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AMD XCS30XL-5BG256C

Part No.:
XCS30XL-5BG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BBGA
Datasheet:
AetrixXCS30XL-5BG256C.pdf
Description:
IC FPGA 192 I/O 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,346

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Product details

Overview

XCS30XL-5BG256C from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 30,000 system gates, 5 ns maximum input-to-output delay, and 256-pin BGA package. It integrates configurable logic blocks, I/O blocks, and interconnect resources for digital logic implementation in industrial control and communications interface applications.

For engineers reviewing the XCS30XL-5BG256C datasheet, pinout, applications, or equivalent options, key selection criteria include propagation delay, I/O count, system gate density, configuration mode support, and commercial temperature grade operation.

Technical Context

The XCS30XL-5BG256C implements a segmented interconnect architecture with four routing channels per CLB row and dedicated carry logic for arithmetic functions. It supports in-system programmability via JTAG boundary-scan and serial PROM configuration.

Configuration is performed through master serial, slave serial, or boundary-scan modes using 3.3 V or 5 V tolerant I/Os. The device operates over 0 °C to 70 °C and requires external configuration memory for power-up initialization.

Key Specifications

ParameterValue and Actual Design Meaning
System Gates30,000 - usable logic capacity for medium-complexity state machines and glue logic replacement
Max I/O Pins180 - supports multi-bus interfacing including PCI, ISA, and custom parallel protocols
Propagation Delay5 ns - enables synchronous operation up to ~125 MHz in critical paths
Package256-pin Fine-Pitch BGA (17×17 mm, 1.27 mm pitch) - requires standard SMT reflow profile
Operating Temp0 °C to +70 °C - suitable for commercial-grade embedded systems without extended thermal management
VCCIO3.3 V or 5 V tolerant - allows mixed-voltage board design with legacy TTL/CMOS peripherals

Pinout & Package

256-pin Fine-Pitch Ball Grid Array (FBGA), 17×17 array, 1.27 mm pitch, 1.0 mm ball diameter, JEDEC MO-205AC compliant.

Pin/TerminalCircuit RoleDesign Meaning
GCK0–GCK3Global Clock InputsDedicated low-skew clock routing to all CLBs; supports asynchronous reset/synchronous enable
PROGRAM_Configuration InitiateActive-low signal that clears configuration memory and resets internal state on power-up or reconfiguration
TMS/TCK/TDI/TDOJTAG Boundary-Scan InterfaceEnables IEEE 1149.1 compliance for testing, debugging, and in-system programming
HCLKHigh-Speed Clock InputOptional high-frequency clock path bypassing global buffers for timing-critical I/O domains
VCCINTCore Logic Supply3.3 V supply for internal logic; decoupling required within 1 inch of each VCCINT ball

Key Features

FeatureDesign Value
Configurable Logic Blocks (CLBs)Each CLB contains two 3-input LUTs and flip-flops, enabling efficient implementation of combinatorial and registered logic
Dedicated Carry ChainSupports fast ripple-carry adders and comparators without consuming general routing resources
I/O Bank PartitioningAllows independent VCCO assignment per bank (3.3 V or 5 V), simplifying mixed-voltage interface design
Boundary-Scan SupportFull IEEE 1149.1 compliance enables PCB-level testability and debug without physical probe access

Applications

Industrial PLC I/O ModuleLegacy Bus Bridge

Use Scenario: Real-time digital I/O conditioning and protocol translation in programmable logic controller backplanes.

IC Role / Device Role / Timing Role: FPGA acts as configurable glue logic and timing coordinator between microcontroller and field I/O drivers.

Use Value: 5 ns propagation delay ensures deterministic response under 10 µs cycle time requirements.

Use Scenario: Interfacing ISA or PCI bus peripherals with modern microcontrollers lacking native legacy bus support.

IC Role / Device Role / Timing Role: XCS30XL-5BG256C implements address decoding, wait-state generation, and data-width conversion.

Use Value: 180 I/O pins accommodate full 16-bit ISA data bus plus control and status lines in single-package solution.

Communications Protocol ConverterTest Equipment Signal Generator

Use Scenario: Converting RS-485 Modbus frames to SPI packets for sensor network gateways.

IC Role / Device Role / Timing Role: Implements UART receiver/transmitter, frame parser, and SPI master controller in hardware.

Use Value: Configurable logic enables simultaneous dual-protocol handling without CPU overhead.

Use Scenario: Generating precise digital stimulus patterns for IC functional validation.

IC Role / Device Role / Timing Role: XCS30XL-5BG256C serves as pattern sequencer and timing engine synchronized to external reference clock.

