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AMD XCS30XL-4BG256C
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- Part No.:
- XCS30XL-4BG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCS30XL-4BG256C.pdf
- Description:
- IC FPGA 192 I/O 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,583
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Product details
Overview
XCS30XL-4BG256C from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 30,000 system gates, 256-ball BGA package, -4 speed grade, and commercial temperature range (0°C to 70°C). It integrates configurable logic blocks, I/O banks supporting 3.3V LVTTL/LVCMOS, and dedicated carry logic for arithmetic functions - used in industrial control interface modules requiring reconfigurable logic and deterministic timing.
For engineers reviewing the XCS30XL-4BG256C datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, I/O voltage support, speed grade timing closure, and legacy design migration path from earlier Spartan devices.
Technical Context
The XCS30XL-4BG256C implements a fine-grained architecture with configurable logic blocks (CLBs), distributed RAM, and programmable interconnect. It supports up to 186 user I/Os across 12 banks, each configurable for 3.3V LVTTL or LVCMOS signaling with programmable slew rate and drive strength.
It features dedicated carry chains for fast arithmetic, global clock routing networks, and internal configuration memory loaded via JTAG or serial PROM. No on-chip oscillator or analog peripherals are integrated - configuration and clock sources are external.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 30,000 system gates - defines maximum combinational logic density for gate-equivalent implementation |
| Package | 256-ball BGA (17×17 mm, 1.27 mm pitch) - requires standard BGA reflow profile and PCB escape routing |
| Speed Grade | -4 - guarantees maximum clock frequency of 125 MHz for CLB-to-CLB paths under worst-case commercial conditions |
| I/O Count | 186 user I/Os - supports multi-protocol digital interfacing with bank-wise voltage assignment |
| Supply Voltage | 3.3V core & I/O - mandates single 3.3V rail with decoupling per bank and CLB region |
| Operating Temp | 0°C to +70°C - validated for commercial-grade industrial control and test equipment environments |
Pinout & Package
256-ball PBGA (Plastic Ball Grid Array), 17×17 array, 1.27 mm ball pitch, 2.0 mm body height. Package complies with JEDEC MO-152AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | 3.3V output supply for Bank 0 I/Os - must be decoupled locally |
| M1 | VCCINT | 3.3V core logic supply - shared across all CLBs and interconnect |
| T1 | GND | Ground reference for Bank 0 and adjacent routing - connects to internal ground plane |
| R2 | CLKA | Dedicated global clock input A - low-skew routing to all CLBs and I/O registers |
| P3 | TMS | JTAG Test Mode Select - controls TAP controller state transitions during configuration |
| N4 | TCK | JTAG Test Clock - synchronizes boundary-scan and configuration data |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Provide 4-input LUTs and flip-flops per slice - enable synchronous sequential logic with registered outputs |
| Dedicated Carry Chain | Supports ripple-carry adders up to 32 bits without consuming general routing - reduces critical path delay |
| Programmable I/O Standards | Per-bank 3.3V LVTTL/LVCMOS support with selectable drive strength (4/8/12/16 mA) and slew rate - enables mixed-voltage board interfaces |
| Global Clock Networks | Four low-skew clock trees - distribute clocks to >90% of registers with <150 ps skew across die |
| JTAG Boundary-Scan | IEEE 1149.1 compliant test access port - enables in-system programming and interconnect verification |
Applications
| Industrial PLC I/O Module | Legacy Test Equipment Controller |
|---|---|
Use Scenario: Replacing fixed ASICs in programmable logic controllers for sensor input aggregation and relay output sequencing. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom state machines and parallel I/O handling with sub-microsecond response latency. Use Value: Enables field-upgradable control logic without hardware redesign - supports multiple OEM variants from single PCB layout. | Use Scenario: Embedded controller in aging automated test equipment requiring deterministic timing for signal stimulus/response capture. IC Role / Device Role / Timing Role: Synchronizing GPIB/IEEE-488 handshaking, digital pattern generation, and DUT status sampling using internal registers and carry logic. Use Value: Delivers repeatable 125 MHz timing closure for test sequence execution - eliminates timing jitter from microcontroller-based solutions. |
| Communications Backplane Interface | Medical Imaging Data Formatter |
Use Scenario: Protocol translation and data alignment between proprietary backplane buses and PCI-compatible host interfaces. IC Role / Device Role / Timing Role: Glue logic implementing FIFO buffering, address decoding, and parity generation/checking across voltage-isolated domains. Use Value: Supports 3.3V LVTTL I/O on both sides with independent bank voltage assignment - avoids level-shifter components. | Use Scenario: Real-time pixel data reformatting and header insertion in ultrasound front-end subsystems. IC Role / Device Role / Timing Role: High-speed parallel-to-serial conversion and packet framing using distributed RAM and carry chain arithmetic. Use Value: Achieves 100+ MSPS pixel throughput with deterministic latency - meets DICOM image acquisition timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS30-4BG256C | No XL-series low-power enhancements; higher static current (≈25 mA vs. ≈12 mA at idle) | Limited suitability for thermally constrained enclosures or battery-backed systems | Select XCS30XL-4BG256C when power efficiency and thermal margin are prioritized over cost minimization |
| XCS40XL-4BG256C | 40,000-gate capacity, identical package and speed grade - requires minor pin-compatible logic migration | Enables larger state machines and deeper FIFOs without PCB change | Choose XCS30XL-4BG256C for designs meeting 30K gate budget and requiring proven qualification history |
Compared with XCS30-4BG256C, the XCS30XL-4BG256C delivers lower static power and improved thermal performance while maintaining identical timing and I/O compatibility; versus XCS40XL-4BG256C, it offers verified fit for legacy 30K-gate designs with reduced NRE validation effort.
