AMD XCV1000-5BG560C

Overview

XCV1000-5BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 1,124,022 system gates, 27,648 logic cells in a 64×96 CLB array, and 512 user I/O pins in a 560-ball BGA package. It supports 66-MHz PCI compliance, hot-swappable Compact PCI operation, and integrates four delay-locked loops (DLLs) for advanced clock management. It is used in high-speed digital signal processing, protocol bridging, and reconfigurable computing systems requiring deterministic timing and multi-standard I/O.

For engineers reviewing the XCV1000-5BG560C datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (200 MHz system performance), 131,072-bit block RAM, SelectIO™ interface support across 16 standards, and 0.22 μm 5-layer metal CMOS process.

Technical Context

The XCV1000-5BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers enabling up to 19-input functions, and LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or shift registers.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. I/O banking enforces voltage domain isolation: eight banks require shared VCCO per bank, and VREF-dependent standards (e.g., HSTL, SSTL) are restricted to one VREF per bank.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (FBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout conforms to DS003-4 (v4.0) Module 4 - Pinout Tables, with dedicated GCLK0–GCLK3, configuration pins (INIT, PROGRAM, CCLK, DIN, DOUT), JTAG TDI/TDO/TMS/TCK, and 512 user-configurable I/O balls distributed across eight I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV1000-5BG560C, the -6 variant offers tighter timing margins without architectural change, while XCV800-5BG560C reduces gate count and RAM by ~21% at identical speed and footprint-enabling cost-down without PCB revision.

Availability

XCV1000-5BG560C is available at Aetrix Electronics and suitable for high-reliability embedded computing, industrial protocol bridging, and reconfigurable test equipment requiring stable component supply throughout extended product lifecycles.

Supply support for XCV1000-5BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools.

The Virtex family was engineered for high-performance, high-capacity reconfigurable logic in telecommunications infrastructure, military/aerospace systems, and high-end computing-emphasizing speed, I/O flexibility, and system-level integration.

FAQ

What is the maximum operating frequency supported by XCV1000-5BG560C?

XCV1000-5BG560C is rated for synchronous system clock rates up to 200 MHz, including I/O timing, under worst-case conditions (VCC = 2.5 V ± 5%, TJ = 85°C). This is guaranteed by its -5 speed grade and verified through characterization of register-to-register paths, adders, and multiplexers per DS003-2 Table 2. Actual achievable frequency depends on design topology and place-and-route optimization.

Does XCV1000-5BG560C support hot-swap functionality?

Yes, XCV1000-5BG560C supports hot-swappable operation for Compact PCI systems. This capability is enabled by its robust I/O structure-including 5 V-tolerant LVTTL/PCI inputs, controlled slew-rate drivers, and IEEE 1149.1 boundary-scan-which allows safe insertion/removal while the backplane remains powered. Full compliance is documented in DS003-1 Module 1.

How many block RAMs does XCV1000-5BG560C contain, and what configurations are supported?

XCV1000-5BG560C contains 32 block SelectRAMs totaling 131,072 bits. Each 4k-bit block supports true dual-port operation with independent clock, address, and control signals per port. Configurable port widths include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible FIFO depth/width trade-offs and built-in bus-width conversion without external logic.

What I/O standards are supported by XCV1000-5BG560C, and how are they managed?

XCV1000-5BG560C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Classes I/III/IV, SSTL3/2, GTL+, and PCI. Standards are grouped into eight I/O banks; each bank requires a common VCCO voltage, and VREF-dependent standards (e.g., HSTL) share one VREF per bank. Mixing incompatible standards within a bank violates electrical specifications and is prevented by Xilinx ISE tool constraint checking.

Is XCV1000-5BG560C still in production, and what is its obsolescence status?

XCV1000-5BG560C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life announced in XCN10016. Aetrix Electronics maintains legacy inventory and offers long-term supply support, including traceable batch sourcing and lifecycle coordination, for customers maintaining deployed systems or fulfilling repair orders under extended maintenance contracts.