AMD XCS30XL-4CS280C

Overview

XCS30XL-4CS280C from AMD is a Spartan-XL family FPGA with 30,000 system gates, 4 ns CLB propagation delay, and 280-pin CSP BGA package. It integrates configurable logic blocks, I/O blocks, and interconnect resources for digital logic implementation in industrial control and communication interface applications.

For engineers reviewing the XCS30XL-4CS280C datasheet, pinout, applications, or equivalent options, key selection criteria include CLB delay, system gate count, I/O count, voltage supply range, and thermal performance in constrained PCB layouts.

Technical Context

The XCS30XL-4CS280C implements a fine-grained architecture with 1,200 configurable logic blocks (CLBs), each supporting dual 4-input LUTs and flip-flops. It supports 176 user I/O pins with 3.3 V LVTTL/LVCMOS compatibility and programmable slew rate control.

Configuration is performed via serial PROM or boundary-scan (JTAG) using IEEE 1149.1 compliant TAP controller. The device operates over 0 °C to 70 °C ambient temperature with internal voltage regulation for core logic at 3.3 V ±5%.

Key Specifications

Pinout & Package

280-pin Chip-Scale Package (CSP) Ball Grid Array with 1.0 mm ball pitch, thermally enhanced bottom-side copper pad, and JEDEC MO-220 compliant footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Compared with XCS30XL-4CS280C, the XCS30-4PQ208C trades I/O count and thermal performance for package serviceability, while the XCS40XL-4CS280C extends logic capacity within identical mechanical and electrical constraints-enabling scalable design reuse without PCB revision.

Availability

XCS30XL-4CS280C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and legacy system upgrades requiring stable component supply and long-term obsolescence management.

Supply support for XCS30XL-4CS280C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD designs and manufactures programmable logic devices, including FPGAs and CPLDs, with focus on industrial, aerospace, and communications infrastructure markets.

The Spartan-XL family was engineered for cost-sensitive, high-reliability applications requiring non-volatile configuration and deterministic timing behavior in commercial temperature environments.

FAQ

What is the configuration method supported by XCS30XL-4CS280C?

The XCS30XL-4CS280C supports serial configuration via external PROM and IEEE 1149.1 JTAG boundary-scan. It does not include on-chip non-volatile memory, so configuration data must be loaded at power-up. The XCS30XL-4CS280C uses a dedicated PROGRAM_B pin to initiate reconfiguration and accepts bitstream data through its TDI pin during JTAG mode.

Does XCS30XL-4CS280C support mixed-voltage I/O operation?

No, the XCS30XL-4CS280C supports only 3.3 V LVTTL/LVCMOS I/O standards across all user banks. Each I/O bank shares a common VCCO supply, and there is no internal level-shifting circuitry. The XCS30XL-4CS280C requires external translators for interfacing with 5 V or 1.8 V systems.

What is the maximum operating frequency achievable with XCS30XL-4CS280C?

The XCS30XL-4CS280C has a 4 ns CLB propagation delay, enabling synchronous logic paths up to approximately 125 MHz under typical routing and loading conditions. Actual system frequency depends on design topology, placement, and clock network skew. The XCS30XL-4CS280C does not include dedicated PLLs or DLLs, so clock management relies on external oscillators and global buffer routing.

Is XCS30XL-4CS280C pin-compatible with other Spartan-XL devices in the same package?

Yes, the XCS30XL-4CS280C shares identical pinout and package dimensions with other Spartan-XL devices in the 280-pin CSP BGA variant, including XCS40XL-4CS280C and XCS50XL-4CS280C. Power and ground ball assignments, JTAG signals, and configuration pins are fixed across this package family, allowing direct substitution where logic capacity permits.

What thermal considerations apply to XCS30XL-4CS280C in enclosed industrial enclosures?

The XCS30XL-4CS280C features an exposed thermal pad on the underside of its CSP BGA package, which must be soldered to a large copper pour on the PCB for effective heat conduction. In sealed enclosures with still-air conditions, derating above 60 °C ambient is recommended. The XCS30XL-4CS280C datasheet specifies junction-to-board thermal resistance (ψJB) of 12.5 °C/W under standard JEDEC test conditions.