AMD XCV1000-4BG560I

Overview

XCV1000-4BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 1,124,022 system gates, 27,648 logic cells in a 64×96 CLB array, and 512 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (131,072 bits of block RAM + distributed LUT RAM), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV1000-4BG560I datasheet, pinout, applications, or equivalent options, key selection criteria include its industrial temperature range (–40°C to +100°C), speed grade –4 (typical 160 MHz system performance), SelectIO™ interface support across 16 standards, and dual-port 4k-bit synchronous block RAM per 4-CLB column.

Technical Context

The XCV1000-4BG560I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each-each with 4-input LUTs configurable as 16-bit RAM, shift registers, or dual-ported RAM-and dedicated carry chains for high-speed arithmetic.

I/O functionality is organized into eight banks, each supporting independent VCCO and VREF voltages; compatible standards per bank include LVTTL, SSTL3, HSTL Class IV, and GTL/GTL+, with 5 V tolerance on select inputs. Configuration is SRAM-based via JTAG, SelectMAP™, or master/slave serial modes, with IEEE 1149.1 boundary-scan support.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant, thermally enhanced with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV1000-4BG560I, the –6 variant delivers higher timing margin for aggressive clock rates, while the XCV800-4BG560I offers identical footprint and interface compatibility at lower logic capacity-enabling scalable design reuse across performance tiers without layout change.

Availability

XCV1000-4BG560I is available at Aetrix Electronics and suitable for industrial control systems, telecom line cards, high-speed data acquisition platforms, and reconfigurable protocol gateways requiring stable component supply across extended product lifecycles.

Supply support for XCV1000-4BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it delivers high-performance FPGAs, adaptive SoCs, and AI inference acceleration solutions.

The Virtex family was designed for high-end system integration-targeting applications demanding maximum logic density, bandwidth, and deterministic timing, such as wired/wireless infrastructure, defense electronics, and scientific instrumentation.

FAQ

What is the operating voltage requirement for XCV1000-4BG560I?

XCV1000-4BG560I requires two primary supply rails: VCCINT = 2.5 V ± 3% for core logic and routing, and bank-specific VCCO (1.5 V, 2.5 V, or 3.3 V) for I/O drivers. Each of the eight I/O banks has independent VCCO and VREF pins, enabling mixed-voltage interface design. Decoupling must follow Xilinx's recommended capacitor placement and values per DS003-3.

Is XCV1000-4BG560I still in production or obsolete?

XCV1000-4BG560I is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and is no longer manufactured. However, Aetrix Electronics maintains verified legacy inventory with full traceability, conforming to original Xilinx specifications and industrial temperature grading. Obsolescence status does not affect functional equivalence or technical support for existing designs.

Does XCV1000-4BG560I support JTAG configuration?

Yes, XCV1000-4BG560I fully supports IEEE 1149.1 JTAG configuration via TCK, TMS, TDI, and TDO pins. This mode enables in-system programming, boundary-scan testing, and debug access without requiring external PROMs or configuration controllers. JTAG is one of four supported configuration methods, alongside master serial, slave serial, and SelectMAP™.

What memory resources are available on XCV1000-4BG560I?

XCV1000-4BG560I provides 131,072 bits of block SelectRAM (32 × 4k-bit dual-port synchronous RAMs) plus distributed memory from 4-input LUTs-configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register. The block RAM supports independent read/write addresses and widths per port, enabling efficient FIFOs, frame buffers, and lookup tables.

Can XCV1000-4BG560I interface directly with DDR SDRAM?

XCV1000-4BG560I supports DDR SDRAM interfacing through its SelectIO™ I/O banks configured for SSTL2 Class I/II (2.5 V) or SSTL3 Class I/II (3.3 V), provided proper board-level termination and timing closure. While it lacks dedicated DDR PHY logic, hardened memory controllers were implemented in user logic using DLL-aligned clocks and precise output enable timing-documented in Xilinx Application Note XAPP128.