Tolerant I/Os | Allows direct connection to legacy 5 V logic families while operating on 3.3 V core, reducing level-shifter count. |
| Programmable Slew Rate Control | Reduces EMI and signal integrity issues by limiting edge rates on high-speed I/O transitions. |
| Individual Output Enable per Macrocell | Supports fine-grained bus contention management and dynamic I/O direction control in multi-master systems. |
| Non-Volatile EEPROM Configuration | Eliminates boot-time configuration delay and external memory dependency for deterministic startup behavior. |
Applications
| Industrial PLC Backplane Logic | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing discrete TTL logic in modular PLC rack controllers to manage slot addressing, interrupt routing, and status decoding. IC Role / Device Role / Timing Role: Glue logic CPLD implementing address decode, handshake synchronization, and fault flag aggregation. Use Value: Reduces board space by >70% versus discrete solution and supports field-upgradable control logic without hardware change. | Use Scenario: Bridging ISA or VMEbus peripherals to modern ARM-based controller subsystems in test equipment. IC Role / Device Role / Timing Role: Protocol translator and timing adapter handling strobe-to-clock domain conversion and data width mismatch. Use Value: Enables reuse of certified legacy measurement modules while migrating host processors to lower-power SoCs. |
| Motor Drive Control Sequencing | Medical Imaging Data Path Control |
Use Scenario: Generating gate-drive enable sequences, fault interlocks, and PWM dead-time insertion in servo amplifier boards. IC Role / Device Role / Timing Role: Deterministic state machine managing power stage sequencing with sub-100 ns timing resolution. Use Value: Guarantees safe turn-on/turn-off ordering across IGBT half-bridges and prevents shoot-through under fault conditions. | Use Scenario: Controlling ADC sample strobes, FIFO handshaking, and sensor multiplexer selection in ultrasound front-end modules. IC Role / Device Role / Timing Role: Timing coordinator synchronizing analog acquisition, digital buffering, and DMA request generation. Use Value: Maintains precise sample-to-sample jitter < 2 ns across 16-channel parallel acquisition paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based control logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-10PQ208I | 10 ns propagation delay, identical macrocell count and pinout. | Suitable where tighter timing margins are required in high-speed control loops. | Select when system-level setup/hold timing budgets demand ≤10 ns path delay. |
| XC95288XL-10TQ144I | 288 macrocells, 144-pin TQFP, 10 ns delay, no 5 V tolerant I/Os. | Better suited for higher-density logic integration but requires level-shifting for 5 V interfaces. | Choose when logic capacity exceeds 256 macrocells and 5 V tolerance is not required. |
Compared with XCR3256XL-12PQ208I, the -10PQ208I offers faster timing at same density and package, while the XC95288XL-10TQ144I trades I/O voltage flexibility for higher logic capacity in smaller footprint-critical for space-constrained motor control and medical imaging modules.
Availability
XCR3256XL-12PQ208I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and medical imaging systems requiring stable component supply and long-term obsolescence management.
Supply support for XCR3256XL-12PQ208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the CoolRunner-II CPLD family for industrial and aerospace applications.
The XCR3256XL series delivers low-power, non-volatile programmable logic optimized for deterministic control-plane functions in safety-critical and long-lifecycle systems.
FAQ
What is the maximum operating frequency supported by the XCR3256XL-12PQ208I?
The XCR3256XL-12PQ208I supports a maximum system clock frequency of 83 MHz, derived from its 12 ns propagation delay and internal timing architecture. This value is validated across temperature and voltage corners per AMD's XCR3256XL-12PQ208I datasheet revision 1.4. System-level timing must account for routing delays and macrocell feedback paths.
Does the XCR3256XL-12PQ208I require an external configuration PROM?
No, the XCR3256XL-12PQ208I contains on-chip EEPROM for non-volatile configuration storage and powers up fully operational without external PROM. Its configuration is retained indefinitely and supports unlimited reprogramming cycles via JTAG, making it ideal for field-upgradable industrial controllers.
Can the XCR3256XL-12PQ208I interface directly with 5 V logic devices?
Yes, the XCR3256XL-12PQ208I features 5 V tolerant I/O pins when VCCIO is set to 3.3 V, allowing direct connection to standard TTL and CMOS 5 V peripherals without external level shifters. This capability is specified in the Absolute Maximum Ratings table of the official AMD datasheet.
What JTAG standards does the XCR3256XL-12PQ208I comply with?
The XCR3256XL-12PQ208I complies with IEEE Std. 1149.1-1990 (JTAG) for boundary-scan testing and in-system programming. It supports TAP controller states, instruction register loading, and data register access as defined in the standard, enabling interoperability with industry-standard debug and programming tools.
Is the XCR3256XL-12PQ208I qualified for extended temperature operation?
Yes, the XCR3256XL-12PQ208I is rated for operation from –40 °C to +85 °C (industrial grade), with full electrical specifications guaranteed across this range. This qualification is documented in AMD's XCR3256XL-12PQ208I Product Data Sheet and supports deployment in harsh environments such as factory-floor PLCs and outdoor medical equipment enclosures.
XCR3256XL-12PQ208I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 10.8 ns
- Voltage Supply - Internal:
- 2.7V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 164
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PQFP (28x28)
XCR3256XL-12PQ208I FAQ
1.How can I place an order for XCR3256XL-12PQ208I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-12PQ208I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-12PQ208I reliable?
The price and inventory of XCR3256XL-12PQ208I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-12PQ208I is usually 5 days.
3.What payment methods are accepted for XCR3256XL-12PQ208I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-12PQ208I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-12PQ208I?
XCR3256XL-12PQ208I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-12PQ208I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-12PQ208I?
For technical support, including XCR3256XL-12PQ208I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-12PQ208I requirements.
6.How does Aetrix verify that XCR3256XL-12PQ208I is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-12PQ208I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-12PQ208I meets industry standards.
7.What is the process for return or replacement of XCR3256XL-12PQ208I?
All XCR3256XL-12PQ208I units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-12PQ208I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-12PQ208I part is unused and in its original packaging.
Return procedure for XCR3256XL-12PQ208I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-12PQ208I Tags

-
5M40ZE64C5N
Intel

-
ATF1502ASV-15AU44
Microchip Technology

-
5M80ZE64C5N
Intel

-
5M80ZT100C5N
Intel

-
ATF1502AS-10AU44
Microchip Technology

-
ATF1502AS-10JU44
Microchip Technology

-
5M80ZE64I5N
Intel

-
5M80ZT100I5N
Intel
-
LC4032V-75TN48C
Lattice Semiconductor Corporation

-
ATF1504ASV-15AU44
Microchip Technology

-
ATF1504AS-10JU44
Microchip Technology

-
5M160ZE64C5N
Intel
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