Use Value: 30,000 system gates support complex state machines generating multi-phase, variable-duty-cycle waveforms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCS30-5BG256CNo XL-series low-power enhancements; higher static current and reduced noise immunitySuitable only where power budget exceeds 200 mW and EMI margin is non-criticalSelect XCS30XL-5BG256C when lower standby current and improved I/O noise rejection are required
XCS40XL-5BG256C40,000 system gates, identical pinout and timing, but larger die size and higher costUsed when additional logic capacity is needed for future firmware expansion or added peripheral interfacesChoose XCS30XL-5BG256C for cost-sensitive designs meeting exact 30K gate requirement without headroom

Compared with XCS30-5BG256C, the XCS30XL-5BG256C delivers lower static power and better I/O noise margin; compared with XCS40XL-5BG256C, it offers identical footprint and timing at reduced gate count and unit cost.

Availability

XCS30XL-5BG256C is available at Aetrix Electronics and suitable for industrial control, legacy bus bridging, and communications protocol conversion requiring stable component supply and long-term obsolescence management.

Supply support for XCS30XL-5BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Spartan-XL product support for industrial and aerospace customers requiring long-lifecycle components.

The Spartan-XL family was designed for cost-sensitive, medium-complexity digital logic replacement in commercial and industrial applications where reprogrammability and I/O flexibility outweigh ASIC-level performance.

FAQ

What is the configuration method supported by XCS30XL-5BG256C?

XCS30XL-5BG256C supports master serial, slave serial, and JTAG boundary-scan configuration modes. It requires external configuration PROM or processor-controlled loading. The device does not include on-chip nonvolatile memory and must be reconfigured at each power-on event. Configuration bitstream is loaded via dedicated pins (DIN, PROGRAM_, and associated clocks) per Xilinx DS012 specification.

Does XCS30XL-5BG256C support hot-swap I/O operation?

XCS30XL-5BG256C supports hot-swap capable I/Os only when configured with 3.3 V VCCO and proper external circuitry (series resistors, clamping diodes). Its I/O structures are 5 V tolerant but not inherently hot-swap rated per JEDEC JS-001. Safe insertion requires controlled power sequencing and slew-rate limiting, as defined in Xilinx Application Note XAPP151.

What is the maximum operating frequency of XCS30XL-5BG256C?

The XCS30XL-5BG256C has a 5 ns maximum input-to-output delay, enabling reliable operation up to approximately 125 MHz in well-constrained synchronous paths. Actual system clock frequency depends on logic depth, routing congestion, and I/O timing closure. Full-speed operation requires adherence to Xilinx timing constraints and use of dedicated carry chains for arithmetic blocks.

Is XCS30XL-5BG256C pin-compatible with newer Spartan families?

No, XCS30XL-5BG256C is not pin-compatible with Spartan-II, Spartan-3, or later families. Its 256-pin FBGA footprint and I/O voltage architecture differ significantly. Migration requires PCB redesign and logic reimplementation. Xilinx documentation explicitly states no mechanical or electrical compatibility across Spartan generations.

What development tools support XCS30XL-5BG256C design entry and synthesis?

XCS30XL-5BG256C is supported by Xilinx Foundation Series F1.5 and earlier versions, as well as Alliance Series 2.1i. Modern Vivado and ISE tools do not support this device. Legacy software must be used for place-and-route, bitstream generation, and timing analysis per DS012 and XAPP058 documentation.

XCS30XL-5BG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-XL
Package/Case:
256-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
192
Number of Gates:
30000
Voltage - Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-PBGA (27x27)

XCS30XL-5BG256C FAQ

1.How can I place an order for XCS30XL-5BG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCS30XL-5BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCS30XL-5BG256C reliable?

The price and inventory of XCS30XL-5BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS30XL-5BG256C is usually 5 days.

3.What payment methods are accepted for XCS30XL-5BG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS30XL-5BG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCS30XL-5BG256C?

XCS30XL-5BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCS30XL-5BG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCS30XL-5BG256C?

For technical support, including XCS30XL-5BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS30XL-5BG256C requirements.

6.How does Aetrix verify that XCS30XL-5BG256C is sourced from the original manufacturer or authorized distributors?

All XCS30XL-5BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS30XL-5BG256C meets industry standards.

7.What is the process for return or replacement of XCS30XL-5BG256C?

All XCS30XL-5BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS30XL-5BG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCS30XL-5BG256C part is unused and in its original packaging.

Return procedure for XCS30XL-5BG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCS30XL-5BG256C Tags

  • XCS30XL-5BG256C
  • XCS30XL-5BG256C PDF
  • XCS30XL-5BG256C Datasheet
  • XCS30XL-5BG256C Specifications
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  • AMD
  • AMD XCS30XL-5BG256C
  • Buy XCS30XL-5BG256C
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