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AMD XCR3256XL-12TQG144C
- Part No.:
- XCR3256XL-12TQG144C
- Manufacturer:
- AMD
- Package:
- 144-LQFP
- Datasheet:
-
XCR3256XL-12TQG144C.pdf
- Description:
- IC CPLD 256MC 10.8NS 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:13,064
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Product details
Overview
XCR3256XL-12TQG144C from AMD (acquired by Xilinx) is a 3.3 V CMOS CPLD with 256 macrocells, 144-pin TQFP package, 12 ns propagation delay, and in-system programmability via JTAG. It serves as a glue logic replacement in industrial control I/O expansion modules.
For engineers reviewing the XCR3256XL-12TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include propagation delay, macrocell count, I/O pin count, JTAG programmability, and 3.3 V supply compatibility for legacy board upgrades.
Technical Context
This device belongs to the XCR3200XL family of high-performance, low-voltage CPLDs built on 0.35 µm CMOS technology. It features a fully registered architecture with up to 256 macrocells, each containing a product-term-based logic block, D-type flip-flop, and configurable output enable.
The architecture supports both combinational and registered logic paths, with dedicated global clock, output enable, and set/reset signals. All I/O pins are 3.3 V tolerant and support LVTTL/LVCMOS interface standards with programmable slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Macrocells | 256 - provides sufficient logic density for medium-complexity glue logic functions like bus arbitration and state machine control |
| Propagation Delay | 12 ns - ensures timing compliance in 33 MHz PCI-compatible peripheral interfaces |
| Supply Voltage | 3.3 V ±0.3 V - compatible with modern low-voltage digital systems and legacy 3.3 V backplanes |
| I/O Pins | 118 user I/O - supports parallel bus interfacing with microcontrollers and FPGAs without external level-shifting |
| Package | TQFP-144 - 20 × 20 mm footprint with 0.5 mm pitch, suitable for automated SMT assembly and thermal management |
| Programming Interface | JTAG IEEE 1149.1 - enables in-circuit reprogramming and boundary-scan testing without removing the device |
Pinout & Package
Package: 144-lead Thin Quad Flat Package (TQFP), 20 mm × 20 mm, 0.5 mm lead pitch, exposed pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TDI, TDO, TMS, TCK | JTAG Test Access Port | Enables IEEE 1149.1 boundary-scan testing and in-system programming without dedicated programming hardware |
| IO/GCLK0–IO/GCLK3 | Global Clock Inputs | Four dedicated low-skew clock inputs drive all macrocells synchronously for deterministic timing |
| IO/OE[0–3] | Global Output Enable | Configurable per I/O bank to control tristate behavior across groups of pins during bus sharing |
| VCCIO (Pins 1, 72, 73, 144) | I/O Power Supply | Separate 3.3 V supply for I/O banks allows mixed-voltage operation when interfacing with 5 V or 2.5 V peripherals |
| GND (Pins 4, 76, 77, 140) | Ground Reference | Four dedicated ground pins minimize switching noise and ensure stable reference for 118 I/O signals |
Key Features
| Feature | Design Value |
|---|---|
| In-system programmability (ISP) | Enables field firmware updates and logic revisions without device removal or socketing, reducing maintenance downtime |
| 12 ns pin-to-pin delay | Meets setup/hold timing for 33 MHz PCI Local Bus and similar synchronous peripheral interfaces |
| 118 user I/O with slew-rate control | Reduces EMI in dense PCB layouts by limiting edge rates on high-speed control signals |
| Four global clocks and four global OE lines | Supports independent clock domains and dynamic bus contention management in multi-controller systems |
| 3.3 V core and I/O operation | Eliminates need for level translators when interfacing with modern microcontrollers and FPGAs |
Applications
| Industrial PLC I/O Expansion | Legacy System Bus Interface |
|---|---|
Use Scenario: Adding isolated digital input/output channels to programmable logic controllers using existing 3.3 V backplane infrastructure. IC Role / Device Role / Timing Role: Glue logic controller managing address decoding, strobe generation, and interrupt prioritization between CPU and I/O modules. Use Value: Replaces discrete TTL logic with single-chip solution, reducing BOM count and improving signal integrity at 12 ns timing margins. | Use Scenario: Bridging legacy 8-bit microcontroller peripherals (e.g., UART, SPI, GPIO expanders) to newer 32-bit host processors. IC Role / Device Role / Timing Role: Protocol translator and bus arbiter handling voltage-level alignment, handshaking, and timing synchronization. Use Value: Enables drop-in upgrade path for aging embedded systems without redesigning PCB layout or power delivery. |
| Automated Test Equipment (ATE) Control Logic | Medical Device Signal Conditioning |
Use Scenario: Generating precise timing waveforms and managing relay/multiplexer sequencing in benchtop test instruments. IC Role / Device Role / Timing Role: Deterministic state machine controller with sub-12 ns timing resolution for synchronized stimulus/response cycles. Use Value: Guarantees repeatable measurement accuracy by eliminating combinatorial path variability in critical trigger paths. | Use Scenario: Isolating and conditioning analog sensor signals (e.g., ECG, temperature) before ADC sampling in portable diagnostic equipment. IC Role / Device Role / Timing Role: Digital control unit managing multiplexer selection, gain switching, and ADC start pulses with jitter-free timing. Use Value: Maintains clinical-grade signal fidelity by minimizing digital switching noise coupling into sensitive analog front-ends. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based glue logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-10TQG144C | 10 ns propagation delay, otherwise identical architecture and pinout | Better suited for 40 MHz+ synchronous interfaces requiring tighter timing margins | Select when system clock frequency exceeds 33 MHz and setup/hold slack is marginal with 12 ns delay |
| XC95288XL-10TQG144C | 288 macrocells, same 12 ns speed grade, but larger die size and higher static current | Preferred for designs requiring >256 macrocells while retaining same package and JTAG flow | Choose when logic density demand exceeds 256 macrocells but TQFP-144 footprint must be retained |
Compared with XCR3256XL-12TQG144C, the -10 speed grade offers faster timing at identical power and packaging, while the XC95288XL variant trades higher static current for greater logic capacity-both require no PCB changes but differ in timing closure and resource utilization trade-offs.
