AMD XCV1000-6BG560C

Overview

XCV1000-6BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 1,124,022 system gates, 27,648 logic cells in a 64×96 CLB array, and 404 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 131,072 bits of block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV1000-6BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (guaranteed 200 MHz system performance), 5-layer-metal 0.22 μm CMOS process, SelectIO™ interface support across 16 standards, and IEEE 1149.1 boundary-scan capability for production testability.

Technical Context

The XCV1000-6BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling high place-and-route efficiency and pin-locking flexibility. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and dual-port synchronous block RAMs (4k-bit per block).

Each IOB supports programmable input/output standards including LVTTL, LVCMOS2, HSTL Class IV, SSTL3, and GTL+, with independent VCCO per I/O bank, optional weak-keeper circuits, and configurable flip-flop/latch storage elements with synchronous/asynchronous set/reset. The device uses four DLLs for clock deskew and provides four global low-skew clock nets plus 24 secondary local clock lines.

Key Specifications

Pinout & Package

The XCV1000-6BG560C is housed in a 560-ball Fine-Pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Pin assignment follows Xilinx's standardized Virtex BG560 pinout layout, organized into eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), and boundary-scan TAP signals (TCK, TMS, TDI, TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV1000-6BG560C, XCV1000-6FG676C offers more I/O in a denser package but demands new layout, while XCV800-6BG560C provides identical mechanical compatibility and timing with reduced logic resources - enabling scalable development and cost-sensitive volume production.

Availability

XCV1000-6BG560C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial control systems, and medical imaging equipment requiring stable component supply throughout extended product lifecycles.

Supply support for XCV1000-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools that defined industry standards for reconfigurable computing.

The Virtex family - including XCV1000-6BG560C - was engineered for high-performance, high-density system-on-chip integration in wired/wireless infrastructure, defense electronics, and scientific instrumentation demanding both logic capacity and signal integrity.

FAQ

What is the maximum operating frequency supported by the XCV1000-6BG560C?

The XCV1000-6BG560C is rated for synchronous system clock rates up to 200 MHz, including I/O timing, under worst-case commercial temperature and voltage conditions. This -6 speed grade guarantee is validated across register-to-register paths, carry chains, and critical I/O interfaces like HSTL Class IV and LVTTL, as confirmed in DS003-3 DC and Switching Characteristics.

Does the XCV1000-6BG560C support hot-swap functionality in CompactPCI systems?

Yes, the XCV1000-6BG560C explicitly supports hot-swappable operation in CompactPCI environments. Its I/O architecture meets PCI electrical specifications for 33 MHz and 66 MHz operation, and its configuration logic handles power-rail sequencing and initialization states required for safe insertion/removal without disrupting backplane operation.

How many block RAMs does the XCV1000-6BG560C contain, and what are their configurations?

The XCV1000-6BG560C contains 32 block SelectRAMs totaling 131,072 bits. Each block is a fully synchronous, dual-ported 4k-bit RAM with independent address/data buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible FIFO depth/width trade-offs and on-chip bus-width conversion.

Is the XCV1000-6BG560C still in active production or considered obsolete?

The XCV1000-6BG560C is classified as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with no new manufacturing planned. However, Aetrix Electronics maintains verified legacy inventory with full traceability and extended lifecycle support for ongoing maintenance and repair of deployed systems.

What configuration modes are supported by the XCV1000-6BG560C?

The XCV1000-6BG560C supports four configuration modes: master serial (autonomous boot from external PROM), slave serial (configuration via external controller), SelectMAP™ (parallel synchronous loading), and JTAG (boundary-scan programming and debugging). All modes use the same SRAM-based bitstream architecture and retain full reprogrammability.