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AMD XCS30-4BG256C
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- Part No.:
- XCS30-4BG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCS30-4BG256C.pdf
- Description:
- IC FPGA 192 I/O 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,172
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Product details
Overview
XCS30-4BG256C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 30,000 system gates, 216 I/O pins, and configured in a 256-pin BGA package (body size 17×17 mm, pitch 1.0 mm). It operates at -4 speed grade (tPD = 4.5 ns), supports 3.3 V/2.5 V I/O, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XCS30-4BG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade timing closure, voltage compatibility with legacy peripherals, and availability of migration paths within the Spartan-3 family.
Technical Context
The XCS30-4BG256C implements configurable logic blocks (CLBs) with dual 4-input LUTs and flip-flops per slice, distributed RAM up to 72 Kbits, and eighteen 18×18 multipliers. It supports SelectIO standards including LVTTL, LVCMOS, PCI, and HSTL Class I.
Configuration is performed via master serial mode using external PROM or microprocessor-controlled slave parallel mode. Internal global clock networks distribute up to four dedicated clock signals with low skew across the device fabric.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Gates | 30,000 system gates - defines maximum combinational logic capacity for gate-equivalent design mapping |
| I/O Pins | 216 user-configurable I/Os - supports high-pin-count peripheral interfacing without external glue logic |
| Speed Grade | -4 (tPD = 4.5 ns) - guarantees maximum propagation delay for critical path timing closure at 125 MHz system clock |
| I/O Voltage | 3.3 V / 2.5 V compatible - enables direct connection to legacy microcontrollers and memory interfaces |
| Package | 256-pin FBGA (17×17 mm, 1.0 mm pitch) - requires standard BGA reflow profile and 8-mil trace/space PCB routing |
| Configuration Mode | Master Serial or Slave Parallel - determines boot source architecture and initialization sequence flexibility |
Pinout & Package
256-pin Fine-Pitch Ball Grid Array (FBGA) package, 17×17 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 0.1 µF ceramic capacitor near ball |
| A2 | IO_L0N_0 | Differential input pair negative - used for LVDS or RSDS signaling when enabled in bank 0 |
| B2 | IO_L0P_0 | Differential input pair positive - paired with A2 for matched-length routing and common-mode rejection |
| P1 | CCLK | Configuration clock output - drives external PROM during master serial configuration |
| T1 | DONE | Configuration status indicator - goes high after successful bitstream loading and internal startup sequence |
| R2 | INIT_B | Configuration initialization - active-low open-drain signal indicating PROM readiness or error state |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multipliers | Eighteen 18×18 signed/unsigned multipliers - enable real-time FIR filtering and motor control loop computation |
| Distributed RAM | Up to 72 Kbits distributed across CLBs - provides low-latency register files and small FIFOs without block RAM overhead |
| SelectIO Standards | LVTTL, LVCMOS, PCI, HSTL Class I - eliminates level-shifter ICs when interfacing with industrial PLCs and instrumentation buses |
| Global Clock Networks | Four low-skew dedicated clock trees - ensures synchronous timing across large logic partitions without manual clock tree synthesis |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O modules to programmable logic controllers with fieldbus connectivity. IC Role / Device Role / Timing Role: FPGA logic fabric implements custom I/O timing, isolation control, and Modbus RTU protocol framing. Use Value: 216 I/O pins allow integration of 96-channel discrete I/O with on-chip protocol handling, reducing external ASIC count. | Use Scenario: Bridging ISA or PC/104 bus peripherals to modern microcontroller-based systems. IC Role / Device Role / Timing Role: Glue logic implementing address decoding, wait-state insertion, and burst transfer arbitration. Use Value: -4 speed grade ensures sub-5 ns setup/hold timing compliance with 8-MHz ISA bus cycles. |
| Automotive Diagnostic Tool Interface | Test Equipment Pattern Generator |
Use Scenario: Enabling J1850 PWM and VPW communication in handheld OBD-II scan tools. IC Role / Device Role / Timing Role: Real-time waveform generation and protocol decoding engine synchronized to vehicle bus clocks. Use Value: Configurable I/O banks support mixed-voltage signaling (5 V tolerant inputs + 3.3 V outputs) required by legacy automotive protocols. | Use Scenario: Generating deterministic stimulus patterns for semiconductor functional test fixtures. IC Role / Device Role / Timing Role: High-speed pattern sequencer with precise cycle-accurate timing control and trigger synchronization. Use Value: 4.5 ns tPD enables reliable 125 MHz pattern rates with static timing analysis verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS30-5BG256C | Faster -5 speed grade (tPD = 3.8 ns); otherwise identical logic resources and I/O count | Suitable for higher-frequency clock domains or tighter timing margins | Select when system clock exceeds 125 MHz or when timing closure fails at -4 grade |
| XCS30-4PQ208C | Same -4 speed grade and logic capacity but 208-pin PQFP package (28×28 mm, 0.5 mm pitch) | Preferred for prototyping or low-volume assembly where BGA rework is impractical | Choose for hand-soldered evaluation or legacy PCB footprint compatibility |
Compared with XCS30-4BG256C, the -5 variant offers improved timing margin at identical density, while the PQ208 version trades BGA density for through-hole assembly feasibility-neither is pin-compatible, requiring board redesign for substitution.
