AMD XCV1000-4BG560C
- Part No.:
- XCV1000-4BG560C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV1000-4BG560C.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,162
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCV1000-4BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 1,124,022 system gates, 27,648 logic cells in a 64×96 CLB array, and 404 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 131,072 bits of block SelectRAM), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV1000-4BG560C datasheet, pinout, applications, or equivalent options, key selection considerations include its -4 speed grade (200 MHz system performance), 2.5 V core voltage, BG560 package thermal and routing constraints, and compatibility with SelectIO™ standards including LVTTL, SSTL3, HSTL Class IV, and PCI 3.3 V.
Technical Context
The XCV1000-4BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or shift registers.
I/O functionality is organized into eight independent banks supporting mixed-voltage signaling; each bank requires shared VCCO and a single VREF. The device integrates 32 block SelectRAMs (4,096-bit synchronous dual-ported RAM per block), dedicated carry chains for arithmetic, and IEEE 1149.1 boundary-scan logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1,124,022 - defines maximum combinational logic capacity for ASIC replacement or complex digital system integration |
| Logic Cells | 27,648 - provides fine-grained programmable resources for high-density logic synthesis and place-and-route efficiency |
| User I/O Pins | 404 - enables high-pin-count interface consolidation (e.g., memory buses, parallel video, multi-protocol I/O) |
| Block RAM Bits | 131,072 - supports on-chip buffering, FIFOs, and data coalescing without external memory |
| Speed Grade | -4 - guarantees 200 MHz system clock performance under worst-case timing conditions including I/O paths |
| Core Voltage | 2.5 V - requires dedicated low-noise 2.5 V supply with tight regulation (< ±3%) for stable configuration and operation |
| Package Type | BG560 - 560-ball ball grid array with 1.27 mm pitch; thermal and mechanical design must accommodate 25.6 mm × 25.6 mm footprint |
Pinout & Package
The XCV1000-4BG560C is housed in a 560-ball fine-pitch BGA (BG560) package with eight I/O banks, four dedicated DLL clock inputs, four global clock pins (GCLK0–GCLK3), and power/ground distribution optimized for 2.5 V core and multiple VCCO domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew primary clock distribution network inputs; must be driven by low-jitter sources to meet DLL setup/hold requirements |
| CLKIN | DLL Reference Input | Feeds internal delay-locked loops; frequency determines achievable output clock stability and jitter performance |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and forces reinitialization on next CCLK edge |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or error; pulled high externally during normal operation |
| CCLK | Configuration Clock | Drives master serial configuration mode; frequency ≤ 25 MHz required for reliable bitstream loading |
| DONE | Configuration Completion | Open-drain status signal asserted high when configuration is successfully completed and device enters user mode |
Key Features
| Feature | Design Value |
|---|---|
| Four integrated DLLs | Enables zero-hold-time I/O timing, clock deskew across large designs, and phase-aligned clock domain crossing |
| Configurable LUT-as-RAM | Each 4-input LUT can serve as 16×1-bit synchronous RAM or combine with adjacent LUTs for 32×1-bit or 16×2-bit RAM - eliminates need for small external SRAM |
| Eight independent I/O banks | Allows simultaneous use of LVTTL (3.3 V), SSTL3 (1.5 V), and HSTL (1.5 V) interfaces on same device without level-shifting circuitry |
| Dual-ported block SelectRAM | 32 blocks × 4,096 bits with independent read/write ports per block - supports concurrent data acquisition and processing pipelines |
| IEEE 1149.1 boundary scan | Enables full-board JTAG testing, interconnect verification, and in-system programming without physical probe access |
Applications
| High-Speed Communications Backplane | PCI-Based Industrial Control System |
|---|---|
Use Scenario: Implementing protocol bridging, packet classification, and real-time traffic shaping between 66-MHz PCI-X peripherals and SerDes-based line cards. IC Role / Device Role / Timing Role: FPGA acts as a reconfigurable interposer managing clock domain crossing between PCI clock domain and high-speed serial links using DLL-synchronized clocks. Use Value: Leverages 404 I/O and 200 MHz system performance to sustain full 528 MB/s PCI-X bandwidth while offloading CPU-intensive packet inspection tasks. | Use Scenario: Replacing fixed-function ASICs in modular PLC chassis requiring hot-swap capability and field-upgradable logic for motion control sequencing. IC Role / Device Role / Timing Role: Configurable logic engine executing deterministic I/O scanning, PID loop execution, and safety monitoring with sub-microsecond jitter control via DLL-managed clocks. Use Value: Uses built-in 66-MHz PCI compliance and hot-swap support to enable live module replacement without system shutdown or firmware reload. |
| Medical Imaging Data Acquisition | Defense Radar Signal Processing |
Use Scenario: Aggregating parallel ADC streams (e.g., 16× 100 MSPS channels) and performing real-time FIR filtering before DDR2 memory buffering. IC Role / Device Role / Timing Role: High-bandwidth data concentrator and preprocessor using distributed LUT RAM for coefficient storage and block SelectRAM for pipeline staging. Use Value: Achieves >1.6 Gbps aggregate I/O throughput using 404 pins and exploits dedicated carry logic for low-latency arithmetic operations. | Use Scenario: Implementing pulse-Doppler processing, beamforming weighting, and CFAR detection in airborne radar systems operating under extreme temperature ranges. IC Role / Device Role / Timing Role: Radiation-tolerant (via configuration scrubbing) reprogrammable signal processor handling multi-channel IF sampling and FFT acceleration using CLB-based butterfly units. Use Value: Relies on die-temperature sensor diode and industrial-grade (-40°C to +100°C) qualification (I-grade variant) for thermal-aware timing closure in avionics enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000-6BG560C | Faster -6 speed grade (225 MHz max system clock); identical logic density, I/O count, and package | Required where worst-case timing margins demand higher clock frequencies or lower propagation delays | Select when design timing closure fails at -4 grade or when future-proofing for higher-performance revisions |
| XCV800-4BG560C | Lower density: 888,439 system gates, 21,168 logic cells, 114,688 block RAM bits; otherwise identical package and speed grade | Suitable for cost-optimized implementations where logic utilization remains below ~75% of XCV1000 capacity | Choose to reduce BOM cost and power consumption when full XCV1000 resources are unused |
Compared with XCV1000-4BG560C, the -6 variant delivers tighter timing margins for high-frequency control loops, while the XCV800-4BG560C reduces static power by ~22% and silicon cost by ~18% at the expense of 21% fewer logic cells and 13% less block RAM - both retain full pin compatibility and toolchain support within the Virtex family.
