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AMD XCS40XL-4BG256I
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- Part No.:
- XCS40XL-4BG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCS40XL-4BG256I.pdf
- Description:
- IC FPGA 205 I/O 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,211
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Product details
Overview
XCS40XL-4BG256I from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 40,000 system gates, 256-ball BGA package, -4 speed grade, and industrial temperature range (–40°C to +100°C); used in legacy industrial control and reconfigurable I/O interface designs.
For engineers reviewing the XCS40XL-4BG256I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (184 user I/Os), configuration mode (serial PROM or boundary-scan), and compliance with IEEE 1149.1 JTAG test standard.
Technical Context
The XCS40XL-4BG256I implements configurable logic blocks (CLBs) with distributed RAM and flip-flops, supporting synchronous design with global clock routing and three dedicated clock pins. It uses SRAM-based configuration with external serial PROM or parallel programming via JTAG boundary-scan.
Configuration occurs on power-up using external 8-pin serial PROM (e.g., XCF01S/XCF02S), and supports in-system programmability via IEEE 1149.1-compliant TDI/TDO/TCK/TMS pins. No internal configuration memory is present.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Gates | 40,000 system gates - defines maximum combinational logic capacity for gate-equivalent synthesis |
| User I/O Pins | 184 - supports high-density peripheral interfacing with configurable voltage and slew rate |
| Speed Grade | -4 - guarantees 4 ns CLB propagation delay under industrial temperature and voltage conditions |
| Operating Temp | –40°C to +100°C - qualified for extended-temperature industrial environments |
| Package | 256-ball BGA (17×17 mm, 1.27 mm pitch) - requires standard BGA reflow profile and PCB escape routing |
| Configuration | Serial PROM or JTAG boundary-scan - no internal flash; external memory required for power-on initialization |
Pinout & Package
256-ball fine-pitch BGA (17×17 array, 1.27 mm pitch), RoHS-compliant, with corner balls designated as NC and center thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1, G2, H1, H2 | VCCINT | 2.5 V core supply inputs - must be decoupled locally with 0.1 µF ceramic capacitors |
| A1, A2, B1, B2 | VCCO | 3.3 V I/O supply inputs - separate from VCCINT; supports mixed-voltage I/O banks |
| T14, T15, U14, U15 | TCK, TMS, TDI, TDO | JTAG boundary-scan test interface - enables programming and debug without dedicated programming header |
| P1, P2, R1 | CLK0, CLK1, CLK2 | Dedicated global clock inputs - low-skew routing to all CLBs; no general-purpose I/O function |
| M1, N1, P1, R1 | PROGRAM_, INIT_, DONE, CCLK | Configuration control signals - PROGRAM_ resets config memory; DONE indicates successful load completion |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1149.1 JTAG Support | Enables in-circuit configuration, verification, and boundary-scan testing without external programming hardware |
| Three Dedicated Clock Pins | Provides deterministic low-jitter clock distribution to all logic resources without consuming general I/O |
| 184 User-Configurable I/Os | Supports multi-bank voltage operation (3.3 V) and programmable drive strength/slew rate per pin |
| SRAM-Based Configuration | Allows unlimited reprogramming cycles but requires external nonvolatile memory for power-up loading |
Applications
| Industrial Motion Control | Legacy Test Equipment |
|---|---|
Use Scenario: Real-time axis coordination and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom PWM generators, quadrature decoders, and safety interlock state machines. Use Value: Enables deterministic sub-microsecond response latency and field-upgradable control algorithms without ASIC redesign. | Use Scenario: Signal routing, pattern generation, and protocol translation in automated test systems. IC Role / Device Role / Timing Role: Reconfigurable glue logic replacing discrete TTL/PLD components between instrument controllers and DUT interfaces. Use Value: Reduces board count and supports multiple test standards (e.g., GPIB, VXI, custom LVDS) via same hardware footprint. |
| Avionics Data Acquisition | Medical Imaging Interface |
Use Scenario: Sensor data aggregation and ARINC 429 bus interfacing in flight data recorders. IC Role / Device Role / Timing Role: Synchronous sampling controller with embedded FIFO buffering and serial bus encoding logic. Use Value: Meets DO-254 design assurance level DAL-C requirements when implemented with certified tool flow and constraints. | Use Scenario: High-speed pixel data serialization and timing alignment between image sensors and FPGA-based processing pipelines. IC Role / Device Role / Timing Role: Source-synchronous interface bridge with programmable deskew and DDR capture logic. Use Value: Supports 80 MSPS pixel clock rates with <1 UI jitter tolerance using dedicated I/O registers and delay chains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS30XL-4BG256I | 30,000 system gates, identical package and speed grade | Lower logic density limits complex state machines and larger datapaths | Select when design fits within 30K gates and cost reduction is prioritized over headroom |
| XCS50XL-4BG256I | 50,000 system gates, same package and speed grade | Higher gate count supports additional peripherals or deeper pipeline stages | Choose when future feature expansion or higher throughput is required without PCB change |
Compared with XCS30XL-4BG256I and XCS50XL-4BG256I, the XCS40XL-4BG256I provides optimal balance of logic capacity, I/O count, and thermal margin for mid-complexity industrial control designs where gate utilization targets 70–85%.