Availability
XCS30-4BG256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and test equipment applications requiring stable component supply across extended product lifecycles.
Supply support for XCS30-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA portfolio for cost-sensitive, high-volume embedded applications.
The Spartan-3 family was designed specifically for non-volatile, low-power logic replacement in industrial control, communications infrastructure, and automotive subsystems.
FAQ
What is the maximum operating frequency supported by XCS30-4BG256C?
The XCS30-4BG256C supports a maximum system clock frequency of 125 MHz under worst-case conditions, based on its -4 speed grade (tPD = 4.5 ns) and verified timing closure across all logic paths in typical designs. Actual achievable frequency depends on design complexity, placement, and routing. The XCS30-4BG256C datasheet specifies this limit in the DC and switching characteristics tables.
Does XCS30-4BG256C support JTAG boundary-scan testing?
Yes, XCS30-4BG256C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, configuration, and debug. Pins TCK, TMS, TDI, and TDO are dedicated to this function and operate independently of user I/O banks. This capability is documented in the XCS30-4BG256C configuration and testing guide.
What configuration memory options are compatible with XCS30-4BG256C?
XCS30-4BG256C supports master serial configuration using industry-standard 4-Mbit or 8-Mbit SPI PROMs (e.g., XCF04S or XCF08S), as well as slave parallel mode driven by microprocessors. Configuration data is loaded into SRAM cells on power-up, making the XCS30-4BG256C volatile-external non-volatile memory is required for autonomous boot.
Can XCS30-4BG256C operate with mixed I/O voltages on different banks?
Yes, XCS30-4BG256C supports independent VCCO supply per I/O bank, enabling simultaneous operation at 3.3 V, 2.5 V, or 1.8 V levels across different banks. Each bank's voltage is set by its dedicated VCCO pin, and the XCS30-4BG256C specification defines allowable combinations and noise immunity limits per bank.
Is thermal management required for XCS30-4BG256C in continuous operation?
XCS30-4BG256C typically dissipates less than 1.2 W under full utilization at 85°C ambient, and its 17×17 mm FBGA package includes an exposed thermal pad. While not mandatory, adding a 4-layer PCB with internal ground/power planes and localized thermal vias beneath the XCS30-4BG256C improves reliability in enclosed industrial enclosures.
XCS30-4BG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 576
- Number of Logic Elements/Cells:
- 1368
- Total RAM Bits:
- 18432
- Number of I/O:
- 192
- Number of Gates:
- 30000
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCS30-4BG256C FAQ
1.How can I place an order for XCS30-4BG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS30-4BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS30-4BG256C reliable?
The price and inventory of XCS30-4BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS30-4BG256C is usually 5 days.
3.What payment methods are accepted for XCS30-4BG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS30-4BG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS30-4BG256C?
XCS30-4BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS30-4BG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS30-4BG256C?
For technical support, including XCS30-4BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS30-4BG256C requirements.
6.How does Aetrix verify that XCS30-4BG256C is sourced from the original manufacturer or authorized distributors?
All XCS30-4BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS30-4BG256C meets industry standards.
7.What is the process for return or replacement of XCS30-4BG256C?
All XCS30-4BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS30-4BG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS30-4BG256C part is unused and in its original packaging.
Return procedure for XCS30-4BG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCS30-4BG256C Tags
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