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AMD XCS30-3TQ144C
- Part No.:
- XCS30-3TQ144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XCS30-3TQ144C.pdf
- Description:
- IC FPGA 113 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,906
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Product details
Overview
XCS30-3TQ144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 30,000 system gates, 144-pin TQFP package, 2.5 V core voltage, and -3 speed grade. It integrates configurable logic blocks, block RAM, and DLL-based clock management for embedded control and interface bridging in industrial I/O modules.
For engineers reviewing the XCS30-3TQ144C datasheet, pinout, applications, or equivalent options, key selection criteria include system gate count, I/O count (118 user I/Os), DLL support for input deskew, and availability of commercial temperature grade (-40°C to +85°C).
Technical Context
The XCS30-3TQ144C implements a hierarchical FPGA architecture with CLBs containing four 3-input LUTs and flip-flops, distributed RAM, and dedicated carry logic. It supports LVCMOS25/LVCMOS33 I/O standards and includes two Digital Clock Managers (DCMs) for phase alignment and frequency synthesis.
Configuration is performed via serial mode using an external PROM or master parallel mode. The device requires external configuration memory and does not integrate on-chip flash. Configuration bitstream loading occurs at power-up through dedicated pins (INIT_B, PROGRAM_B, DONE).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 30,000 system gates - defines maximum combinational logic density for control path implementation |
| User I/O Pins | 118 - supports multi-protocol interface bridging without external glue logic |
| Core Voltage | 2.5 V ± 0.1 V - mandates dedicated 2.5 V regulator and decoupling near VCCINT pins |
| Speed Grade | -3 - guarantees timing closure up to 280 MHz for internal CLB paths |
| Operating Temperature | 0°C to +70°C (Commercial) - validated for non-extended ambient environments |
| Package | TQFP-144, 20×20 mm, 0.5 mm pitch - compatible with standard reflow profiles and optical inspection |
Pinout & Package
144-pin Thin Quad Flat Pack (TQFP) with exposed thermal pad (non-electrical). Pin functions include CONFIG_IO (configuration I/O), D_IN (serial data input), PROGRAM_B (active-low configuration reset), INIT_B (configuration status), DONE (configuration completion), and dual DCM inputs/outputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-low configuration reset | Asserting low forces reload of configuration bitstream from external PROM |
| INIT_B | Configuration initialization status | Open-drain output indicating PROM readiness or configuration error state |
| DONE | Configuration completion indicator | Drives high when bitstream loading and CRC verification succeed |
| D_IN | Serial configuration data input | Accepts LSB-first bitstream during master serial configuration mode |
| CLK0–CLK2 | DCM clock inputs/outputs | Support phase-aligned clock distribution for synchronous I/O interfaces |
Key Features
| Feature | Design Value |
|---|---|
| Dual Digital Clock Managers (DCMs) | Enable zero-delay buffering, frequency synthesis (×2, ÷2), and 90° phase shift for precise timing control |
| 118 User I/Os with SelectIO™ | Support mixed-voltage operation (1.5 V to 3.3 V) and programmable slew rate for EMI reduction |
| Block RAM | 72 Kbits total - usable as dual-port FIFOs or small lookup tables without external memory |
| Configurable Logic Blocks (CLBs) | Each contains four 3-LUTs + flip-flops - optimized for fast arithmetic and state-machine logic |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O channels to programmable logic controllers using RS-485 or CAN physical layer. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing controller between microcontroller and field-side I/O drivers. Use Value: Enables deterministic response under 10 µs using DCM-synchronized sampling clocks and on-chip register staging. | Use Scenario: Bridging ISA or PCI bus signals to modern microcontroller peripherals in test equipment upgrades. IC Role / Device Role / Timing Role: Implements address decoding, handshaking, and data-width conversion logic with cycle-accurate timing. Use Value: Eliminates discrete glue logic; 118 I/Os accommodate full 16-bit data + 24-bit address + control lines in single device. |
| Motor Control Encoder Interface | Medical Sensor Signal Preprocessing |
Use Scenario: Capturing quadrature encoder signals from servo motors while filtering noise and computing position deltas. IC Role / Device Role / Timing Role: FPGA performs real-time edge detection, debounce, and counter accumulation synchronized to motor PWM cycles. Use Value: DCM-derived 2× oversampling clock ensures sub-degree angular resolution without CPU intervention. | Use Scenario: Conditioning analog sensor outputs (ECG, pulse oximetry) before ADC digitization in portable diagnostic devices. IC Role / Device Role / Timing Role: Implements digital filtering (FIR), gain scaling, and sample-rate conversion prior to microcontroller ingestion. Use Value: On-chip block RAM stores filter coefficients; CLBs execute 16-tap FIR in one clock cycle at 10 MSPS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS30-4TQ144C | Faster -4 speed grade; same gate count, package, and I/O count | Suitable where setup/hold margins are marginal at 280 MHz | Select when timing closure fails with -3 grade and board layout cannot be revised |
| XCS25-3TQ144C | Lower 25K gate count; identical package, voltage, and DCM features | Applicable for simpler control logic with ≤90 I/Os required | Choose when design fits within reduced logic capacity to lower BOM cost |
Compared with XCS30-3TQ144C, the XCS30-4TQ144C offers tighter timing margins without changing PCB layout, while the XCS25-3TQ144C reduces logic resources and cost for less complex implementations - both retain identical pinout and configuration methodology.
