AMD XCV1000-5BG560I

Overview

XCV1000-5BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 1,124,022 system gates, 27,648 logic cells in a 64×96 CLB array, and 512 user I/O pins in a 560-ball BGA package. It features four dedicated delay-locked loops (DLLs), hierarchical memory including 131,072 bits of block SelectRAM and LUTs configurable as RAM/shift registers, and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV1000-5BG560I datasheet, pinout, applications, or equivalent options, key selection considerations include its industrial temperature range (–40°C to +100°C), –5 speed grade (5.0 ns register-to-register delay), 200 MHz system performance ceiling, multi-standard SelectIO™ interface support, and die-temperature sensor diode for thermal monitoring.

Technical Context

The XCV1000-5BG560I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets plus four global low-skew clock distribution networks, and VersaRing™ I/O routing for enhanced pin-locking flexibility. Its CLBs contain four logic cells each, with dual-slice structure supporting 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and BUFTs for internal 3-state bus driving.

Each IOB supports programmable input/output standards including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, and SSTL2/3, with independent polarity control, synchronous/asynchronous set/reset, and optional weak-keeper circuits. I/O banking enforces VCCO/VREF voltage grouping across eight banks, requiring compatible standards per bank-e.g., 1.5 V banks support HSTL I/III/IV and GTL/GTL+.

Key Specifications

Pinout & Package

Package: 560-ball Fine-pitch Ball Grid Array (BG560), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant, industrial-grade thermal profile.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV1000-5BG560I, the –6 variant delivers measurable timing headroom for aggressive clocking, while the XCV800-5BG560I offers identical packaging and speed but trades 21% logic capacity and 13% block RAM for lower unit cost-enabling scalable migration paths within the same PCB footprint.

Availability

XCV1000-5BG560I is available at Aetrix Electronics and suitable for industrial automation controllers, telecom line cards, and test & measurement instrumentation requiring stable component supply throughout extended product lifecycles.

Supply support for XCV1000-5BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it delivers FPGA, adaptive SoC, and ACAP platforms.

The Virtex family was designed as Xilinx's flagship high-performance FPGA line for demanding applications including wired/wireless infrastructure, military systems, and high-end computing-emphasizing silicon efficiency, clock management, and I/O flexibility.

FAQ

What does the "-5" suffix indicate in XCV1000-5BG560I?

The "-5" denotes the speed grade, specifying worst-case register-to-register propagation delay of 5.0 ns under industrial temperature and voltage conditions. This grade ensures reliable operation up to 200 MHz system clock rates and defines timing closure targets during place-and-route. The XCV1000-5BG560I meets all timing specifications in DS003-3 (v4.0) for this grade, including setup/hold and clock-to-out parameters.

Is XCV1000-5BG560I still in production or obsolete?

XCV1000-5BG560I is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and superseded by newer Virtex-II and Virtex-4 families. However, Aetrix Electronics maintains verified legacy inventory with full traceability, conforming to XCN10016 obsolescence guidelines. Functional replacements require redesign due to architectural differences-not drop-in compatible.

Does XCV1000-5BG560I support JTAG boundary scan?

Yes, XCV1000-5BG560I fully implements IEEE 1149.1 boundary-scan logic as a standard feature. All IOBs include scan-capable registers, and the TAP controller supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. This enables PCB-level interconnect testing and in-system programming via the JTAG port-critical for manufacturing test of high-density BG560 assemblies.

Can XCV1000-5BG560I interface directly with DDR SDRAM?

Yes, XCV1000-5BG560I supports DDR SDRAM through SSTL2 Class I/II I/O standards in dedicated I/O banks powered at 2.5 V. Its 512 I/O pins, programmable slew rate, and DLL-controlled clocking enable robust DQS capture and command/address timing. However, successful interface requires careful PCB layout matching and adherence to Xilinx Application Note XAPP235 for DDR timing constraints.

What configuration modes does XCV1000-5BG560I support?

XCV1000-5BG560I supports four configuration modes: master serial (internal PROM boot), slave serial (external controller), SelectMAP™ (8-bit parallel host interface), and JTAG (IEEE 1149.1). Mode selection is controlled by M2:M0 pins at power-up. All modes load the same SRAM-based bitstream; JTAG is used for debugging and partial reconfiguration, while SelectMAP™ enables fastest loading in production systems.