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AMD XCS40XL-5BG256C
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- Part No.:
- XCS40XL-5BG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCS40XL-5BG256C.pdf
- Description:
- IC FPGA 205 I/O 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,594
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Product details
Overview
XCS40XL-5BG256C from AMD (formerly Xilinx) is a Spartan-XL family FPGA with 40,000 system gates, 256-pin BGA package, 5 ns CLB propagation delay, and support for 3.3 V I/O operation. It serves as a reconfigurable logic fabric in industrial control modules requiring deterministic timing and moderate gate density.
For engineers reviewing the XCS40XL-5BG256C datasheet, pinout, applications, or equivalent options, key selection criteria include CLB count, I/O voltage compatibility, configuration mode (JTAG/Slave Serial), maximum system frequency, and thermal performance in compact enclosures.
Technical Context
The XCS40XL-5BG256C implements a hierarchical architecture with Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and interconnect resources. It uses SRAM-based configuration with external PROM or processor-controlled loading via JTAG or Slave Serial mode.
It supports 3.3 V LVTTL/LVCMOS I/O standards with programmable slew rate and drive strength per bank. Configuration bitstream integrity is maintained through CRC checking during startup, and partial reconfiguration is not supported.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Gates | 40,000 system gates - defines total combinational logic capacity for medium-complexity digital functions |
| CLB Propagation Delay | 5 ns - enables synchronous operation up to ~160 MHz in critical paths with minimal routing overhead |
| I/O Voltage | 3.3 V - compatible with standard LVTTL/LVCMOS interfaces without level-shifting circuitry |
| Package | 256-pin Ball Grid Array (BGA) - provides high I/O density and thermal dissipation for board-level integration |
| Configuration Mode | JTAG & Slave Serial - allows in-system programming and host-controlled initialization |
| Operating Temperature | 0 °C to 70 °C - rated for commercial-grade environments including office automation and test equipment |
Pinout & Package
256-pin Fine-Pitch BGA (FBGA) package with 1.27 mm ball pitch, 17 × 17 array, and thermal pad on underside for enhanced heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply for Bank 0 - must be decoupled locally to maintain signal integrity |
| K1 | GND | Ground reference for core and I/O - connects to internal ground plane for noise reduction |
| M1 | VCCINT | Core logic supply (3.3 V) - powers CLBs and interconnect; requires low-noise regulation |
| T1 | TCK | JTAG test clock input - synchronizes boundary-scan operations during programming and debug |
| R2 | TMS | JTAG test mode select - controls state transitions of TAP controller |
| P2 | TDO | JTAG test data output - serially returns scan chain data during verification |
| N2 | TDI | JTAG test data input - serially loads instruction and data into scan chains |
| U14 | PROGRAM_B | Active-low configuration reset - forces reinitialization and reloads bitstream from external source |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based configuration | Enables fast, repeatable reprogramming without UV erasure or flash wear-out concerns |
| CRC configuration verification | Detects bitstream corruption at power-up, preventing functional failure due to corrupted logic mapping |
| Per-bank I/O voltage control | Allows mixed-voltage interfacing (e.g., 3.3 V FPGA core driving 2.5 V peripherals) within single device |
| Programmable slew rate | Reduces EMI and signal overshoot by limiting edge rates on high-speed outputs |
| JTAG boundary-scan support | Enables PCB-level interconnect testing and in-system debugging without physical probe access |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and controller bus. IC Role / Device Role / Timing Role: Reconfigurable logic fabric implementing custom timing engines, debounce filters, and SPI-to-parallel bridges. Use Value: Enables field-upgradable logic behavior without hardware redesign, supporting evolving sensor interface standards. | Use Scenario: High-speed pattern generation and response capture in semiconductor wafer probing systems. IC Role / Device Role / Timing Role: Synchronous state machine coordinating stimulus timing, DUT clocking, and result sampling with sub-10 ns resolution. Use Value: Delivers deterministic latency and precise edge alignment required for nanosecond-level test vector execution. |
| Medical Imaging Control Board | Communications Backplane Interface |
Use Scenario: Managing timing-critical sequencing of X-ray detector readout and analog front-end calibration cycles. IC Role / Device Role / Timing Role: Dedicated timing sequencer generating gated clocks, reset pulses, and enable signals synchronized to master imaging clock. Use Value: Ensures pixel data integrity by eliminating metastability in multi-domain clock domain crossings. | Use Scenario: Glue logic bridging legacy parallel backplane protocols to modern serial management interfaces. IC Role / Device Role / Timing Role: Protocol translator handling handshaking, parity insertion, and address decoding across mismatched bus widths. Use Value: Extends service life of installed infrastructure by enabling interoperability without full system replacement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCS40XL-4BG256C | 4 ns CLB delay vs. 5 ns - higher max frequency but tighter timing closure requirements | Suitable where sub-200 MHz synchronous paths dominate; less margin for long interconnects | Select when timing budget permits stricter constraints and higher clock rates are mandatory |
| XCS40XL-5PQ208C | 208-pin PQFP package vs. 256-pin BGA - lower I/O count and inferior thermal performance | Better suited for prototyping or low-volume assemblies where BGA rework is impractical | Choose for manual assembly environments or cost-sensitive designs accepting reduced I/O and thermal headroom |
Compared with XCS40XL-5BG256C, the -4BG256C offers faster timing at the expense of design margin, while the -5PQ208C trades package density and thermal capability for assembly flexibility - selection depends on whether performance, thermal management, or manufacturability is the dominant constraint.
