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AMD XCR3256XL-12PQG208I
- Part No.:
- XCR3256XL-12PQG208I
- Manufacturer:
- AMD
- Package:
- 208-BFQFP
- Datasheet:
-
XCR3256XL-12PQG208I.pdf
- Description:
- IC CPLD 256MC 10.8NS 208QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,440
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Product details
Overview
XCR3256XL-12PQG208I from AMD (acquired Xilinx) is a 3.3 V, 12 ns propagation delay CPLD with 256 macrocells, 208-pin PQFP package, and in-system programmable (ISP) capability via JTAG; used in legacy industrial control logic replacement and FPGA configuration glue logic.
For engineers reviewing the XCR3256XL-12PQG208I datasheet, pinout, applications, or equivalent options, key selection criteria include propagation delay, macrocell count, ISP voltage compliance, I/O bank flexibility, and EOL status awareness for long-life designs.
Technical Context
This device belongs to the XCR3000XL family of high-performance, low-voltage CPLDs built on 0.35 µm CMOS technology. It integrates three function blocks interconnected by a low-skew global routing switch matrix, supporting up to 128 product terms per macrocell and configurable buried registers with synchronous or asynchronous reset.
The architecture supports mixed-voltage I/O operation across four banks, with each bank independently configurable for 3.3 V LVTTL/LVCMOS levels. Internal logic operates at 3.3 V, and the JTAG port complies with IEEE 1149.1 for boundary-scan testing and programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocells | 256 - provides combinational and registered logic capacity for medium-complexity glue logic functions |
| Propagation Delay (tPD) | 12 ns - ensures timing closure in 33 MHz control-path applications |
| Supply Voltage (VCC) | 3.3 V ± 0.3 V - requires stable low-noise 3.3 V rail; not 5 V tolerant |
| I/O Pins | 172 user I/Os - supports wide bus interfacing and multi-bank voltage translation |
| Package | 208-pin PQFP (28 × 28 mm, 0.5 mm pitch) - standard footprint compatible with legacy reflow profiles |
| Programming | In-system programmable via IEEE 1149.1 JTAG - enables field updates without socket removal |
Pinout & Package
208-pin Plastic Quad Flat Pack (PQFP), 28 mm × 28 mm body, 0.5 mm lead pitch, JEDEC MO-137AC compliant. Pin 1 marked by corner notch; power/ground pins distributed across all four sides for noise reduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1, 12, 23, ..., 208) | Ground reference | Multiple dedicated ground pins reduce simultaneous switching noise and improve signal integrity |
| VCC (Pins 2, 11, 22, ..., 207) | Core & I/O supply | Separate VCC pins per quadrant support localized decoupling and thermal distribution |
| TCK/TMS/TDI/TDO | JTAG interface | Enable boundary-scan test and in-system programming without external hardware programmers |
| I/O[0..171] | Configurable bidirectional I/O | Each supports Schmitt-trigger input, slew-rate control, and programmable pull-up resistors |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 0.35 µm CMOS process | Reduces static current to < 100 µA at standby, critical for battery-backed systems |
| 12 ns pin-to-pin delay | Enables reliable operation in 33 MHz synchronous control loops without added wait states |
| Four independent I/O banks | Allows interfacing with mixed-voltage peripherals (e.g., 3.3 V logic + 2.5 V memory) without level shifters |
| IEEE 1149.1 JTAG support | Permits system-level debugging, chain testing, and firmware update during production and field service |
| Programmable macrocell registers | Supports both rising- and falling-edge clocking with async preset/clear - simplifies state machine implementation |
Applications
| Industrial PLC Backplane Logic | Legacy FPGA Configuration Manager |
|---|---|
Use Scenario: Replacing discrete TTL logic in programmable logic controller backplanes for I/O expansion and bus arbitration. IC Role / Device Role / Timing Role: Glue logic CPLD implementing address decoding, handshake synchronization, and interrupt prioritization. Use Value: Reduces board space by >70% vs. discrete SSI/MSI chips while maintaining deterministic 12 ns timing behavior. | Use Scenario: Managing bitstream loading sequence and CRC verification for Spartan-II FPGAs in aerospace avionics subsystems. IC Role / Device Role / Timing Role: Configuration controller with JTAG-initiated serial boot and watchdog-timed fallback recovery. Use Value: Eliminates external microcontroller dependency and guarantees sub-100 ms FPGA reconfiguration under brownout conditions. |
| Telecom Line Card Control | Medical Imaging Data Mux |
Use Scenario: Implementing HDLC framing, alarm masking, and LED status sequencing on legacy T1/E1 line interface cards. IC Role / Device Role / Timing Role: Protocol-aware control engine with embedded state machines and parallel I/O scanning. Use Value: Supports real-time 2.048 Mbps data path monitoring with zero software overhead via hardware state transitions. | Use Scenario: Multiplexing analog sensor outputs from CT detector arrays into ADC pipelines with channel calibration offset correction. IC Role / Device Role / Timing Role: Precision timing sequencer and digital offset compensation block synchronized to 10 MHz system clock. Use Value: Achieves < ±0.5 LSB gain error across 64-channel paths using on-chip register-based trim values. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based glue logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-10PQ208C | 10 ns tPD, commercial temperature grade (0–70°C), same macrocell count and pinout | Suitable for non-industrial environments where tighter timing margin is required | Select when design operates within commercial temp range and needs 2 ns faster propagation |
| XC95288XL-10TQ144I | 288 macrocells, 144-pin TQFP, 10 ns tPD, different pinout and I/O count | Higher logic density but fewer I/Os; requires PCB redesign | Choose only if additional macrocells are needed and board revision is feasible |
Compared with XCR3256XL-12PQG208I, the XCR3256XL-10PQ208C offers faster timing at same density and package, while XC95288XL-10TQ144I trades I/O count for macrocell scalability - neither is pin-compatible, requiring layout review for migration.
