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AMD XCV1000-5BG560C

Part No.:
XCV1000-5BG560C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
560-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV1000-5BG560C.pdf
Description:
IC FPGA 404 I/O 560MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,750

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Product details

Overview

XCV1000-5BG560C from AMD is a programmable logic device in the Virtex line intended for systems that need one configurable device to absorb sequencing, interface glue logic, timing behavior, and subsystem-specific digital processing. The part pairs the Virtex architecture with the Tray package used by this orderable option, helping the design team keep board logic concentrated inside a known programmable platform.

Original Virtex devices provide older high-performance FPGA integration for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. For engineers reviewing the XCV1000-5BG560C datasheet, XCV1000-5BG560C pinout, XCV1000-5BG560C application, or XCV1000-5BG560C equivalent, this device is widely used in embedded control hardware, communications boards, industrial subsystems, programmable interface engines, and sustaining-production digital platforms.

Technical Context

In real hardware, XCV1000-5BG560C is used as a programmable logic platform rather than a fixed-function controller. The selected Virtex density and speed grade 5 orderable option. matter because logic capacity, I/O concentration, and escape routing all influence whether the device can absorb the intended subsystem workload.

The exact orderable code is important here: Tray affects PCB footprint compatibility and escape routing, speed grade 5 orderable option. affects timing margin, and the commercial temperature option indicated by the suffix. defines whether the device stays aligned with the deployment environment or qualification target.

Large Virtex density point for legacy programmable logic, broader subsystem integration, and high-I/O package-scale FPGA platforms. In practice, this means XCV1000-5BG560C is chosen when the board must preserve a known programmable logic footprint while keeping interface adaptation, digital control, and subsystem-specific logic inside one FPGA device.

Key Specifications

Parameter Value and Actual Design Meaning
Device Type Virtex FPGA.
Series Virtex
Package Tray package with unspecified packing.
Speed Grade Speed grade 5 orderable option.
Operating Range Commercial temperature option indicated by the suffix.
Architecture Role Field-programmable logic device for configurable digital control, interface adaptation, and subsystem integration.
Integration Focus Used where board-specific programmable logic, timing behavior, and interface glue functions need to be consolidated.
Programming Model Configuration-based FPGA platform within the referenced AMD/Xilinx family.

Pinout & Package

The XCV1000-5BG560C pinout includes configurable user I/O, supply rails, configuration resources, and package-specific escape pins within Tray package.

For PCB work, the main concerns are footprint continuity, power integrity, configuration access, and preserving routing around subsystem interfaces and timing-critical digital nets.

Pin / Function PCB Design and Circuit Role
User I/O Pins Configurable pins used for subsystem interfaces, address/data paths, timing signals, and board-specific digital connectivity.
Clock / Timing Pins Support synchronous logic behavior and clock distribution within the programmable fabric.
Configuration / JTAG Pins Support device programming, configuration control, and board-level debug or bring-up access.
Power Rails Support the core and I/O voltage domains required by the selected FPGA family.
Ground Pins Provide the return paths needed for stable digital switching and noise control.

Key Features

  • Configurable FPGA fabric supports board-specific logic, control, and interface integration.
  • Package options help preserve established PCB footprints and routing strategies.
  • Orderable speed grades help align the device with validated board timing margins.
  • Suitable for sustaining-production digital control and interface-consolidation functions.
  • Supports long-life hardware programs that depend on programmable logic flexibility.
  • Field-programmable behavior preserves updateability across maintenance revisions.

Applications

Embedded Digital Control Interface Concentration

Use Scenario: Used where one FPGA centralizes timing, state-machine, and control behavior on the board.

IC Role: Acts as the configurable digital control layer.

Use Value: Keeps board-specific logic updateable without redesigning multiple fixed-function ICs.

Use Scenario: Used to absorb multiple board-level interfaces or protocol adaptation tasks inside one programmable device.

IC Role: Centralizes interface translation and digital routing.

Use Value: Reduces discrete logic count and preserves a cleaner subsystem partition.

Industrial or Communications Boards Programmable Subsystem Integration

Use Scenario: Used in long-life boards that still rely on FPGA-based control, routing, or glue logic.

IC Role: Implements board-specific digital behavior and subsystem integration.

