AMD XCS40XL-4BG256C
- Part No.:
- XCS40XL-4BG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCS40XL-4BG256C.pdf
- Description:
- IC FPGA 205 I/O 256BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCS40XL-4BG256C from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 40,000 system gates, 256-ball BGA package, 4.5 ns CLB delay, and support for 3.3 V I/O operation. It serves as a reconfigurable logic fabric in industrial control logic, digital signal preprocessing, and embedded interface bridging.
For engineers reviewing the XCS40XL-4BG256C datasheet, pinout, applications, or equivalent options, key selection factors include CLB count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and guaranteed timing performance at -4 speed grade.
Technical Context
The XCS40XL-4BG256C implements a hierarchical architecture with Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and interconnect resources. It supports IEEE 1149.1 JTAG boundary-scan testing and uses internal SRAM-based configuration memory loaded via serial PROM or microprocessor interface.
Configuration occurs on power-up using external PROM or through JTAG port; no internal non-volatile memory is present. The device operates within commercial temperature range (0°C to 70°C) and requires separate 3.3 V supply for I/O banks and 3.3 V core voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 40,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| Speed Grade | -4 - guarantees 4.5 ns CLB propagation delay under worst-case commercial conditions |
| I/O Voltage | 3.3 V - enables direct interfacing with LVTTL and LVCMOS33 systems without level shifters |
| Package | 256-ball BGA (17×17 mm, 1.27 mm pitch) - provides high I/O count with compact board footprint |
| Configuration Mode | Master Serial, Slave Parallel, JTAG - determines boot source flexibility and programming methodology |
| Operating Temperature | 0°C to +70°C - validated for commercial-grade industrial and instrumentation applications |
Pinout & Package
256-ball fine-pitch BGA (FBGA) package with 17×17 array, 1.27 mm ball pitch, and standard JEDEC MO-205AC mechanical outline. Thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIN_A1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity |
| PIN_B2 | CLK0 | Dedicated global clock input - low-skew routing to all CLBs and IOBs |
| PIN_C3 | PROGRAM_B | Active-low configuration reset - forces reinitialization of SRAM configuration memory |
| PIN_D4 | TCK | JTAG test clock - synchronizes boundary-scan operations per IEEE 1149.1 |
| PIN_E5 | GND | Ground reference for core and I/O - multiple dedicated balls required for noise reduction |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based configuration | Enables full reprogrammability in-system without socket replacement or UV erasure |
| IEEE 1149.1 JTAG support | Allows standardized boundary-scan testing and in-circuit programming across production and field service |
| Multiple configuration modes | Supports flexible deployment: serial PROM boot, microprocessor-controlled parallel load, or JTAG debug reload |
| 3.3 V I/O compatibility | Reduces external interface components by eliminating level translators for common digital buses |
Applications
| Industrial Motion Control | Digital Communication Interface |
|---|---|
Use Scenario: Real-time servo loop coordination in multi-axis CNC controllers. IC Role / Device Role / Timing Role: FPGA logic fabric implementing position interpolation, PWM generation, and encoder feedback decoding. Use Value: Deterministic 4.5 ns CLB delay ensures sub-microsecond control cycle timing critical for jitter-sensitive motion profiles. | Use Scenario: Protocol translation between RS-485 fieldbus and SPI-based microcontroller subsystems. IC Role / Device Role / Timing Role: Glue logic performing data framing, parity insertion, and baud rate adaptation. Use Value: 3.3 V I/O tolerance allows direct connection to both legacy transceivers and modern MCU peripherals without voltage translation. |
| Test Equipment Signal Generation | Embedded Video Preprocessing |
Use Scenario: Arbitrary waveform synthesis in automated test equipment using DAC interface and timing sequencer. IC Role / Device Role / Timing Role: Synchronized pattern generator controlling DAC update timing and trigger synchronization. Use Value: Master Serial configuration mode enables fast firmware updates during calibration without hardware modification. | Use Scenario: Pixel format conversion and line buffering prior to display controller ingestion in medical imaging displays. IC Role / Device Role / Timing Role: Frame buffer controller managing dual-port RAM access and pixel clock domain crossing. Use Value: 256-ball BGA provides sufficient I/O count to manage parallel RGB data bus, sync signals, and memory address/control lines simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS40XL-3BG256C | Slower -3 speed grade (5.5 ns CLB delay); otherwise identical architecture and pinout | Suitable where timing margin exceeds 100 MHz system clock requirements | Select when cost sensitivity outweighs need for maximum operating frequency |
| XCS50XL-4BG256C | Higher 50K-gate capacity; same -4 speed grade and 256-ball BGA footprint | Required when additional logic resources needed for expanded feature sets or larger state machines | Choose when design scalability or future-proofing justifies higher gate count and cost |
Compared with XCS40XL-4BG256C, the -3 variant trades speed for cost in timing-relaxed designs, while the XCS50XL-4BG256C retains identical timing and packaging but adds 10K extra gates-enabling more complex control logic without PCB redesign.
