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AMD XCS40XL-4BG256C

Part No.:
XCS40XL-4BG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BBGA
Datasheet:
AetrixXCS40XL-4BG256C.pdf
Description:
IC FPGA 205 I/O 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,855

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Product details

Overview

XCS40XL-4BG256C from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 40,000 system gates, 256-ball BGA package, 4.5 ns CLB delay, and support for 3.3 V I/O operation. It serves as a reconfigurable logic fabric in industrial control logic, digital signal preprocessing, and embedded interface bridging.

For engineers reviewing the XCS40XL-4BG256C datasheet, pinout, applications, or equivalent options, key selection factors include CLB count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and guaranteed timing performance at -4 speed grade.

Technical Context

The XCS40XL-4BG256C implements a hierarchical architecture with Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and interconnect resources. It supports IEEE 1149.1 JTAG boundary-scan testing and uses internal SRAM-based configuration memory loaded via serial PROM or microprocessor interface.

Configuration occurs on power-up using external PROM or through JTAG port; no internal non-volatile memory is present. The device operates within commercial temperature range (0°C to 70°C) and requires separate 3.3 V supply for I/O banks and 3.3 V core voltage.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity40,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping
Speed Grade-4 - guarantees 4.5 ns CLB propagation delay under worst-case commercial conditions
I/O Voltage3.3 V - enables direct interfacing with LVTTL and LVCMOS33 systems without level shifters
Package256-ball BGA (17×17 mm, 1.27 mm pitch) - provides high I/O count with compact board footprint
Configuration ModeMaster Serial, Slave Parallel, JTAG - determines boot source flexibility and programming methodology
Operating Temperature0°C to +70°C - validated for commercial-grade industrial and instrumentation applications

Pinout & Package

256-ball fine-pitch BGA (FBGA) package with 17×17 array, 1.27 mm ball pitch, and standard JEDEC MO-205AC mechanical outline. Thermal pad exposed on underside for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
PIN_A1VCCO_0I/O bank 0 power supply - must be decoupled locally for signal integrity
PIN_B2CLK0Dedicated global clock input - low-skew routing to all CLBs and IOBs
PIN_C3PROGRAM_BActive-low configuration reset - forces reinitialization of SRAM configuration memory
PIN_D4TCKJTAG test clock - synchronizes boundary-scan operations per IEEE 1149.1
PIN_E5GNDGround reference for core and I/O - multiple dedicated balls required for noise reduction

Key Features

FeatureDesign Value
SRAM-based configurationEnables full reprogrammability in-system without socket replacement or UV erasure
IEEE 1149.1 JTAG supportAllows standardized boundary-scan testing and in-circuit programming across production and field service
Multiple configuration modesSupports flexible deployment: serial PROM boot, microprocessor-controlled parallel load, or JTAG debug reload
3.3 V I/O compatibilityReduces external interface components by eliminating level translators for common digital buses

Applications

Industrial Motion ControlDigital Communication Interface

Use Scenario: Real-time servo loop coordination in multi-axis CNC controllers.

IC Role / Device Role / Timing Role: FPGA logic fabric implementing position interpolation, PWM generation, and encoder feedback decoding.

Use Value: Deterministic 4.5 ns CLB delay ensures sub-microsecond control cycle timing critical for jitter-sensitive motion profiles.

Use Scenario: Protocol translation between RS-485 fieldbus and SPI-based microcontroller subsystems.

IC Role / Device Role / Timing Role: Glue logic performing data framing, parity insertion, and baud rate adaptation.

Use Value: 3.3 V I/O tolerance allows direct connection to both legacy transceivers and modern MCU peripherals without voltage translation.

Test Equipment Signal GenerationEmbedded Video Preprocessing

Use Scenario: Arbitrary waveform synthesis in automated test equipment using DAC interface and timing sequencer.

IC Role / Device Role / Timing Role: Synchronized pattern generator controlling DAC update timing and trigger synchronization.

Use Value: Master Serial configuration mode enables fast firmware updates during calibration without hardware modification.

Use Scenario: Pixel format conversion and line buffering prior to display controller ingestion in medical imaging displays.

IC Role / Device Role / Timing Role: Frame buffer controller managing dual-port RAM access and pixel clock domain crossing.

