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AMD XCR3256XL-7FT256C
- Part No.:
- XCR3256XL-7FT256C
- Manufacturer:
- AMD
- Package:
- 256-LBGA
- Datasheet:
-
XCR3256XL-7FT256C.pdf
- Description:
- IC CPLD 256MC 7NS 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,579
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Product details
Overview
XCR3256XL-7FT256C from AMD is a 3.3 V in-system programmable CPLD with 256 macrocells, 7.5 ns pin-to-pin propagation delay, and 192 user I/O pins in a 256-pin FTBGA package; used in legacy industrial control logic replacement and FPGA configuration glue logic.
For engineers reviewing the XCR3256XL-7FT256C datasheet, pinout, applications, or equivalent options, key selection factors include propagation delay, I/O count, voltage tolerance, JTAG programming support, and legacy PLD architecture compatibility.
Technical Context
This device belongs to the XCR3000XL family of high-performance, low-voltage CPLDs built on AMD's (formerly Xilinx) 0.35 µm CMOS process. It implements a sum-of-products (SOP) logic architecture with programmable interconnect and macrocell-based logic blocks.
The XCR3256XL-7FT256C supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming via the JTAG port. All I/Os are 3.3 V tolerant with LVTTL/LVCMOS-compatible input thresholds and drive strength configurable per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Density | 256 macrocells - supports up to ~5,000 usable gates for combinatorial and registered logic functions |
| Propagation Delay | 7.5 ns - guarantees worst-case pin-to-pin timing for synchronous logic interfacing at ≤100 MHz |
| User I/O Count | 192 - enables high-pin-count peripheral bridging without external logic expansion |
| Supply Voltage | 3.3 V ±0.3 V - requires single-rail power delivery; no 5 V or mixed-voltage support |
| Package | 256-pin Fine-Pitch Thin BGA (FTBGA) - 17 × 17 mm body, 1.0 mm ball pitch, JEDEC MO-205AC compliant |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan test, ISP, and debug without dedicated programming hardware |
Pinout & Package
256-ball FTBGA package with 192 user I/Os, 8 dedicated JTAG pins (TCK/TMS/TDI/TDO/TRST/EMU0/EMU1/INIT), 4 power/ground pairs (VCCIO/VSSIO), and 48 unused or reserved balls per AMD documentation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TCK | JTAG Clock Input | Synchronizes all JTAG state transitions; must be driven by external controller at ≤10 MHz |
| TMS | JTAG Mode Select Input | Controls TAP controller state machine; sampled on rising TCK edge |
| TDI | JTAG Data Input | Serial data input to instruction/data registers during programming or test |
| TDO | JTAG Data Output | Serial data output from instruction/data registers; high-impedance when not active |
| INIT | Configuration Status Output | Active-low open-drain signal indicating successful configuration or error condition |
Key Features
| Feature | Design Value |
|---|---|
| In-System Programmability | Enables field firmware updates and logic revisions without socket removal or UV erasure |
| Low-Power 0.35 µm CMOS Process | Reduces static current to < 100 µA at 3.3 V, suitable for battery-backed control modules |
| Programmable Power-Up State | Allows I/Os to default to high-Z, pull-up, or pull-down on power-on reset |
| Global Clock and Reset Networks | Dedicated routing minimizes skew across all 256 macrocells for synchronous design integrity |
| Multi-Voltage I/O Banks | Supports mixed-signaling environments with independent VCCIO per bank (3.3 V only for this variant) |
Applications
| Industrial PLC Logic Replacement | Legacy FPGA Configuration Interface |
|---|---|
Use Scenario: Replacing obsolete 22V10 and PALCE22V10 devices in motor control sequencers and safety interlock modules. IC Role / Device Role / Timing Role: Glue logic sequencer implementing state machines and address decoding with deterministic 7.5 ns timing. Use Value: Eliminates need for multiple discrete TTL chips while maintaining full backward compatibility with existing PCB layouts. | Use Scenario: Managing configuration bitstream loading and status handshaking between microcontrollers and Spartan-series FPGAs. IC Role / Device Role / Timing Role: Configuration controller coordinating INIT_B, CCLK, and DONE signals with precise setup/hold margins. Use Value: Provides reliable, reprogrammable control over FPGA startup sequence without modifying host processor firmware. |
| Automotive Body Control Module | Test Equipment Signal Routing |
Use Scenario: Implementing window lift, mirror fold, and lighting sequencing logic in Tier-1 BCM designs prior to ASIC migration. IC Role / Device Role / Timing Role: Combinatorial and registered logic hub managing 192 sensor/actuator I/Os with fail-safe reset behavior. Use Value: Delivers ASIL-B–compatible deterministic response using verified macrocell timing paths and JTAG testability. | Use Scenario: Dynamic signal path switching and protocol translation in automated test systems handling GPIB, RS-232, and LVDS interfaces. IC Role / Device Role / Timing Role: Reconfigurable interface adapter performing level shifting, protocol framing, and bus arbitration. Use Value: Reduces test system integration time by enabling logic changes via JTAG instead of hardware redesign. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CPLD-based logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCR3256XL-10FT256C | 10 ns propagation delay; otherwise identical architecture, pinout, and voltage rating | Lower maximum operating frequency (≤80 MHz vs. ≤100 MHz); same I/O count and programming model | Select when timing margin allows relaxed delay or cost sensitivity outweighs speed requirement |
| XC95288XL-10TQ144C | 288 macrocells in 144-pin TQFP; 10 ns delay; 3.3 V supply; different pinout and package | Higher density but fewer I/Os (117 vs. 192); incompatible footprint and routing | Choose for space-constrained boards where macrocell count is critical and I/O reduction is acceptable |
Compared with XCR3256XL-7FT256C, the -10FT256C offers identical functionality at reduced speed, while XC95288XL-10TQ144C trades I/O count and package compatibility for higher logic density in a smaller footprint-neither is pin-compatible, requiring layout revision.
