My Inquiry
My Account
AMD XCS30-4PQ240C
- Part No.:
- XCS30-4PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCS30-4PQ240C.pdf
- Description:
- IC FPGA 192 I/O 240QFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,139
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCS30-4PQ240C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 30,000 system gates, 1728 logic cells, 176 I/O pins, and configured in a 240-pin PQFP package; it targets low-cost, high-volume embedded control and interface bridging applications requiring deterministic timing and reconfigurable logic.
For engineers reviewing the XCS30-4PQ240C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic density, TQFP/PQFP package compatibility, supply voltage tolerance (3.3 V ±10%), and JTAG boundary-scan support for production testability.
Technical Context
This device implements a fully static, SRAM-based architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic for arithmetic functions. It supports IEEE 1149.1 JTAG boundary-scan and includes SelectIO™ technology for single-ended and differential signaling.
The XCS30-4PQ240C operates at -4 speed grade (tPD = 4.5 ns CLB-to-CLB), uses 3.3 V core and I/O supply, and requires external configuration PROM or master serial mode via microcontroller. No internal oscillator or PLL is integrated.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 - provides combinational and sequential logic capacity for medium-complexity state machines and glue logic. |
| System Gates | 30,000 - indicates total equivalent gate count for logic synthesis estimation and resource planning. |
| I/O Pins | 176 - supports wide parallel interfaces, multi-channel sensor aggregation, or bus bridging without external expansion. |
| Package | PQFP-240 - 24 mm × 24 mm body, 0.5 mm pitch, surface-mount compatible with standard reflow profiles. |
| Speed Grade | -4 - guarantees maximum 4.5 ns CLB-to-CLB propagation delay under worst-case conditions (3.3 V, 85°C). |
| VCCINT/VCCO | 3.3 V ±10% - requires single regulated supply; I/O banks support LVTTL/LVCMOS33 standards only. |
Pinout & Package
PQFP-240 package with 240 leads arranged in quad flat pack configuration; lead finish is matte tin, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins ensure low-impedance return paths for digital and I/O domains. |
| VCCINT | Core power supply | Supplies 3.3 V to internal logic; decoupling required within 10 mm of each pin. |
| VCCO | I/O power supply | Provides 3.3 V to output drivers; bank-specific, enabling mixed-voltage I/O when partitioned. |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables in-system programming, debug access, and production-level structural testing. |
| PROGRAM_B | Configuration reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs and flip-flops, enabling efficient implementation of synchronous logic and registered outputs. |
| Distributed RAM | Up to 72 Kbits of fast, dual-port RAM per device - usable as FIFO buffers or small lookup tables without block RAM overhead. |
| SelectIO™ Technology | Supports LVTTL and LVCMOS33 I/O standards with programmable drive strength (2–24 mA) and slew rate control. |
| Boundary-Scan (IEEE 1149.1) | Integrated test access port enables PCB-level interconnect verification and in-circuit programming without dedicated test fixtures. |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Adapter |
|---|---|
Use Scenario: Replacing fixed-function ASICs in modular I/O subsystems for real-time digital input sampling and output pattern generation. IC Role / Device Role / Timing Role: Configurable logic fabric handles parallel bit-banging of 16–32 channel status registers and pulse-width modulated outputs with sub-microsecond jitter. Use Value: Enables field-upgradable I/O mapping and timing parameters without hardware redesign or firmware update to host controller. | Use Scenario: Bridging RS-232/RS-485 or ISA/PCI legacy peripherals to modern microcontroller buses in medical diagnostic equipment. IC Role / Device Role / Timing Role: Implements protocol translation, handshaking logic, and clock domain crossing between asynchronous legacy and synchronous host domains. Use Value: Eliminates need for multiple discrete glue logic ICs while maintaining deterministic latency under 200 ns for critical data acquisition cycles. |
| Automotive Body Control Unit | Test Equipment Signal Generator |
Use Scenario: Managing door lock actuation sequences, window lift control, and mirror position feedback in entry-level vehicle platforms. IC Role / Device Role / Timing Role: Executes safety-critical state machines with watchdog supervision and failsafe output enable/disable logic. Use Value: Provides ASIL-B–capable logic partitioning using external monitoring circuits and configurable fault response timing. | Use Scenario: Generating precise multi-channel digital stimulus waveforms (e.g., SPI, I²C, custom protocols) for DUT validation in ATE systems. IC Role / Device Role / Timing Role: Serves as deterministic waveform engine with synchronized edge placement across 16+ channels using internal routing constraints. Use Value: Delivers <±1 ns skew between adjacent outputs and supports user-defined pattern depth up to 4K words per channel. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS30-5PQ240C | Faster -5 speed grade (tPD = 3.8 ns); otherwise identical logic resources, I/O count, and package. | Suitable where tighter setup/hold margins or higher clock frequencies (>65 MHz system clock) are required. | Select XCS30-5PQ240C only if timing closure fails with -4 grade; no PCB or firmware changes needed. |
| XCS30-4PQ208C | Same speed grade and logic density but 208-pin PQFP package (140 I/O pins vs. 176). | Applicable in space-constrained designs accepting reduced I/O count; not suitable for full 176-pin interface implementations. | Choose XCS30-4PQ208C only when board layout cannot accommodate 240-pin footprint and I/O reduction is acceptable. |
Compared with XCS30-5PQ240C and XCS30-4PQ208C, the XCS30-4PQ240C balances cost, I/O availability, and timing margin for mid-range control and bridging tasks - making it optimal where pin count and thermal profile are prioritized over maximum frequency.
