AMD XCV1000-6FG680C

Overview

XCV1000-6FG680C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 1,124,022 system gates, 27,648 logic cells in a 64×96 CLB array, 512 user I/O pins, and four dedicated delay-locked loops (DLLs) for clock management. It supports 66-MHz PCI compliance, hot-swappable Compact PCI operation, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, SSTL2/3, HSTL, and GTL/GTL+.

For engineers reviewing the XCV1000-6FG680C datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade (6.0 ns pipelined multiplier delay), FG680 fine-pitch BGA package with 512 I/O, dual-port 4k-bit block RAMs totaling 131,072 bits, and support for 0°C to +85°C commercial temperature operation.

Technical Context

The XCV1000-6FG680C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each, with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. I/O banking enforces VCCO and VREF voltage grouping across eight banks, enabling mixed-voltage signaling within defined constraints.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG680) with 680 balls, 25 mm × 25 mm body, 1.0 mm ball pitch, and 512 user I/O pins arranged across eight I/O banks. Thermal pad on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV1000-6FG680C, XCV1000-6HQ240C trades I/O count and routing flexibility for simpler assembly and thermal management, while XCV800-6FG676C offers a pin-compatible down-bin option with reduced logic and memory resources-both require full timing revalidation but preserve architectural compatibility.

Availability

XCV1000-6FG680C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial automation controllers, and medical imaging subsystems requiring stable component supply throughout extended product lifecycles.

Supply support for XCV1000-6FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and EDA tools for adaptive computing.

The Virtex family was engineered for high-performance, high-capacity digital system integration-targeting applications demanding advanced clock management, multi-standard I/O, and scalable logic density in a single reprogrammable device.

FAQ

What is the maximum operating frequency supported by the XCV1000-6FG680C?

The XCV1000-6FG680C achieves synchronous system clock rates up to 200 MHz, including I/O timing, verified under worst-case conditions. Its -6 speed grade guarantees ≤6.0 ns delay for an 8×8 pipelined multiplier and ≤5.4 ns for a 16:1 multiplexer. Actual performance depends on design placement and routing, but benchmarked circuits consistently exceed 100 MHz in real-world implementations.

Does the XCV1000-6FG680C support hot-swap functionality?

Yes, the XCV1000-6FG680C is explicitly designed for hot-swappable Compact PCI systems. Its I/O structure, power sequencing behavior, and configuration architecture comply with Compact PCI hot-swap specifications, enabling safe insertion and removal while the backplane remains powered. This capability is enabled by robust I/O clamping, controlled power-up states, and IEEE 1149.1 boundary-scan support for pre-insertion verification.

How many block RAMs does the XCV1000-6FG680C contain, and what are their configurations?

The XCV1000-6FG680C contains 32 block SelectRAMs, each providing 4,096 bits of synchronous dual-ported memory. These blocks support independent address and data widths per port (e.g., 16×256, 8×512, 4×1024), enabling built-in bus-width conversion. All 32 blocks collectively deliver 131,072 bits of dedicated memory, distinct from distributed LUT-based RAM resources.

What I/O standards are supported by the XCV1000-6FG680C, and how are they grouped?

The XCV1000-6FG680C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI (3.3 V and 5 V), SSTL3/I/II, SSTL2/I/II, HSTL Classes I/III/IV, GTL, GTL+, and CTT. These are grouped into eight I/O banks, each requiring a common VCCO supply voltage and, where applicable, a shared VREF. Compatible standards per bank are determined by VCCO voltage level (e.g., 3.3 V, 2.5 V, or 1.5 V).

Is the XCV1000-6FG680C still in active production, and what is its obsolescence status?

The XCV1000-6FG680C is classified as obsolete/under obsolescence per Xilinx documentation DS003-1 (v4.0) dated March 2013. While no longer in active production, Aetrix Electronics maintains legacy inventory and supports long-term supply through traceable, tested stock and lifecycle coordination services for existing designs requiring continued availability.