Use Value: 256-ball BGA provides sufficient I/O count to manage parallel RGB data bus, sync signals, and memory address/control lines simultaneously.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCS40XL-3BG256CSlower -3 speed grade (5.5 ns CLB delay); otherwise identical architecture and pinoutSuitable where timing margin exceeds 100 MHz system clock requirementsSelect when cost sensitivity outweighs need for maximum operating frequency
XCS50XL-4BG256CHigher 50K-gate capacity; same -4 speed grade and 256-ball BGA footprintRequired when additional logic resources needed for expanded feature sets or larger state machinesChoose when design scalability or future-proofing justifies higher gate count and cost

Compared with XCS40XL-4BG256C, the -3 variant trades speed for cost in timing-relaxed designs, while the XCS50XL-4BG256C retains identical timing and packaging but adds 10K extra gates-enabling more complex control logic without PCB redesign.

Availability

XCS40XL-4BG256C is available at Aetrix Electronics and suitable for industrial motion control, digital communication interface bridging, and embedded video preprocessing requiring stable component supply and long-term manufacturing continuity.

Supply support for XCS40XL-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022, integrating programmable logic technology into its adaptive computing portfolio. Xilinx pioneered SRAM-based FPGAs for high-performance reconfigurable systems.

The Spartan-XL family was designed for cost-sensitive, high-volume embedded applications requiring reliable reprogrammable logic with commercial temperature support and 3.3 V I/O compatibility.

FAQ

What is the configuration method supported by the XCS40XL-4BG256C?

The XCS40XL-4BG256C supports Master Serial, Slave Parallel, and IEEE 1149.1 JTAG configuration modes. Master Serial uses an external serial PROM; Slave Parallel allows microprocessor-controlled loading; JTAG enables boundary-scan testing and in-system programming. All methods initialize the internal SRAM configuration memory on power-up or PROGRAM_B assertion.

Does the XCS40XL-4BG256C have internal non-volatile configuration memory?

No, the XCS40XL-4BG256C relies on external configuration sources. It contains no internal flash or EEPROM. Configuration data is loaded into volatile SRAM each time power is applied or after a PROGRAM_B reset. Persistent storage requires an external serial PROM or host processor intervention.

What is the significance of the "-4" speed grade in XCS40XL-4BG256C?

The "-4" speed grade in XCS40XL-4BG256C specifies a maximum CLB propagation delay of 4.5 ns under worst-case commercial temperature and voltage conditions. This rating guarantees timing closure for synchronous logic operating up to approximately 100 MHz, enabling deterministic real-time control in industrial and instrumentation applications.

Can the XCS40XL-4BG256C operate with mixed I/O voltages?

No, the XCS40XL-4BG256C supports only 3.3 V I/O operation across all banks. It lacks multi-voltage I/O capability or bank-specific voltage selection. All VCCO pins must be supplied with 3.3 V, and interfacing with 5 V or 1.8 V systems requires external level-shifting circuitry.

Is the XCS40XL-4BG256C pin-compatible with other Spartan-XL devices in the same package?

Yes, all Spartan-XL devices in the 256-ball BGA package-including XCS30XL, XCS40XL, and XCS50XL variants-share identical pinouts. This allows direct substitution based on logic density needs without PCB layout changes, provided power delivery and thermal design accommodate the specific device's current draw.

XCS40XL-4BG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-XL
Package/Case:
256-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
784
Number of Logic Elements/Cells:
1862
Total RAM Bits:
25088
Number of I/O:
205
Number of Gates:
40000
Voltage - Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-PBGA (27x27)

XCS40XL-4BG256C FAQ

1.How can I place an order for XCS40XL-4BG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCS40XL-4BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCS40XL-4BG256C reliable?

The price and inventory of XCS40XL-4BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS40XL-4BG256C is usually 5 days.

3.What payment methods are accepted for XCS40XL-4BG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS40XL-4BG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCS40XL-4BG256C?

XCS40XL-4BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCS40XL-4BG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCS40XL-4BG256C?

For technical support, including XCS40XL-4BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS40XL-4BG256C requirements.

6.How does Aetrix verify that XCS40XL-4BG256C is sourced from the original manufacturer or authorized distributors?

All XCS40XL-4BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS40XL-4BG256C meets industry standards.

7.What is the process for return or replacement of XCS40XL-4BG256C?

All XCS40XL-4BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS40XL-4BG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCS40XL-4BG256C part is unused and in its original packaging.

Return procedure for XCS40XL-4BG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCS40XL-4BG256C Tags

  • XCS40XL-4BG256C
  • XCS40XL-4BG256C PDF
  • XCS40XL-4BG256C Datasheet
  • XCS40XL-4BG256C Specifications
  • XCS40XL-4BG256C Images
  • AMD
  • AMD XCS40XL-4BG256C
  • Buy XCS40XL-4BG256C
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