Availability
XCR3256XL-12TQG144C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply over extended production lifecycles.
Supply support for XCR3256XL-12TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, integrating its FPGA and CPLD portfolio into the Adaptive and Embedded Computing Group. Xilinx originally developed this device as part of its mature, high-reliability CPLD family.
The XCR3200XL family was designed for long-lifecycle industrial and aerospace applications where in-system programmability, predictable timing, and 3.3 V compatibility are essential for maintaining legacy system functionality.
FAQ
What is the maximum operating frequency supported by the XCR3256XL-12TQG144C?
The XCR3256XL-12TQG144C supports a maximum system clock frequency of 83 MHz, derived from its 12 ns propagation delay and internal timing architecture. This value is validated in Xilinx's DS017 datasheet under worst-case commercial temperature and voltage conditions. The actual achievable frequency depends on logic depth and routing; typical designs achieve 66–75 MHz in register-to-register paths. XCR3256XL-12TQG144C does not specify a guaranteed maximum frequency for asynchronous paths.
Does the XCR3256XL-12TQG144C support hot-swap or live-insertion?
No, the XCR3256XL-12TQG144C does not support hot-swap operation. Its I/O structure lacks bus-hold or weak pull-up circuitry required for safe insertion into powered backplanes. Power sequencing must follow VCCIO before VCCCore, and all I/O signals must be inactive during power-up. XCR3256XL-12TQG144C requires full power-down before board replacement in live systems.
Can the XCR3256XL-12TQG144C be programmed using third-party JTAG tools?
Yes, the XCR3256XL-12TQG144C is fully compliant with IEEE 1149.1 JTAG and supports programming and boundary-scan testing with standard third-party tools such as J-Link, XJTAG, and ScanWorks. XCR3256XL-12TQG144C requires SVF or STAPL file formats; Xilinx IMPACT software remains the reference tool for configuration bitstream generation and verification.
What is the I/O voltage tolerance of the XCR3256XL-12TQG144C?
The XCR3256XL-12TQG144C I/O pins are rated for 3.3 V operation with absolute maximum input voltage of 4.05 V, making them tolerant of brief 5 V overshoots but not continuous 5 V signaling. Input thresholds are LVTTL-compatible (VIL ≤ 0.8 V, VIH ≥ 2.0 V). XCR3256XL-12TQG144C does not support 5 V-tolerant mode or mixed-voltage I/O banks beyond its specified 3.3 V VCCIO range.
Is the XCR3256XL-12TQG144C RoHS compliant and halogen-free?
Yes, the XCR3256XL-12TQG144C is RoHS 6/6 compliant and halogen-free per Xilinx specification document DS017 Revision 12. It meets JEDEC J-STD-609A Class 1 for bromine and chlorine content (<900 ppm) and is qualified for lead-free reflow soldering up to 260 °C peak temperature. XCR3256XL-12TQG144C carries the "Pb-Free" marking on the top-side laser etch.
XCR3256XL-12TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 10.8 ns
- Voltage Supply - Internal:
- 3V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 120
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 144-TQFP (20x20)
XCR3256XL-12TQG144C FAQ
1.How can I place an order for XCR3256XL-12TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-12TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-12TQG144C reliable?
The price and inventory of XCR3256XL-12TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-12TQG144C is usually 5 days.
3.What payment methods are accepted for XCR3256XL-12TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-12TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-12TQG144C?
XCR3256XL-12TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-12TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-12TQG144C?
For technical support, including XCR3256XL-12TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-12TQG144C requirements.
6.How does Aetrix verify that XCR3256XL-12TQG144C is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-12TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-12TQG144C meets industry standards.
7.What is the process for return or replacement of XCR3256XL-12TQG144C?
All XCR3256XL-12TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-12TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-12TQG144C part is unused and in its original packaging.
Return procedure for XCR3256XL-12TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-12TQG144C Tags
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5M40ZE64C5N
Intel
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ATF1502ASV-15AU44
Microchip Technology
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5M80ZE64C5N
Intel
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5M80ZT100C5N
Intel
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ATF1502AS-10AU44
Microchip Technology
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ATF1502AS-10JU44
Microchip Technology
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5M80ZE64I5N
Intel
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5M80ZT100I5N
Intel
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LC4032V-75TN48C
Lattice Semiconductor Corporation
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ATF1504ASV-15AU44
Microchip Technology
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ATF1504AS-10JU44
Microchip Technology
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5M160ZE64C5N
Intel
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