Use Value: Supports sustaining-production maintenance without a full architecture change.

Use Scenario: Used when a design must keep logic concentrated in one FPGA while preserving a known package and timing profile.

IC Role: Provides the programmable core for subsystem-specific digital functions.

Use Value: Improves lifecycle continuity and board-compatibility planning.

Equivalent & Alternatives

When evaluating a XCV1000-5BG560C equivalent, engineers should compare family generation, package footprint, speed grade, operating range, and whether the replacement preserves subsystem compatibility.

Alternative Part Technical Difference Application Difference Selection Advice
XCV1000-4FG680C Closely related orderable option in the same or adjacent family density with a different package, speed, or qualification emphasis. Used when the board stays in the same general FPGA family but requires a different orderable fit. Compare package, speed grade, suffix, and validated system margins before substitution.
XCV1000E-7FG860C Alternative programmable logic option that can serve a similar board-level role with a different density or family emphasis. Used in comparable embedded, industrial, or communications applications when the design tradeoff shifts. Choose according to footprint compatibility, logic capacity, and platform continuity.

Compared with XCV1000-4FG680C, XCV1000-5BG560C selection depends on exact package, speed grade, suffix, and board-compatibility fit. XCV1000-5BG560C vs XCV1000E-7FG860C selection depends on whether the design should remain in the same FPGA path or shift to another density with different integration tradeoffs.

Quality

XCV1000-5BG560C should be sourced as original AMD/Xilinx programmable logic inventory through traceable supply channels. Quality checks may include package inspection, top-mark validation, configuration access checks, and board-level bring-up verification.

Production validation should include power-sequencing review, configuration reliability, timing-margin confirmation, and signal-integrity checks around programmable I/O paths.

Availability

XCV1000-5BG560C is suitable for programmable subsystem integration, board-level digital control, and interface functions in embedded, industrial, and communications hardware.

Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.

For production builds, confirming package option, speed grade, operating-range suffix, lifecycle status, and sourcing continuity helps reduce procurement risk for programmable logic families.

Manufacturer

AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.

Original Virtex devices provide older high-performance FPGA integration for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. Large Virtex density point for legacy programmable logic, broader subsystem integration, and high-I/O package-scale FPGA platforms.

FAQ

What is XCV1000-5BG560C used for?

XCV1000-5BG560C is used for configurable digital control, interface concentration, and board-level subsystem integration in FPGA-based hardware.

Where can I find the XCV1000-5BG560C datasheet download?

The XCV1000-5BG560C datasheet can be accessed from the confirmed family source used for this completion pass.

What should be considered in XCV1000-5BG560C pinout design?

Designers should account for power domains, configuration access, package-driven routing, and how programmable I/O maps to board interfaces.

Is XCV1000-5BG560C a modern FPGA?

It belongs to a defined AMD/Xilinx programmable logic line with board-level configurable logic resources.

What are common XCV1000-5BG560C equivalent solutions?

Common candidates include XCV1000-4FG680C and XCV1000E-7FG860C depending on package, family architecture, logic density, and system-level compatibility needs.

XCV1000-5BG560C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
560-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
6144
Number of Logic Elements/Cells:
27648
Total RAM Bits:
131072
Number of I/O:
404
Number of Gates:
1124022
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
560-MBGA (42.5x42.5)

XCV1000-5BG560C FAQ

1.How can I place an order for XCV1000-5BG560C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV1000-5BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV1000-5BG560C reliable?

The price and inventory of XCV1000-5BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000-5BG560C is usually 5 days.

3.What payment methods are accepted for XCV1000-5BG560C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000-5BG560C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV1000-5BG560C?

XCV1000-5BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV1000-5BG560C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV1000-5BG560C?

For technical support, including XCV1000-5BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000-5BG560C requirements.

6.How does Aetrix verify that XCV1000-5BG560C is sourced from the original manufacturer or authorized distributors?

All XCV1000-5BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000-5BG560C meets industry standards.

7.What is the process for return or replacement of XCV1000-5BG560C?

All XCV1000-5BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000-5BG560C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV1000-5BG560C part is unused and in its original packaging.

Return procedure for XCV1000-5BG560C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV1000-5BG560C Tags

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