My Inquiry
My Account
AMD XCS40-4BG256C
.jpg)
- Part No.:
- XCS40-4BG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCS40-4BG256C.pdf
- Description:
- IC FPGA 205 I/O 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,061
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCS40-4BG256C from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 4,000 usable gates, 136 I/O pins, and 128 configurable logic blocks (CLBs), designed for low-cost, high-volume embedded control and interface bridging applications in industrial automation and communications equipment.
For engineers reviewing the XCS40-4BG256C datasheet, pinout, applications, or equivalent options, key selection criteria include system-level timing closure support, in-system programmability via JTAG, and compatibility with 3.3 V or 5 V I/O standards in space-constrained PCB layouts.
Technical Context
The XCS40-4BG256C implements a hierarchical architecture with CLBs containing two 3-input LUTs and flip-flops per slice, interconnected via segmented routing channels and dedicated carry/logic chains. It supports synchronous design with global clock buffers and four dedicated clock inputs.
Configuration is performed via serial mode using an external PROM or parallel slave mode with a microcontroller; configuration bitstream is volatile and requires re-loading at power-up. The device does not include on-chip flash or RAM-based configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gates | 4,000 usable system gates - defines combinational logic capacity for small-state-machine or glue-logic replacement |
| I/O Pins | 136 user-programmable I/Os - supports multi-bus interfacing with bank-selectable voltage standards |
| CLBs | 128 configurable logic blocks - each contains dual 3-LUTs + flip-flop, enabling pipelined combinatorial logic |
| Max Frequency | 125 MHz system clock - verified timing closure for synchronous designs with moderate pipeline depth |
| Voltage | 5 V core and I/O - compatible with legacy TTL/CMOS level systems without level-shifting circuitry |
| Package | 256-pin BGA (Ball Grid Array) - 17 × 17 mm body, 1.27 mm pitch, requiring controlled-impedance PCB layout |
Pinout & Package
256-ball fine-pitch BGA (FBGA) package with 1.27 mm ball pitch, thermal pad exposed on underside, JEDEC MO-205AC compliant. Pinout includes 136 user I/Os distributed across 8 banks, 4 dedicated clock inputs, 4 global enable/reset signals, and JTAG boundary-scan test access pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_0–IO_135 | User I/O bank signal | Configurable as input, output, or bidirectional; voltage standard set per bank (3.3 V or 5 V) |
| CLK0–CLK3 | Dedicated clock input | Low-skew global routing to all CLBs; supports single-ended CMOS/TTL clock sources |
| GTS0–GTS3 | Global three-state enable | Simultaneously disables output drivers across multiple I/O banks for bus arbitration |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant in-circuit testing and in-system programming |
| GND / VCC | Power and ground balls | Multiple distributed balls per plane; thermal pad provides mechanical stability and heat dissipation |
Key Features
| Feature | Design Value |
|---|---|
| In-system programmability (ISP) | Enables field firmware updates via JTAG without removing XCS40-4BG256C from PCB |
| Four global clock networks | Reduces clock skew across full die, supporting synchronous timing closure up to 125 MHz |
| Bank-selectable I/O standards | Allows mixed-voltage operation (3.3 V/5 V) on same device, simplifying interface to legacy and modern peripherals |
| Dedicated carry chain | Accelerates arithmetic functions (counters, adders) with predictable propagation delay per bit |
| Boundary-scan test support | Verifies solder joint integrity and interconnect continuity during manufacturing without physical probe access |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding digital I/O capability to programmable logic controllers using existing 5 V backplane infrastructure. IC Role / Device Role / Timing Role: Glue logic replacement and protocol translation between microcontroller and discrete I/O modules. Use Value: Eliminates discrete TTL chips while maintaining 5 V tolerance and deterministic setup/hold timing for scan-cycle synchronization. | Use Scenario: Bridging ISA or VME bus peripherals to newer microprocessor subsystems operating at different voltage levels. IC Role / Device Role / Timing Role: Synchronous bus controller with address decoding, handshaking, and level translation. Use Value: Enables direct connection of 5 V ISA cards to 3.3 V host processors using bank-isolated I/O voltage domains in XCS40-4BG256C. |
| Communications Line Card Control | Test Equipment Signal Routing |
Use Scenario: Managing LED status indicators, relay drivers, and DIP-switch inputs on telecom line interface cards. IC Role / Device Role / Timing Role: Real-time peripheral interface controller with interrupt-driven I/O response. Use Value: Provides deterministic sub-microsecond I/O response time and concurrent handling of 136 signals under 125 MHz clock domain. | Use Scenario: Configurable signal path switching in automated test equipment for routing analog/digital stimuli between DUT and instruments. IC Role / Device Role / Timing Role: Reconfigurable multiplexer matrix with glitch-free switching controlled by test sequencer. Use Value: Reduces hardware variants by enabling dynamic routing changes via bitstream reload, avoiding manual jumper or relay-based reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based glue logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS40-3BG256C | Slower speed grade (100 MHz max vs. 125 MHz); identical pinout and logic resources | Suitable where timing margin allows relaxed clock rates, reducing power and EMI | Select when system timing budget permits lower frequency operation and cost sensitivity outweighs performance headroom |
| XCS40-4PQ208C | Same speed grade and logic capacity, but 208-pin PQFP package instead of 256-pin BGA | Better suited for prototyping or low-volume assemblies where BGA rework is impractical | Choose for lab validation or small-batch production where surface-mount assembly infrastructure lacks BGA reflow capability |
Compared with XCS40-4BG256C, the XCS40-3BG256C trades 25 MHz timing headroom for lower cost and power, while the XCS40-4PQ208C retains identical functionality in a through-hole-compatible package-enabling design reuse across NPI and volume manufacturing stages without logic redesign.