Availability
XCS40XL-4BG256I is available at Aetrix Electronics and suitable for industrial motion control, avionics data acquisition, and medical imaging interface applications requiring stable component supply and long-term obsolescence management.
Supply support for XCS40XL-4BG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-XL product support for industrial and aerospace customers.
The Spartan-XL family was designed for cost-sensitive, high-reliability applications requiring reconfigurable logic with predictable timing and extended temperature operation.
FAQ
What is the configuration method supported by XCS40XL-4BG256I?
The XCS40XL-4BG256I supports configuration via external serial PROM (e.g., XCF01S) or IEEE 1149.1 JTAG boundary-scan. It lacks internal nonvolatile memory, so external storage is mandatory for power-on initialization. The XCS40XL-4BG256I requires PROGRAM_, INIT_, DONE, and CCLK signals to manage configuration sequence and status reporting.
Does XCS40XL-4BG256I support hot-swap or live insertion?
No, the XCS40XL-4BG256I is not rated for hot-swap operation. Its I/O structure and power sequencing requirements mandate full power-down before insertion or removal. The XCS40XL-4BG256I datasheet specifies strict ramp-rate and sequencing order for VCCINT and VCCO to prevent latch-up or configuration corruption.
What is the maximum operating frequency for internal logic in XCS40XL-4BG256I?
The XCS40XL-4BG256I -4 speed grade guarantees a 4 ns CLB propagation delay, enabling internal logic operation up to approximately 125 MHz for typical register-to-register paths. Actual system frequency depends on routing, fanout, and placement; the XCS40XL-4BG256I does not specify a hard maximum clock frequency independent of design constraints.
Can XCS40XL-4BG256I be reprogrammed in the field?
Yes, the XCS40XL-4BG256I supports unlimited in-system reprogramming via JTAG boundary-scan or serial PROM reload. Reprogramming requires external configuration source and does not alter the device's physical structure. The XCS40XL-4BG256I retains no configuration state after power loss and must be reloaded each power cycle.
Is XCS40XL-4BG256I compliant with RoHS and REACH?
Yes, the XCS40XL-4BG256I is RoHS-compliant (Pb-free BGA solder balls) and meets EU REACH SVHC requirements as documented in AMD's official product change notices. The XCS40XL-4BG256I packaging uses halogen-free molding compound and conforms to IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
XCS40XL-4BG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-XL
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 784
- Number of Logic Elements/Cells:
- 1862
- Total RAM Bits:
- 25088
- Number of I/O:
- 205
- Number of Gates:
- 40000
- Voltage - Supply:
- 3V ~ 3.6V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCS40XL-4BG256I FAQ
1.How can I place an order for XCS40XL-4BG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS40XL-4BG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS40XL-4BG256I reliable?
The price and inventory of XCS40XL-4BG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS40XL-4BG256I is usually 5 days.
3.What payment methods are accepted for XCS40XL-4BG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS40XL-4BG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS40XL-4BG256I?
XCS40XL-4BG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS40XL-4BG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS40XL-4BG256I?
For technical support, including XCS40XL-4BG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS40XL-4BG256I requirements.
6.How does Aetrix verify that XCS40XL-4BG256I is sourced from the original manufacturer or authorized distributors?
All XCS40XL-4BG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS40XL-4BG256I meets industry standards.
7.What is the process for return or replacement of XCS40XL-4BG256I?
All XCS40XL-4BG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCS40XL-4BG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS40XL-4BG256I part is unused and in its original packaging.
Return procedure for XCS40XL-4BG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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