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AMD XCS40-3BG256C

Part No.:
XCS40-3BG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BBGA
Datasheet:
AetrixXCS40-3BG256C.pdf
Description:
IC FPGA 205 I/O 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,689

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Product details

Overview

XCS40-3BG256C from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 40,000 system gates, 256-pin BGA package, 3.3 V I/O voltage, and -3 speed grade (12 ns CLB propagation delay). It implements configurable logic for digital control in industrial motion controllers.

For engineers reviewing the XCS40-3BG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (184 user I/Os), configuration mode (JTAG/Slave Serial), internal RAM (12 kbits), and compliance with IEEE 1149.1 boundary-scan test standard.

Technical Context

The XCS40-3BG256C integrates configurable logic blocks (CLBs), input/output blocks (IOBs), and interconnect resources programmable via SRAM-based configuration bitstream. It supports multiple configuration modes including JTAG boundary-scan and Slave Serial PROM loading.

Its architecture delivers deterministic timing with guaranteed 12 ns CLB propagation delay at -3 speed grade and operates with 3.3 V core and I/O supply. The device includes dedicated carry logic for high-speed arithmetic and distributed RAM per CLB.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity40,000 system gates - defines maximum combinational logic density for control state machines and data path implementation
Speed Grade-3 (12 ns CLB tPD) - guarantees worst-case propagation delay through a single CLB for timing-critical paths
I/O Count184 user-configurable I/Os - supports interface to multiple peripherals including encoders, ADCs, and bus transceivers
Configuration ModeJTAG & Slave Serial - enables in-system programming and field reconfiguration without dedicated configuration PROM
Internal RAM12 kbits distributed RAM - provides on-chip storage for small lookup tables, FIFO buffers, or register files
Supply Voltage3.3 V core and I/O - requires single-rail power design; compatible with LVTTL and LVCMOS33 interfaces

Pinout & Package

256-ball fine-pitch BGA (17 × 17 mm, 1.27 mm pitch) with perimeter I/O arrangement and dedicated power/ground ball pattern for signal integrity.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 power supply - must be decoupled locally for noise-sensitive digital interfaces
A1GNDDedicated ground ball - connects to PCB ground plane to minimize return path inductance
P16TCKJTAG test clock input - synchronizes boundary-scan operations during programming and debug
R16TMSJTAG test mode select - controls state transitions of TAP controller during configuration
T16TDOJTAG test data output - serially returns scan chain data during verification or diagnostics
U16TDIJTAG test data input - accepts serial configuration bitstream or test instructions

Key Features

FeatureDesign Value
IEEE 1149.1 Boundary-ScanEnables board-level testability and in-system programming without physical probe access
Distributed RAM per CLBAllows implementation of small memory structures without external SRAM, reducing component count
Carry Chain LogicSupports high-speed arithmetic (e.g., counters, adders) with predictable 1-bit propagation delay per stage
Multi-Voltage I/O BanksPermits mixed-interface designs (e.g., 3.3 V logic interfacing to 5 V peripherals via level-shifting)

Applications

Industrial Motion ControllerProgrammable Logic Relay

Use Scenario: Real-time position loop closure and PWM generation for servo drives in CNC machines.

IC Role / Device Role / Timing Role: Configurable digital logic fabric executing deterministic control algorithms with sub-microsecond latency.

Use Value: Replaces fixed-function ASICs with field-upgradable logic while maintaining hard real-time response.

Use Scenario: Replacement of electromechanical relays in factory automation panels with solid-state switching logic.

IC Role / Device Role / Timing Role: Programmable combinatorial and sequential logic implementing safety interlocks and sequencing states.

Use Value: Eliminates mechanical wear and enables diagnostic feedback via JTAG scan chain visibility.

Legacy System EmulatorTest Equipment Pattern Generator

Use Scenario: Emulation of obsolete gate arrays in avionics maintenance test sets requiring long-term obsolescence mitigation.

IC Role / Device Role / Timing Role: Pin-compatible functional replacement using SRAM configuration to replicate legacy logic behavior.

Use Value: Extends service life of certified equipment without hardware redesign or recertification.

Use Scenario: Generation of synchronized multi-channel digital stimulus waveforms for IC validation labs.

IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing alignment across 184 I/O pins.