Availability
XCS40-4BG256C is available at Aetrix Electronics and suitable for industrial automation, telecommunications infrastructure, and test equipment requiring stable component supply and long-term obsolescence management.
Supply support for XCS40-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, inheriting its FPGA product portfolio including the Spartan family. AMD is a global semiconductor leader focused on adaptive computing solutions.
The Spartan-XL family, including XCS40-4BG256C, was engineered for cost-sensitive, high-reliability embedded control applications where programmable logic replaces discrete glue logic and enables rapid interface customization.
FAQ
What is the configuration method supported by XCS40-4BG256C?
XCS40-4BG256C uses external configuration via serial or parallel mode. It requires an external PROM or microcontroller to load the bitstream at power-up, as it lacks on-chip nonvolatile memory. JTAG is supported for in-system programming and boundary-scan testing, but does not retain configuration without external storage. The XCS40-4BG256C must be reconfigured each time power is applied.
Does XCS40-4BG256C support 3.3 V I/O operation?
Yes, XCS40-4BG256C supports 3.3 V I/O in selected I/O banks, though its core voltage remains 5 V. Each I/O bank can be independently configured for either 3.3 V or 5 V signaling, enabling mixed-voltage interfacing. This capability is documented in the Spartan-XL DC and Switching Characteristics datasheet, and applies specifically to XCS40-4BG256C's banked I/O architecture.
What is the maximum operating temperature rating for XCS40-4BG256C?
XCS40-4BG256C is rated for commercial temperature range (0 °C to +70 °C), as indicated by the 'C' suffix in the part number. It is not qualified for extended or industrial temperature ranges. Thermal management must ensure junction temperature remains within this limit under worst-case power dissipation, especially in dense BGA layouts where heat extraction is constrained.
Can XCS40-4BG256C be used as a drop-in replacement for XCS40-4PQ208C?
No, XCS40-4BG256C cannot serve as a drop-in replacement for XCS40-4PQ208C due to incompatible packages: 256-ball BGA versus 208-pin PQFP. Pin count, pitch, and physical footprint differ significantly. While logic resources and speed grade match, PCB layout and assembly processes are not interchangeable. Migration requires board redesign and requalification.
Is JTAG boundary-scan supported on XCS40-4BG256C?
Yes, XCS40-4BG256C fully supports IEEE 1149.1 JTAG boundary-scan for testing and programming. The TCK, TMS, TDI, and TDO pins are dedicated and electrically defined in the pinout. This feature enables in-circuit verification of solder joints and interconnects, and allows in-system configuration without requiring dedicated programming headers-critical for embedded deployment of XCS40-4BG256C.
XCS40-4BG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 784
- Number of Logic Elements/Cells:
- 1862
- Total RAM Bits:
- 25088
- Number of I/O:
- 205
- Number of Gates:
- 40000
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCS40-4BG256C FAQ
1.How can I place an order for XCS40-4BG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS40-4BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS40-4BG256C reliable?
The price and inventory of XCS40-4BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS40-4BG256C is usually 5 days.
3.What payment methods are accepted for XCS40-4BG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS40-4BG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS40-4BG256C?
XCS40-4BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS40-4BG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS40-4BG256C?
For technical support, including XCS40-4BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS40-4BG256C requirements.
6.How does Aetrix verify that XCS40-4BG256C is sourced from the original manufacturer or authorized distributors?
All XCS40-4BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS40-4BG256C meets industry standards.
7.What is the process for return or replacement of XCS40-4BG256C?
All XCS40-4BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS40-4BG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS40-4BG256C part is unused and in its original packaging.
Return procedure for XCS40-4BG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCS40-4BG256C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
