AMD XCR3256XL-7FTG256C

Overview

XCR3256XL-7FTG256C from AMD (acquired by Xilinx) is a 3.3 V in-system programmable CPLD featuring 256 macrocells, 5.5 ns pin-to-pin propagation delay, and 192 user I/O pins in a 256-pin FTBGA package; used in legacy industrial control logic replacement and FPGA configuration glue logic.

For engineers reviewing the XCR3256XL-7FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include propagation delay, I/O count, voltage tolerance, JTAG programming support, and legacy device migration path compatibility.

Technical Context

This device belongs to the XCR3200XL family of high-performance, low-voltage CPLDs built on 0.35 µm CMOS technology. It implements registered and combinatorial logic using sum-of-products architecture with up to 96 product terms per macrocell and global/local clocking resources.

The XCR3256XL-7FTG256C supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming via dedicated ISP pins. Its I/Os are configurable for LVTTL/LVCMOS 3.3 V operation with programmable slew rate and pull-up resistors.

Key Specifications

Pinout & Package

256-pin Fine-Pitch Thin BGA (FTBGA), 1.0 mm pitch, 17 × 17 array, bottom-side solder balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar CPLD-based glue logic applications.

Compared with XCR3256XL-7FTG256C, the -10FTG256C trades speed for cost in identical packaging, while the XCR3128XL-7TQ144C reduces logic scale and changes package-both require timing or layout reassessment but maintain same family toolchain and ISP flow.

Availability

XCR3256XL-7FTG256C is available at Aetrix Electronics and suitable for industrial control, FPGA configuration management, and legacy system emulation requiring stable component supply and long-term lifecycle support.

Supply support for XCR3256XL-7FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022, inheriting its legacy CPLD portfolio including the CoolRunner-II family. Xilinx originally designed these devices for low-power, high-reliability programmable logic applications.

The XCR3256XL-7FTG256C belongs to the CoolRunner-II XL series, engineered for in-system programmable logic replacement in space- and power-constrained industrial and communications systems.

FAQ

What is the maximum operating frequency of the XCR3256XL-7FTG256C?

The XCR3256XL-7FTG256C supports a maximum system clock frequency of 182 MHz, derived from its 5.5 ns pin-to-pin propagation delay and internal timing characteristics. This value applies to registered logic paths under worst-case conditions (VCC = 3.0 V, TA = +70 °C). The actual achievable frequency depends on design topology, routing, and loading. XCR3256XL-7FTG256C does not specify a single global fMAX; users must perform static timing analysis using Xilinx ISE tools for their specific implementation.

Does the XCR3256XL-7FTG256C support JTAG boundary-scan testing?

Yes, the XCR3256XL-7FTG256C fully complies with IEEE 1149.1 JTAG boundary-scan standards. It provides dedicated TCK, TMS, TDI, and TDO pins for test access port functionality. This enables in-circuit testing, device identification, and ISP without requiring additional programming hardware beyond a standard JTAG adapter. The boundary-scan chain integrates all 192 user I/Os and internal logic resources for comprehensive visibility into XCR3256XL-7FTG256C operation.

Can the XCR3256XL-7FTG256C replace older PAL or GAL devices?

Yes, the XCR3256XL-7FTG256C is widely used as a functional and timing-compatible replacement for obsolete 22V10, 16V8, and GAL22V10 devices in legacy systems. Its 5.5 ns propagation delay matches or exceeds many original bipolar PALs, and its 192 I/Os allow consolidation of multiple discrete devices. Migration requires logic re-synthesis using Xilinx ISE WebPACK, but no PCB changes are needed if the FTBGA footprint is accommodated or adapted via adapter.

What programming software is required for the XCR3256XL-7FTG256C?

The XCR3256XL-7FTG256C is programmed using Xilinx ISE Design Suite (versions 14.7 and earlier), which includes ABEL, VHDL, and Verilog synthesis support along with place-and-route for CoolRunner-II devices. Programming files are generated as JEDEC (.jed) or BITSTREAM (.bit) formats. XCR3256XL-7FTG256C does not support Vivado; continued toolchain access is maintained through archived ISE installations and third-party JEDEC programmers compatible with IEEE 1149.1.

Is the XCR3256XL-7FTG256C RoHS compliant?

Yes, the XCR3256XL-7FTG256C is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC JS-021D MSL-3 moisture sensitivity requirements. The FTBGA package uses lead-free solder balls and halogen-free molding compound. Documentation confirming compliance is available in Xilinx's Product Change Notification (PCN) #050315-01 and subsequent revisions applicable to the -7 speed grade and FTG256 package variant.