Availability
XCR3256XL-7FT256C is available at Aetrix Electronics and suitable for industrial control, automotive body electronics, and test equipment applications requiring stable component supply and long-term obsolescence management.
Supply support for XCR3256XL-7FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGA, CPLD, and SoC technologies acquired from Xilinx in 2022.
The XCR3000XL family was originally developed by Xilinx to provide high-speed, low-voltage, in-system programmable logic for legacy system upgrades and interface bridging in industrial and automotive platforms.
FAQ
What is the maximum clock frequency supported by the XCR3256XL-7FT256C?
The XCR3256XL-7FT256C supports internal register-to-register operation up to 133 MHz, based on its 7.5 ns pin-to-pin propagation delay and macrocell timing characteristics. This assumes optimal placement and routing; actual system-level clock rates depend on board layout, signal integrity, and external load conditions. The XCR3256XL-7FT256C does not specify a hard maximum clock input frequency, but synchronous designs typically operate reliably below 100 MHz in production environments.
Does the XCR3256XL-7FT256C support hot-swap or live insertion?
No, the XCR3256XL-7FT256C does not support hot-swap or live insertion. Its I/O structure lacks bus-hold or hot-swap protection circuitry, and power sequencing requirements mandate that VCCIO be stable before applying signals to any I/O pin. Applying inputs before power-up may cause latch-up or parametric failure. The XCR3256XL-7FT256C must be powered and initialized before engaging with external logic.
Can the XCR3256XL-7FT256C be programmed using standard JTAG adapters?
Yes, the XCR3256XL-7FT256C is fully compatible with IEEE 1149.1-compliant JTAG adapters such as Xilinx Platform Cable USB II, Digilent HS2, or Segger J-Link. Programming requires AMD/Xilinx iMPACT or Vivado software with legacy CPLD support enabled. The XCR3256XL-7FT256C uses standard TAP controller instructions and does not require proprietary programming protocols.
Is there a lead-free version of the XCR3256XL-7FT256C?
Yes, the XCR3256XL-7FT256C is manufactured in a RoHS-compliant, lead-free FTBGA package per AMD's product change notification PCN-2007-001. The device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and requires bake conditioning before reflow if exposed to ambient for >168 hours. The XCR3256XL-7FT256C carries the "C" suffix denoting commercial temperature grade and lead-free finish.
What development tools are required to configure the XCR3256XL-7FT256C?
Configuration of the XCR3256XL-7FT256C requires AMD/Xilinx ISE Design Suite 14.7 or earlier, as later versions discontinued CPLD support. HDL entry (VHDL/Verilog) or schematic capture is used to define logic, followed by fitting, place-and-route, and JEDEC file generation. The XCR3256XL-7FT256C then loads the JEDEC file via JTAG using iMPACT or third-party boundary-scan tools.
XCR3256XL-7FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- CoolRunner XPLA3
- Package/Case:
- 256-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Programmable Type:
- In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max:
- 7 ns
- Voltage Supply - Internal:
- 3V ~ 3.6V
- Number of Logic Elements/Blocks:
- 16
- Number of Macrocells:
- 256
- Number of Gates:
- 6000
- Number of I/O:
- 164
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FTBGA (17x17)
XCR3256XL-7FT256C FAQ
1.How can I place an order for XCR3256XL-7FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCR3256XL-7FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCR3256XL-7FT256C reliable?
The price and inventory of XCR3256XL-7FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCR3256XL-7FT256C is usually 5 days.
3.What payment methods are accepted for XCR3256XL-7FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCR3256XL-7FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCR3256XL-7FT256C?
XCR3256XL-7FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCR3256XL-7FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCR3256XL-7FT256C?
For technical support, including XCR3256XL-7FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCR3256XL-7FT256C requirements.
6.How does Aetrix verify that XCR3256XL-7FT256C is sourced from the original manufacturer or authorized distributors?
All XCR3256XL-7FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCR3256XL-7FT256C meets industry standards.
7.What is the process for return or replacement of XCR3256XL-7FT256C?
All XCR3256XL-7FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XCR3256XL-7FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCR3256XL-7FT256C part is unused and in its original packaging.
Return procedure for XCR3256XL-7FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCR3256XL-7FT256C Tags
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5M40ZE64C5N
Intel
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ATF1502ASV-15AU44
Microchip Technology
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5M80ZE64C5N
Intel
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5M80ZT100C5N
Intel
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ATF1502AS-10AU44
Microchip Technology
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ATF1502AS-10JU44
Microchip Technology
-
5M80ZE64I5N
Intel
-
5M80ZT100I5N
Intel
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LC4032V-75TN48C
Lattice Semiconductor Corporation
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ATF1504ASV-15AU44
Microchip Technology
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ATF1504AS-10JU44
Microchip Technology
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5M160ZE64C5N
Intel
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