AMD XCS30-3PQ240C

Overview

XCS30-3PQ240C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 30,000 system gates, 1728 logic cells, and 176 I/O pins in a 240-pin PQFP package. It operates at -3 speed grade (5 ns CLB delay), supports 3.3 V I/O, and includes embedded block RAM and DLLs for clock management. Used in industrial control logic and legacy communication interface bridging.

For engineers reviewing the XCS30-3PQ240C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, PQFP thermal profile, DLL-based clock deskew capability, and -3 speed grade timing compliance for deterministic state-machine implementations.

Technical Context

The XCS30-3PQ240C implements a configurable logic fabric based on SRAM-programmable CLBs, each containing two 4-input LUTs and flip-flops. It integrates eight 18-kbit block RAMs (total 144 kbits), four Digital Clock Managers (DCMs) for phase alignment and frequency synthesis, and SelectIO™ technology supporting LVCMOS, LVTTL, and PCI I/O standards.

Configuration is performed via master serial mode using external PROM or JTAG boundary-scan. The device requires external configuration memory and supports IEEE 1149.1 JTAG for programming and debugging. Power supply requirements are 1.2 V core (VCCINT) and 3.3 V I/O (VCCO).

Key Specifications

Pinout & Package

240-pin PQFP (Plastic Quad Flat Pack), 28 mm × 28 mm body, 0.5 mm lead pitch, standard JEDEC MO-118AC footprint. Thermal pad not present; thermal dissipation relies on PCB copper area and airflow.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Compared with XCS30-3PQ240C, the -4 variant offers improved timing margin without changing logic or I/O allocation, while the XCS25-3PQ208C reduces cost and board space at the expense of gate count and I/O flexibility - both require separate timing analysis and pin assignment verification.

Availability

XCS30-3PQ240C is available at Aetrix Electronics and suitable for industrial automation, legacy system refurbishment, and medical device timing subsystems requiring stable component supply across extended product lifecycles.

Supply support for XCS30-3PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022, inheriting its FPGA portfolio including the Spartan family. AMD focuses on adaptive computing solutions for data center, AI, and embedded markets.

The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring moderate logic density and robust I/O flexibility - especially in industrial control, video interface, and communications infrastructure.

FAQ

What is the configuration method supported by the XCS30-3PQ240C?

The XCS30-3PQ240C supports master serial configuration via external PROM and IEEE 1149.1 JTAG boundary-scan. It does not support slave parallel or selectMAP modes. Configuration bitstream is loaded into on-chip SRAM, requiring reprogramming at power-up unless paired with nonvolatile PROM. The XCS30-3PQ240C PROGRAM_B pin initiates this process and must be asserted low to reset configuration logic before loading.

Does the XCS30-3PQ240C support 2.5 V or 1.8 V I/O standards?

Yes, the XCS30-3PQ240C supports 2.5 V and 1.8 V I/O standards through its SelectIO™ technology, but only when corresponding VCCO banks are supplied at those voltages. Each I/O bank has independent VCCO pins; mixing 3.3 V, 2.5 V, and 1.8 V standards across different banks is permitted. The XCS30-3PQ240C datasheet specifies DC characteristics and timing parameters separately for each supported standard.

How many Digital Clock Managers (DCMs) are integrated in the XCS30-3PQ240C?

The XCS30-3PQ240C integrates four Digital Clock Managers (DCMs), each capable of input clock multiplication, division, phase shifting, and duty-cycle correction. These DCMs operate independently and can drive separate clock networks. Their use is mandatory for achieving zero-hold-time operation and managing clock skew in high-speed synchronous designs implemented on the XCS30-3PQ240C.

What is the maximum operating junction temperature for the XCS30-3PQ240C?

The XCS30-3PQ240C has a maximum operating junction temperature of +100 °C, specified for commercial-grade (-3C) devices. This rating assumes proper PCB thermal design with adequate copper pour and airflow. Exceeding this temperature risks configuration loss and accelerated wear-out of SRAM cells. Thermal calculations for the XCS30-3PQ240C must account for both core (1.2 V) and I/O (3.3 V) power dissipation under worst-case logic utilization.

Is the XCS30-3PQ240C pin-compatible with other Spartan-3 devices in the PQ240 package?

The XCS30-3PQ240C shares the same 240-pin PQFP footprint with other Spartan-3 devices in the PQ240 package, including XCS40-3PQ240C and XCS50-3PQ240C. However, pin functions differ across densities due to varying internal resource mapping - particularly for dedicated clock inputs, global enable lines, and configuration pins. Direct substitution without netlist and constraint file revision is not supported for the XCS30-3PQ240C.