Availability
XCS40XL-4BG256C is available at Aetrix Electronics and suitable for industrial motion control, digital communication interface bridging, and embedded video preprocessing requiring stable component supply and long-term manufacturing continuity.
Supply support for XCS40XL-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, integrating programmable logic technology into its adaptive computing portfolio. Xilinx pioneered SRAM-based FPGAs for high-performance reconfigurable systems.
The Spartan-XL family was designed for cost-sensitive, high-volume embedded applications requiring reliable reprogrammable logic with commercial temperature support and 3.3 V I/O compatibility.
FAQ
What is the configuration method supported by the XCS40XL-4BG256C?
The XCS40XL-4BG256C supports Master Serial, Slave Parallel, and IEEE 1149.1 JTAG configuration modes. Master Serial uses an external serial PROM; Slave Parallel allows microprocessor-controlled loading; JTAG enables boundary-scan testing and in-system programming. All methods initialize the internal SRAM configuration memory on power-up or PROGRAM_B assertion.
Does the XCS40XL-4BG256C have internal non-volatile configuration memory?
No, the XCS40XL-4BG256C relies on external configuration sources. It contains no internal flash or EEPROM. Configuration data is loaded into volatile SRAM each time power is applied or after a PROGRAM_B reset. Persistent storage requires an external serial PROM or host processor intervention.
What is the significance of the "-4" speed grade in XCS40XL-4BG256C?
The "-4" speed grade in XCS40XL-4BG256C specifies a maximum CLB propagation delay of 4.5 ns under worst-case commercial temperature and voltage conditions. This rating guarantees timing closure for synchronous logic operating up to approximately 100 MHz, enabling deterministic real-time control in industrial and instrumentation applications.
Can the XCS40XL-4BG256C operate with mixed I/O voltages?
No, the XCS40XL-4BG256C supports only 3.3 V I/O operation across all banks. It lacks multi-voltage I/O capability or bank-specific voltage selection. All VCCO pins must be supplied with 3.3 V, and interfacing with 5 V or 1.8 V systems requires external level-shifting circuitry.
Is the XCS40XL-4BG256C pin-compatible with other Spartan-XL devices in the same package?
Yes, all Spartan-XL devices in the 256-ball BGA package-including XCS30XL, XCS40XL, and XCS50XL variants-share identical pinouts. This allows direct substitution based on logic density needs without PCB layout changes, provided power delivery and thermal design accommodate the specific device's current draw.
XCS40XL-4BG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-XL
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 784
- Number of Logic Elements/Cells:
- 1862
- Total RAM Bits:
- 25088
- Number of I/O:
- 205
- Number of Gates:
- 40000
- Voltage - Supply:
- 3V ~ 3.6V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCS40XL-4BG256C FAQ
1.How can I place an order for XCS40XL-4BG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS40XL-4BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS40XL-4BG256C reliable?
The price and inventory of XCS40XL-4BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS40XL-4BG256C is usually 5 days.
3.What payment methods are accepted for XCS40XL-4BG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS40XL-4BG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS40XL-4BG256C?
XCS40XL-4BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS40XL-4BG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS40XL-4BG256C?
For technical support, including XCS40XL-4BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS40XL-4BG256C requirements.
6.How does Aetrix verify that XCS40XL-4BG256C is sourced from the original manufacturer or authorized distributors?
All XCS40XL-4BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS40XL-4BG256C meets industry standards.
7.What is the process for return or replacement of XCS40XL-4BG256C?
All XCS40XL-4BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS40XL-4BG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS40XL-4BG256C part is unused and in its original packaging.
Return procedure for XCS40XL-4BG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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