Availability
XCV1000-4BG560C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial automation controllers, medical imaging subsystems, and defense electronics requiring stable component supply throughout extended product lifecycles.
Supply support for XCV1000-4BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.
The Virtex family - including XCV1000-4BG560C - was engineered for demanding applications requiring high logic density, multi-standard I/O flexibility, and deterministic timing, targeting communications infrastructure, test equipment, and aerospace systems.
FAQ
What is the maximum operating frequency supported by the XCV1000-4BG560C?
The XCV1000-4BG560C has a -4 speed grade specifying guaranteed synchronous system clock performance up to 200 MHz, including I/O paths. This rating is validated under worst-case commercial temperature (0°C to +85°C) and voltage conditions. Actual achievable frequency depends on design complexity, placement, and routing; benchmarked register-to-register paths achieve 5.0 ns propagation delay. The XCV1000-4BG560C datasheet (DS003-3) provides detailed DC and switching characteristics for timing analysis.
Does the XCV1000-4BG560C support hot-swap operation in Compact PCI systems?
Yes, the XCV1000-4BG560C explicitly supports hot-swappable operation in Compact PCI systems as stated in its official product specification (DS003-1 v4.0). This capability relies on robust I/O protection circuitry, controlled power-up sequencing, and IEEE 1149.1 boundary-scan testability to ensure safe insertion/removal without disrupting bus arbitration or corrupting configuration state. The XCV1000-4BG560C's I/O structure includes dedicated weak-keeper circuits and programmable pull-ups to maintain valid logic levels during transition states.
How many block SelectRAM modules does the XCV1000-4BG560C contain, and what is their configuration flexibility?
The XCV1000-4BG560C contains 32 block SelectRAM modules, totaling 131,072 bits of dedicated memory. Each block is a fully synchronous dual-ported 4,096-bit RAM with independent address, data, and control buses per port. Width/depth configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion (e.g., 32-bit input to 16-bit output) without external glue logic. This capability is documented in DS003-2 Table 4 and Figure 6 for the XCV1000-4BG560C.
What I/O standards are supported by the XCV1000-4BG560C, and how are they managed across I/O banks?
The XCV1000-4BG560C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V, SSTL3 Class I/II, HSTL Class I/III/IV, GTL/GTL+, and CTT. These are managed across eight independent I/O banks - four per side - where each bank requires a common VCCO voltage and (if needed) a shared VREF. Compatible standards per VCCO are defined in DS003-2 Table 2; for example, 3.3 V banks support LVTTL and PCI, while 1.5 V banks support HSTL and SSTL3. This banking constraint directly affects PCB layout for the XCV1000-4BG560C.
Is the XCV1000-4BG560C still in active production, and what lifecycle support does Aetrix Electronics provide?
No - the XCV1000-4BG560C is officially obsolete, as confirmed in DS003-1 v4.0 (March 2013) and Xilinx Notice XCN10016. Aetrix Electronics provides legacy supply chain support including verified surplus inventory, traceable lot history, extended warranty, and obsolescence mitigation planning. For new designs, Aetrix recommends migration paths to Spartan-7 or Artix-7 families; however, the XCV1000-4BG560C remains available for repair, maintenance, and long-lifecycle program fulfillment under controlled allocation.
XCV1000-4BG560C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 131072
- Number of I/O:
- 404
- Number of Gates:
- 1124022
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV1000-4BG560C FAQ
1.How can I place an order for XCV1000-4BG560C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000-4BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000-4BG560C reliable?
The price and inventory of XCV1000-4BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000-4BG560C is usually 5 days.
3.What payment methods are accepted for XCV1000-4BG560C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000-4BG560C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000-4BG560C?
XCV1000-4BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000-4BG560C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000-4BG560C?
For technical support, including XCV1000-4BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000-4BG560C requirements.
6.How does Aetrix verify that XCV1000-4BG560C is sourced from the original manufacturer or authorized distributors?
All XCV1000-4BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000-4BG560C meets industry standards.
7.What is the process for return or replacement of XCV1000-4BG560C?
All XCV1000-4BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000-4BG560C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000-4BG560C part is unused and in its original packaging.
Return procedure for XCV1000-4BG560C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV1000-4BG560C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
