AMD XCV1000-4FG680C

Overview

XCV1000-4FG680C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 1,124,022 system gates, 27,648 logic cells in a 64×96 CLB array, and 512 user I/O pins in a 680-ball fine-pitch BGA package. It supports 66-MHz PCI compliance, hot-swappable Compact PCI operation, and features four dedicated delay-locked loops (DLLs) for advanced clock control - deployed in high-speed communications infrastructure and reconfigurable computing systems.

For engineers reviewing the XCV1000-4FG680C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, 131,072-bit block RAM capacity, 4k-bit configurable dual-ported synchronous RAM per block, SelectIO™ interface support across 16 standards, and die-temperature sensor diode integration.

Technical Context

The XCV1000-4FG680C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 secondary local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain four logic cells each - each with 4-input LUTs usable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift registers - and dedicated carry logic enabling high-speed arithmetic.

Each IOB supports IEEE 1149.1 boundary-scan, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and configurable input/output flip-flops with independent clock enable, synchronous/asynchronous set/reset, and polarity control. I/O banking enforces VCCO and VREF voltage grouping across eight banks, supporting mixed standards only when compatible per Table 2 (e.g., HSTL Class IV at 1.5 V VCCO).

Key Specifications

Pinout & Package

XCV1000-4FG680C uses a 680-ball fine-pitch ball grid array (FG680) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. Pin functions follow Xilinx DS003-4 (v4.0) Module 4 pinout tables, with dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), four global clock inputs (GCLK0–GCLK3), and eight I/O banks (Bank 0–7) requiring segregated VCCO and VREF supplies.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV1000-4FG680C, the -6 variant delivers tighter timing margins for high-frequency control loops, while the XCV800-4FG680C reduces unit cost and power by 22% at the expense of 21% fewer logic cells and 13% less block RAM - making it viable only when design fits with ≥15% resource margin.

Availability

XCV1000-4FG680C is available at Aetrix Electronics and suitable for industrial motion control, PCI-based data acquisition, baseband signal processing, and reconfigurable computing applications requiring stable component supply amid obsolescence transitions.

Supply support for XCV1000-4FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools now integral to adaptive computing platforms.

The Virtex family - including XCV1000-4FG680C - was engineered for high-performance, high-density reconfigurable logic in telecommunications infrastructure, military/aerospace systems, and scientific instrumentation demanding 200 MHz synchronous operation and mixed-signal interface flexibility.

FAQ

What is the operating temperature range for XCV1000-4FG680C?

XCV1000-4FG680C is rated for commercial temperature operation from 0°C to +85°C (TJ). This range is defined by the "C" suffix in the ordering code and applies to junction temperature under steady-state conditions with proper PCB thermal design. The integrated die-temperature sensor diode enables real-time monitoring but does not extend the specified operating envelope beyond 85°C.

Does XCV1000-4FG680C support JTAG boundary scan?

Yes, XCV1000-4FG680C fully implements IEEE 1149.1 boundary-scan logic across all user I/O pins and internal logic resources. The TCK, TMS, TDI, and TDO pins are dedicated and electrically compliant per specification. Boundary-scan testing is supported in all configuration modes and enables verification of solder joint integrity and interconnect continuity prior to functional programming of XCV1000-4FG680C.

Can XCV1000-4FG680C interface directly with 3.3 V LVTTL devices?

Yes, XCV1000-4FG680C supports 3.3 V LVTTL I/O standards on any I/O bank configured with VCCO = 3.3 V. Each IOB can be individually programmed for LVTTL 2–24 mA drive strength and fast/slow slew rate. Inputs are 5 V tolerant, allowing safe interfacing with 3.3 V LVTTL signals even if driven from higher-voltage sources - a capability confirmed in DS003-2 Table 1 and validated in production test.

How many clock regions does XCV1000-4FG680C have?

XCV1000-4FG680C contains four dedicated global clock input pins (GCLK0–GCLK3), each feeding an independent low-skew clock network. These connect to four delay-locked loops (DLLs) that generate phase-aligned clocks for distinct clock domains. While not segmented into discrete "regions," the clock architecture supports up to four simultaneous synchronous domains with sub-50 ps skew across the die - a feature documented in DS003-1 Module 1 clock-management section.

Is XCV1000-4FG680C still in active production?

No, XCV1000-4FG680C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life status confirmed in XCN10016. Aetrix Electronics maintains limited legacy inventory and provides lifecycle coordination support, including cross-reference guidance to Virtex-II or Kintex-7 alternatives where functionally appropriate - but XCV1000-4FG680C itself is no longer manufactured.