Availability
XCS30-3TQ144C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and medical device OEMs requiring stable component supply across long-lifecycle programs.
Supply support for XCS30-3TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product support for industrial and aerospace customers.
The Spartan-3 family was designed for cost-sensitive, high-volume embedded control and interface bridging applications requiring predictable timing and mature process reliability.
FAQ
What is the configuration method supported by XCS30-3TQ144C?
XCS30-3TQ144C supports master serial, slave serial, and master parallel configuration modes. It requires external configuration PROM (e.g., XCF02S) and uses dedicated pins including PROGRAM_B, INIT_B, and DONE. The device does not support JTAG-only configuration or internal flash, so external memory is mandatory for power-on initialization of XCS30-3TQ144C.
Does XCS30-3TQ144C support hot-swap I/O operation?
No, XCS30-3TQ144C does not support hot-swap I/O. Its I/O banks require VCCO to be stable before applying signal voltages, and no I/O pin is rated for live insertion. Safe power sequencing - VCCINT first, then VCCO, then signals - must be enforced to prevent latch-up or damage to XCS30-3TQ144C.
What clocking resources are integrated into XCS30-3TQ144C?
XCS30-3TQ144C integrates two Digital Clock Managers (DCMs), each supporting input jitter filtering, frequency synthesis (×2, ÷2, ×1.5), 90°/180° phase shifts, and zero-delay buffering. These DCMs drive internal logic and I/O timing, enabling precise synchronization for XCS30-3TQ144C-based encoder interfaces and high-speed data capture.
Can XCS30-3TQ144C operate at 3.3 V I/O voltage?
Yes, XCS30-3TQ144C supports 3.3 V I/O operation in LVCMOS33 mode when VCCO = 3.3 V. Each I/O bank is independently powered, allowing mixed-voltage operation across banks. However, core voltage remains fixed at 2.5 V, and all I/O standards must comply with Spartan-3 DC and switching specifications for XCS30-3TQ144C.
Is there a pin-compatible replacement for XCS30-3TQ144C with higher logic density?
No direct pin-compatible higher-density replacement exists within the Spartan-3 family. XCS40-3TQ144C is not offered in TQFP-144; higher-density alternatives like Spartan-3E use different packages and pinouts. Migration to XCS30-3TQ144C's successor families requires PCB redesign, as no drop-in upgrade path is available for XCS30-3TQ144C.
XCS30-3TQ144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 576
- Number of Logic Elements/Cells:
- 1368
- Total RAM Bits:
- 18432
- Number of I/O:
- 113
- Number of Gates:
- 30000
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XCS30-3TQ144C FAQ
1.How can I place an order for XCS30-3TQ144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS30-3TQ144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS30-3TQ144C reliable?
The price and inventory of XCS30-3TQ144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS30-3TQ144C is usually 5 days.
3.What payment methods are accepted for XCS30-3TQ144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS30-3TQ144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS30-3TQ144C?
XCS30-3TQ144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS30-3TQ144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS30-3TQ144C?
For technical support, including XCS30-3TQ144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS30-3TQ144C requirements.
6.How does Aetrix verify that XCS30-3TQ144C is sourced from the original manufacturer or authorized distributors?
All XCS30-3TQ144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS30-3TQ144C meets industry standards.
7.What is the process for return or replacement of XCS30-3TQ144C?
All XCS30-3TQ144C units undergo pre-shipment inspection (PSI). If there is an issue with XCS30-3TQ144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS30-3TQ144C part is unused and in its original packaging.
Return procedure for XCS30-3TQ144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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