Availability
XCS30XL-4BG256C is available at Aetrix Electronics and suitable for industrial PLCs, legacy test equipment, and medical imaging subsystems requiring stable component supply and long-term obsolescence management.
Supply support for XCS30XL-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and AI technologies. Formerly Xilinx, it pioneered FPGA architecture and continues to serve industrial, aerospace, and communications markets.
The Spartan-XL family was designed for cost-sensitive, high-volume applications requiring reliable reconfigurable logic with commercial temperature operation and mature process technology.
FAQ
What is the configuration method supported by XCS30XL-4BG256C?
The XCS30XL-4BG256C supports configuration via JTAG boundary-scan (IEEE 1149.1) and serial PROM loading through dedicated configuration pins. It does not support master parallel or slave serial modes. Configuration bitstream is loaded into volatile SRAM cells, requiring reinitialization on power-up unless paired with external nonvolatile memory.
Does XCS30XL-4BG256C support 2.5V or 1.8V I/O standards?
No, the XCS30XL-4BG256C only supports 3.3V LVTTL and LVCMOS I/O standards across its 12 banks. It lacks internal voltage regulators or multi-voltage I/O circuitry. Mixed-voltage interfacing requires external level shifters when connecting to 2.5V or 1.8V devices.
What is the maximum operating frequency for internal logic in XCS30XL-4BG256C?
The XCS30XL-4BG256C -4 speed grade guarantees a maximum CLB-to-CLB propagation delay of 8 ns, enabling internal logic operation up to 125 MHz under worst-case commercial temperature and voltage conditions. Actual achievable frequency depends on design placement and routing.
Is XCS30XL-4BG256C pin-compatible with newer Spartan-3 or Spartan-6 devices?
No, the XCS30XL-4BG256C is not pin-compatible with Spartan-3 or Spartan-6 families. It uses a legacy 256-ball PBGA footprint with different power, ground, and configuration pin assignments. Migration requires PCB redesign and logic reimplementation due to architectural differences.
What thermal considerations apply to XCS30XL-4BG256C in continuous operation?
The XCS30XL-4BG256C has a maximum junction temperature of 100°C and typical power dissipation of 1.2 W at full utilization. Adequate PCB copper area, thermal vias under the package, and ambient airflow ≥0.5 m/s are recommended to maintain junction temperature below 85°C in commercial temperature-range operation.
XCS30XL-4BG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-XL
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 576
- Number of Logic Elements/Cells:
- 1368
- Total RAM Bits:
- 18432
- Number of I/O:
- 192
- Number of Gates:
- 30000
- Voltage - Supply:
- 3V ~ 3.6V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCS30XL-4BG256C FAQ
1.How can I place an order for XCS30XL-4BG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS30XL-4BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS30XL-4BG256C reliable?
The price and inventory of XCS30XL-4BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS30XL-4BG256C is usually 5 days.
3.What payment methods are accepted for XCS30XL-4BG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS30XL-4BG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS30XL-4BG256C?
XCS30XL-4BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS30XL-4BG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS30XL-4BG256C?
For technical support, including XCS30XL-4BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS30XL-4BG256C requirements.
6.How does Aetrix verify that XCS30XL-4BG256C is sourced from the original manufacturer or authorized distributors?
All XCS30XL-4BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS30XL-4BG256C meets industry standards.
7.What is the process for return or replacement of XCS30XL-4BG256C?
All XCS30XL-4BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS30XL-4BG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS30XL-4BG256C part is unused and in its original packaging.
Return procedure for XCS30XL-4BG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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