Availability
XCS40XL-5BG256C is available at Aetrix Electronics and suitable for industrial control, automated test equipment, and medical imaging subsystems requiring stable component supply and long-term obsolescence planning.
Supply support for XCS40XL-5BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022, inheriting its FPGA portfolio including the Spartan-XL family. AMD is a global leader in adaptive computing solutions for data center, embedded, and edge applications.
The Spartan-XL family was designed for cost-sensitive, high-volume applications requiring reliable reconfigurable logic with commercial temperature range and 3.3 V I/O compatibility - targeting industrial automation and instrumentation markets.
FAQ
What is the configuration method supported by the XCS40XL-5BG256C?
The XCS40XL-5BG256C supports JTAG and Slave Serial configuration modes. JTAG enables in-system programming and boundary-scan testing, while Slave Serial allows host processor-controlled initialization using an external PROM or microcontroller. Both methods load the SRAM-based configuration bitstream at power-up or upon assertion of PROGRAM_B.
Does the XCS40XL-5BG256C support partial reconfiguration?
No, the XCS40XL-5BG256C does not support partial reconfiguration. Its SRAM-based architecture requires full bitstream reload for any logic change. Configuration is atomic: the entire device is initialized from external memory or JTAG interface, and no runtime modification of active logic blocks is possible.
What I/O standards are compatible with the XCS40XL-5BG256C?
The XCS40XL-5BG256C supports 3.3 V LVTTL and LVCMOS I/O standards across all banks. Each bank can be independently powered at 3.3 V, and drive strength/slew rate are programmable per output. It does not support 2.5 V, 1.8 V, or differential standards like LVDS or RSDS.
Is the XCS40XL-5BG256C RoHS compliant?
Yes, the XCS40XL-5BG256C is RoHS compliant and lead-free. It meets EU Directive 2011/65/EU requirements, with Pb-free solder ball composition and halogen-free packaging materials consistent with Xilinx's commercial product release specifications.
What is the maximum operating junction temperature for the XCS40XL-5BG256C?
The XCS40XL-5BG256C has a maximum operating junction temperature of 100 °C. Its commercial temperature grade (0 °C to 70 °C ambient) assumes adequate PCB thermal design - including copper pour, thermal vias under the BGA, and airflow - to maintain junction temperature within specification under full static and dynamic loading.
XCS40XL-5BG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-XL
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 784
- Number of Logic Elements/Cells:
- 1862
- Total RAM Bits:
- 25088
- Number of I/O:
- 205
- Number of Gates:
- 40000
- Voltage - Supply:
- 3V ~ 3.6V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCS40XL-5BG256C FAQ
1.How can I place an order for XCS40XL-5BG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCS40XL-5BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCS40XL-5BG256C reliable?
The price and inventory of XCS40XL-5BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCS40XL-5BG256C is usually 5 days.
3.What payment methods are accepted for XCS40XL-5BG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCS40XL-5BG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCS40XL-5BG256C?
XCS40XL-5BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCS40XL-5BG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCS40XL-5BG256C?
For technical support, including XCS40XL-5BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCS40XL-5BG256C requirements.
6.How does Aetrix verify that XCS40XL-5BG256C is sourced from the original manufacturer or authorized distributors?
All XCS40XL-5BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCS40XL-5BG256C meets industry standards.
7.What is the process for return or replacement of XCS40XL-5BG256C?
All XCS40XL-5BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCS40XL-5BG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCS40XL-5BG256C part is unused and in its original packaging.
Return procedure for XCS40XL-5BG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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