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AMD XCS30-3PQ208I
- Part No.:
- XCS30-3PQ208I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 208-BFQFP
- Datasheet:
-
XCS30-3PQ208I.pdf
- Description:
- IC FPGA 169 I/O 208QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,161
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Product details
Overview
XCS30-3PQ208I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 30,000 system gates, 1728 logic cells, and 176 I/O pins in a 208-pin PQFP package; it supports 3.3V/2.5V I/O, operates at -3 speed grade (4.9 ns CLB delay), and is used in industrial control logic and legacy communication interface bridging.
For engineers reviewing the XCS30-3PQ208I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage compatibility, CLB count for logic density, PQFP thermal profile, and -3 speed grade timing closure in cost-sensitive embedded systems.
Technical Context
The XCS30-3PQ208I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic for arithmetic functions. It features SelectIO technology supporting LVTTL, LVCMOS, and PCI I/O standards with programmable slew rate and drive strength.
Configuration is performed via serial PROM or master parallel mode using an external CPU or microcontroller. The device lacks on-chip configuration memory and requires external bitstream loading at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 CLBs - defines maximum combinational and sequential logic capacity |
| System Gates | 30,000 - gate-equivalent metric for logic density estimation |
| I/O Pins | 176 user-programmable I/Os - supports multi-bus interfacing with bank-wise voltage assignment |
| Speed Grade | -3 - guarantees 4.9 ns CLB propagation delay under worst-case conditions |
| Package | PQ208 - 208-pin plastic quad flat pack, 28 × 28 mm, 0.5 mm pitch, JEDEC MS-026 |
| I/O Standards | LVTTL/LVCMOS/PCI - enables direct connection to legacy microcontrollers and peripheral ICs |
Pinout & Package
Package: PQ208 (Plastic Quad Flat Pack, 208-pin, 0.5 mm pitch, 28 mm × 28 mm body, JEDEC MO-137AC).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK3 | Global Clock Input | Dedicated low-skew clock routing to all CLBs and I/Os |
| M0–M2 | Mode Configuration Pins | Set startup configuration mode (e.g., Master Parallel, Slave Serial) |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating successful bitstream load |
| CCLK | Configuration Clock Input | Drives internal configuration shift register during PROM or CPU loading |
| DIN | Serial Data Input | Accepts configuration bitstream in slave serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Configurable I/O Standards per Bank | Enables mixed-voltage operation (e.g., 3.3V CPU interface + 2.5V memory bus) without level shifters |
| Distributed RAM Blocks | Each CLB provides 16-bit dual-port RAM - eliminates need for external SRAM in small FIFO or register-file designs |
| Carry Chain Logic | Fast ripple-carry path across CLBs - improves adder/subtractor timing by up to 35% vs. general logic |
| Programmable Slew Rate Control | Reduces EMI and signal integrity issues on high-speed I/O traces without external termination |
Applications
| Industrial PLC Logic | Legacy Bus Bridge |
|---|---|
Use Scenario: Replacing fixed-function PAL/GAL logic in aging programmable logic controllers with field-upgradable control state machines. IC Role / Device Role / Timing Role: Configurable logic fabric implementing scan-based I/O processing, timer sequencing, and safety interlock logic. Use Value: Enables firmware-level updates to ladder logic behavior without hardware redesign or board re-spin. | Use Scenario: Interfacing ISA-bus peripherals to modern microcontroller subsystems in test equipment and data acquisition systems. IC Role / Device Role / Timing Role: Protocol translator and timing adapter handling ISA address/data strobes, interrupt arbitration, and wait-state insertion. Use Value: Preserves investment in legacy sensor modules while enabling migration to ARM-based host controllers. |
| Video Signal Formatter | Communications Protocol Engine |
Use Scenario: Converting parallel RGB video streams to serialized formats (e.g., BT.656) in broadcast monitoring hardware. IC Role / Device Role / Timing Role: Pixel-clock-synchronized shift register, sync generator, and line buffer controller. Use Value: Achieves sub-pixel timing alignment without external FIFOs or clock domain crossing ICs. | Use Scenario: Implementing HDLC or SDLC framing, CRC-16 generation, and flag detection in point-of-sale terminal modems. IC Role / Device Role / Timing Role: Bit-level protocol processor offloading UART and CPU resources. Use Value: Reduces host CPU interrupt load by >70% during sustained serial data transfer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS30-4PQ208C | Faster -4 speed grade (4.2 ns CLB delay); commercial temperature range (0°C to 70°C) | Suitable for non-industrial environments where higher timing margin is required | Select when design requires guaranteed setup/hold timing at 50 MHz+ system clocks |
| XCS30-3TQ144I | Same -3 speed grade but TQFP-144 package (144 pins, smaller footprint, lower I/O count) | Better fit for space-constrained PCBs with ≤120 I/O requirements | Choose when board area is critical and I/O reduction is acceptable |
Compared with XCS30-4PQ208C and XCS30-3TQ144I, the XCS30-3PQ208I offers the optimal balance of industrial temperature support, I/O count, and package thermal dissipation for legacy system upgrades where cost and reliability outweigh peak frequency needs.