Use Value: Achieves precise edge placement (±1 ns jitter) using internal carry chain and global clock routing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCS40-4BG256CFaster -4 speed grade (10 ns CLB tPD); identical pinout and logic resourcesSuitable for higher-frequency control loops requiring tighter timing marginsSelect when target system clock exceeds 80 MHz or setup/hold slack is marginal with XCS40-3BG256C
XCS30-3BG256CLower density (30,000 gates); same -3 speed grade and packageApplicable where logic utilization remains below 75% and cost reduction is prioritizedChoose if design fits within reduced gate count and avoids over-provisioning resources

Compared with XCS40-3BG256C, the XCS40-4BG256C offers improved timing margin without layout change, while the XCS30-3BG256C reduces unit cost at the expense of logic headroom - both require functional verification but no PCB revision.

Availability

XCS40-3BG256C is available at Aetrix Electronics and suitable for industrial motion control, programmable relay systems, legacy avionics emulation, and automated test equipment requiring stable component supply and long-lifecycle support.

Supply support for XCS40-3BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues to support legacy Spartan families under the AMD Adaptive SoC and FPGA portfolio.

The Spartan-XL family was designed for cost-sensitive, high-volume digital control applications requiring predictable timing, JTAG testability, and long-term availability - especially in industrial and test equipment markets.

FAQ

What is the configuration method supported by the XCS40-3BG256C?

The XCS40-3BG256C supports JTAG boundary-scan and Slave Serial configuration modes. JTAG allows in-system programming and debugging via standard test access port signals (TCK, TMS, TDI, TDO), while Slave Serial enables bootloading from external PROM. Both methods are fully documented in the Spartan-XL Configuration User Guide, and the XCS40-3BG256C requires no external configuration controller.

Does the XCS40-3BG256C have internal configuration memory?

No, the XCS40-3BG256C uses SRAM-based configuration and does not retain its bitstream after power loss. It must be reconfigured at power-up using an external source such as JTAG programmer or serial PROM. This characteristic applies to all Spartan-XL devices, including the XCS40-3BG256C, and necessitates inclusion of configuration circuitry in system design.

What is the maximum operating frequency of the XCS40-3BG256C?

The XCS40-3BG256C has a guaranteed CLB propagation delay of 12 ns at -3 speed grade, supporting system clock frequencies up to approximately 83 MHz for logic paths crossing a single CLB. Actual maximum frequency depends on design topology, routing, and I/O timing constraints - verified per design using Xilinx Foundation or Alliance software timing analysis for the XCS40-3BG256C.

Can the XCS40-3BG256C interface directly with 5 V TTL devices?

The XCS40-3BG256C I/Os operate at 3.3 V and are not 5 V tolerant. Direct connection to 5 V TTL outputs risks damaging the device. Safe interfacing requires external level-shifting circuitry or use of 3.3 V–compatible peripherals. This limitation applies uniformly across all I/O banks of the XCS40-3BG256C and is specified in the DC Characteristics table of its datasheet.

Is the XCS40-3BG256C still in production?

The XCS40-3BG256C is discontinued by AMD/Xilinx but remains available through authorized legacy distributors and Aetrix Electronics' long-term inventory program. Aetrix maintains traceable, tested stock with full lot documentation and provides lifecycle coordination support specifically for the XCS40-3BG256C to sustain industrial and aerospace programs.

XCS40-3BG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®
Package/Case:
256-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
784
Number of Logic Elements/Cells:
1862
Total RAM Bits:
25088
Number of I/O:
205
Number of Gates:
40000
Voltage - Supply:
4.75V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-PBGA (27x27)

XCS40-3BG256C FAQ

1.How can I place an order for XCS40-3BG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCS40-3BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCS40-3BG256C reliable?

The price and inventory of XCS40-3BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS40-3BG256C is usually 5 days.

3.What payment methods are accepted for XCS40-3BG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS40-3BG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCS40-3BG256C?

XCS40-3BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCS40-3BG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCS40-3BG256C?

For technical support, including XCS40-3BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS40-3BG256C requirements.

6.How does Aetrix verify that XCS40-3BG256C is sourced from the original manufacturer or authorized distributors?

All XCS40-3BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS40-3BG256C meets industry standards.

7.What is the process for return or replacement of XCS40-3BG256C?

All XCS40-3BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS40-3BG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCS40-3BG256C part is unused and in its original packaging.

Return procedure for XCS40-3BG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCS40-3BG256C Tags

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  • XCS40-3BG256C PDF
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