Availability
XCS30-4PQ240C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and automotive body electronics requiring stable component supply and long-term obsolescence management.
Supply support for XCS30-4PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.
The Spartan-3 family was designed for cost-sensitive, high-volume applications demanding reconfigurable logic with predictable timing and minimal power - especially in industrial control and communications infrastructure.
FAQ
What is the configuration method supported by XCS30-4PQ240C?
The XCS30-4PQ240C supports master serial, slave serial, and JTAG configuration modes. It requires an external configuration PROM (e.g., XCF02S) or microcontroller-driven bitstream loading. The XCS30-4PQ240C does not include on-chip flash or configuration memory, so persistent operation depends on external nonvolatile storage.
Does XCS30-4PQ240C support internal clock multiplication or phase alignment?
No, the XCS30-4PQ240C lacks integrated DLLs, PLLs, or digital clock managers. Clock conditioning must be performed externally using discrete oscillators, clock buffers, or companion clock ICs. This limitation applies specifically to the XCS30-4PQ240C and all members of the base Spartan-3 generation.
What is the maximum operating junction temperature for XCS30-4PQ240C?
The XCS30-4PQ240C is rated for commercial temperature range (0°C to +70°C ambient), with a maximum junction temperature of +100°C under specified thermal conditions. Thermal design must ensure θJA ≤ 35°C/W using appropriate PCB copper area and airflow, as defined in the XCS30-4PQ240C thermal characteristics table.
Can XCS30-4PQ240C be used with 2.5 V or 1.8 V I/O standards?
No, the XCS30-4PQ240C supports only 3.3 V I/O standards - specifically LVTTL and LVCMOS33. Its VCCO pins are internally tied to 3.3 V operation; interfacing with lower-voltage devices requires level-shifting circuitry. This constraint is fixed for the XCS30-4PQ240C and is not configurable via software or hardware settings.
Is JTAG boundary-scan functionality available on XCS30-4PQ240C?
Yes, the XCS30-4PQ240C implements full IEEE 1149.1 JTAG boundary-scan with TCK, TMS, TDI, and TDO pins. This allows in-system programming, debugging, and structural testing without requiring additional test access hardware - a confirmed capability documented in the XCS30-4PQ240C configuration and test guide.
XCS30-4PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 576
- Number of Logic Elements/Cells:
- 1368
- Total RAM Bits:
- 18432
- Number of I/O:
- 192
- Number of Gates:
- 30000
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCS30-4PQ240C FAQ
1.How can I place an order for XCS30-4PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS30-4PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS30-4PQ240C reliable?
The price and inventory of XCS30-4PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS30-4PQ240C is usually 5 days.
3.What payment methods are accepted for XCS30-4PQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS30-4PQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS30-4PQ240C?
XCS30-4PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS30-4PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS30-4PQ240C?
For technical support, including XCS30-4PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS30-4PQ240C requirements.
6.How does Aetrix verify that XCS30-4PQ240C is sourced from the original manufacturer or authorized distributors?
All XCS30-4PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS30-4PQ240C meets industry standards.
7.What is the process for return or replacement of XCS30-4PQ240C?
All XCS30-4PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCS30-4PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS30-4PQ240C part is unused and in its original packaging.
Return procedure for XCS30-4PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCS30-4PQ240C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