Availability
XCS30-3PQ208I is available at Aetrix Electronics and suitable for industrial automation, legacy communications infrastructure, and video signal processing applications requiring stable component supply over extended product lifecycles.
Supply support for XCS30-3PQ208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now manages the Spartan family as part of its adaptive computing portfolio.
The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring moderate logic density, flexible I/O, and long-term availability - especially in industrial and communications markets.
FAQ
What is the operating temperature range for the XCS30-3PQ208I?
The XCS30-3PQ208I is rated for industrial temperature operation from –40°C to +85°C. This range ensures reliable functionality in factory-floor PLCs, outdoor telecom cabinets, and other harsh-environment applications where ambient temperatures exceed commercial-grade limits. The PQ208 package's thermal characteristics support sustained operation within this range without derating.
Does the XCS30-3PQ208I include on-chip configuration memory?
No, the XCS30-3PQ208I does not contain on-chip configuration memory. It relies on external serial PROM or parallel flash devices to store and load the configuration bitstream at power-up. This architecture allows field updates but requires careful design of the configuration interface and power sequencing to ensure INIT_B assertion and CCLK synchronization.
Can the XCS30-3PQ208I support 3.3V and 2.5V I/O simultaneously?
Yes, the XCS30-3PQ208I supports mixed I/O voltages through bank-wise VCCO assignment. Each I/O bank has independent VCCO pins, allowing one bank to operate at 3.3V while another runs at 2.5V. This capability eliminates external level shifters when interfacing with heterogeneous peripheral families, such as 3.3V microcontrollers and 2.5V DDR memory interfaces.
What configuration modes are supported by the XCS30-3PQ208I?
The XCS30-3PQ208I supports Master Parallel, Slave Parallel, Slave Serial, and JTAG boundary-scan configuration modes. Mode selection is controlled by M2:M0 pins at power-up. JTAG is primarily used for debugging and programming during development, while Master Parallel is common in production systems with microcontroller-based bootloaders.
Is the XCS30-3PQ208I still in active production?
The XCS30-3PQ208I is no longer in active production by AMD/Xilinx but remains available through authorized legacy component distributors and Aetrix Electronics' long-term inventory program. Lifecycle documentation confirms last-time-buy dates have passed, and Aetrix provides traceable, tested stock with full lot traceability and extended warranty coverage.
XCS30-3PQ208I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 576
- Number of Logic Elements/Cells:
- 1368
- Total RAM Bits:
- 18432
- Number of I/O:
- 169
- Number of Gates:
- 30000
- Voltage - Supply:
- 4.5V ~ 5.5V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 208-PQFP (28x28)
XCS30-3PQ208I FAQ
1.How can I place an order for XCS30-3PQ208I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS30-3PQ208I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS30-3PQ208I reliable?
The price and inventory of XCS30-3PQ208I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS30-3PQ208I is usually 5 days.
3.What payment methods are accepted for XCS30-3PQ208I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS30-3PQ208I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS30-3PQ208I?
XCS30-3PQ208I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS30-3PQ208I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS30-3PQ208I?
For technical support, including XCS30-3PQ208I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS30-3PQ208I requirements.
6.How does Aetrix verify that XCS30-3PQ208I is sourced from the original manufacturer or authorized distributors?
All XCS30-3PQ208I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS30-3PQ208I meets industry standards.
7.What is the process for return or replacement of XCS30-3PQ208I?
All XCS30-3PQ208I units undergo pre-shipment inspection (PSI). If there is an issue with XCS30-3PQ208I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS30-3PQ208I part is unused and in its original packaging.
Return procedure for XCS30-3PQ208I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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