Availability
XCR3256XL-12PQG208I is available at Aetrix Electronics and suitable for industrial control, medical imaging subsystems, and telecom line card replacements requiring stable component supply and long-term obsolescence management.
Supply support for XCR3256XL-12PQG208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, integrating its programmable logic portfolio including legacy CoolRunner CPLD families. AMD is a global semiconductor leader focused on adaptive computing solutions.
The XCR3256XL series was designed specifically for low-power, high-reliability glue logic in mission-critical industrial and telecom infrastructure where long-lifecycle support and deterministic timing are mandatory.
FAQ
What is the maximum operating frequency supported by XCR3256XL-12PQG208I?
The XCR3256XL-12PQG208I supports a maximum system clock frequency of 83 MHz, derived from its 12 ns propagation delay and internal register-to-register timing path. This value assumes optimal placement, minimal routing delay, and proper setup/hold margins. The actual achievable frequency depends on design topology and I/O loading, but the device is routinely deployed in 33 MHz control planes and 50 MHz data mux applications.
Is XCR3256XL-12PQG208I still in active production?
No - XCR3256XL-12PQG208I is discontinued by AMD (formerly Xilinx) and classified as a mature, last-time-buy (LTB) product. Aetrix Electronics maintains verified legacy stock with full traceability and offers extended lifecycle support, including obsolescence forecasting and cross-reference assistance for migration planning.
Does XCR3256XL-12PQG208I support in-system programming via SPI or I²C?
No - XCR3256XL-12PQG208I supports in-system programming exclusively through the IEEE 1149.1 JTAG interface (TCK/TMS/TDI/TDO). It does not include native SPI or I²C programming controllers. External microcontrollers may emulate JTAG sequences, but official programming requires a JTAG-compliant tool such as AMD Vivado or legacy Xilinx IMPACT.
Can XCR3256XL-12PQG208I operate with 2.5 V I/O signaling?
No - XCR3256XL-12PQG208I I/O banks are rated only for 3.3 V LVTTL/LVCMOS signaling. While the inputs are 5 V tolerant in some earlier CoolRunner variants, the XL series specifies absolute maximum input voltage of 3.6 V. Interfacing with 2.5 V systems requires external level-shifting circuitry or careful voltage translation design.
What software tools are required to program XCR3256XL-12PQG208I?
XCR3256XL-12PQG208I is programmed using AMD Vivado Design Suite (legacy support mode) or the discontinued Xilinx ISE WebPACK v14.7. The device uses Jedec-standard .jed files generated from ABEL or VHDL source. Programming requires a JTAG cable (e.g., Digilent HS3 or Xilinx Platform Cable USB II) and a compatible boundary-scan controller.
XCR3256XL-12PQG208I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 10.8 ns
- Voltage Supply - Internal:
- 2.7V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 164
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PQFP (28x28)
XCR3256XL-12PQG208I FAQ
1.How can I place an order for XCR3256XL-12PQG208I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-12PQG208I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-12PQG208I reliable?
The price and inventory of XCR3256XL-12PQG208I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-12PQG208I is usually 5 days.
3.What payment methods are accepted for XCR3256XL-12PQG208I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-12PQG208I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-12PQG208I?
XCR3256XL-12PQG208I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-12PQG208I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-12PQG208I?
For technical support, including XCR3256XL-12PQG208I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-12PQG208I requirements.
6.How does Aetrix verify that XCR3256XL-12PQG208I is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-12PQG208I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-12PQG208I meets industry standards.
7.What is the process for return or replacement of XCR3256XL-12PQG208I?
All XCR3256XL-12PQG208I units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-12PQG208I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-12PQG208I part is unused and in its original packaging.
Return procedure for XCR3256XL-12PQG208I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-12PQG208I Tags
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5M40ZE64C5N
Intel
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ATF1502ASV-15AU44
Microchip Technology
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Intel
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5M80ZT100C5N
Intel
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ATF1502AS-10AU44
Microchip Technology
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ATF1502AS-10JU44
Microchip Technology
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5M80ZE64I5N
Intel
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5M80ZT100I5N
Intel
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LC4032V-75TN48C
Lattice Semiconductor Corporation
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ATF1504ASV-15AU44
Microchip Technology
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ATF1504AS-10JU44
Microchip Technology
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Intel
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