AMD XCS30-3PQ208C

Overview

XCS30-3PQ208C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 30,000 system gates, 216 I/O pins, and configured in a 208-pin PQFP package; it supports 3.3V/2.5V I/O, operates at -3 speed grade (4.9 ns CLB delay), and is used in industrial control logic and legacy communication interface bridging.

For engineers reviewing the XCS30-3PQ208C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, CLB count, timing grade compliance, and PQFP thermal profile suitability for cost-sensitive reflow assembly.

Technical Context

The XCS30-3PQ208C implements configurable logic blocks (CLBs) with dual 4-input LUTs and flip-flops per slice, supporting synchronous design with global clock routing and up to 12 dedicated clock inputs. It integrates SelectRAM+ memory blocks (18 kbits total) and DLL-based clock management for input deskew and frequency synthesis.

Configuration is performed via master serial mode using external PROM or JTAG boundary-scan; configuration bitstream is loaded into SRAM-based logic cells, requiring external nonvolatile storage for power-on initialization. The device lacks on-chip flash or configuration memory.

Key Specifications

Pinout & Package

208-pin Plastic Quad Flat Pack (PQFP), 28 × 28 mm body, 0.5 mm lead pitch, JEDEC MS-026AC compliant. Thermal resistance θ_JA ≈ 45°C/W (standard PCB, 2 oz copper).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and interface bridging applications.

Compared with XCS30-3PQ208C, the -4 variant improves worst-case timing margin by ~14% without layout change, while the XCS25-3PQ208C reduces gate count and dynamic power but constrains logic partitioning flexibility.

Availability

XCS30-3PQ208C is available at Aetrix Electronics and suitable for industrial control logic, legacy bus bridging, and medical signal conditioning requiring stable component supply across long-lifecycle programs.

Supply support for XCS30-3PQ208C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through the Xilinx merger in 2022.

The Spartan-3 family was designed for cost-optimized, high-volume applications requiring reliable programmable logic with predictable timing and broad I/O voltage support.

FAQ

What is the maximum operating frequency supported by the XCS30-3PQ208C?

The XCS30-3PQ208C has a -3 speed grade specifying 4.9 ns CLB propagation delay. Maximum system clock frequency depends on design topology, but typical synchronous logic paths achieve 120–150 MHz. The on-chip DCM supports input clock multiplication up to 200 MHz for internal domains, though actual achievable frequency is constrained by routing delay and I/O timing.

Does the XCS30-3PQ208C include embedded block RAM?

No, the XCS30-3PQ208C does not contain dedicated block RAM. It provides 18 kbits of SelectRAM+ - distributed RAM built from CLB flip-flops and LUTs - usable as small dual-port RAM, ROM, or shift registers. For larger memory requirements, external SRAM or PSRAM must be interfaced via its 216 I/O pins.

Can the XCS30-3PQ208C be configured via JTAG only, without external PROM?

Yes, the XCS30-3PQ208C supports JTAG boundary-scan configuration directly through TDI/TDO pins. This enables in-system programming and debugging without external configuration PROM, though SRAM-based configuration is volatile and requires re-loading after each power cycle.

What are the power supply requirements for the XCS30-3PQ208C?

The XCS30-3PQ208C requires two separate supplies: 1.2V ±5% for the core logic (VCCINT) and 3.3V or 2.5V for I/O banks (VCCO). Each of the eight I/O banks may be independently powered, enabling mixed-voltage interface operation. Decoupling capacitors must be placed near each VCCINT and VCCO pin per Xilinx Spartan-3 PCB layout guidelines.

Is the XCS30-3PQ208C RoHS compliant?

Yes, the XCS30-3PQ208C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU. The PQFP package uses matte tin lead finish, and the device conforms to IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), requiring bake prior to reflow if exposed beyond floor life.