AMD XCV1000E-6BG560C

Overview

XCV1000E-6BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1,569,178 system gates, 27,648 logic cells, and 404 user I/O pins in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V I/O standards. It is used in high-speed communication line cards requiring deterministic clock management and multi-standard interface integration.

For engineers reviewing the XCV1000E-6BG560C datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM configuration, DLL-based clock multiplication/division, and compatibility with Xilinx Foundation and Alliance development tools.

Technical Context

The XCV1000E-6BG560C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.

Its IOBs support 20 I/O standards-including LVDS (622 Mb/s), LVPECL, SSTL, HSTL, and PCI-organized across eight I/O banks with bank-specific VCCO and VREF requirements. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and up to 4× frequency multiplication without external components.

Key Specifications

Pinout & Package

The XCV1000E-6BG560C is housed in a 560-ball fine-pitch Ball Grid Array (BG560) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal dissipation in telecom and industrial applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV1000E-6BG560C, the -7BG560C offers guaranteed timing headroom for aggressive clock rates, while the -6FG676C trades package size for superior thermal management-neither is pin-compatible with the BG560 variant, requiring PCB redesign.

Availability

XCV1000E-6BG560C is available at Aetrix Electronics and suitable for high-reliability communication infrastructure, industrial motion control, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCV1000E-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software-defined platforms for aerospace, communications, and industrial markets.

The Virtex-E family was engineered for high-speed, high-density system integration-targeting applications demanding multi-gigabit I/O, deterministic clocking, and embedded memory bandwidth, such as telecom line cards and real-time signal processing.

FAQ

What is the maximum supported LVDS data rate for XCV1000E-6BG560C?

The XCV1000E-6BG560C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Features" and validated by its DLL-synchronized I/O timing. This rate applies to source-synchronous architectures using dedicated LVDS I/O pairs, and is achievable under -6 speed grade conditions with proper PCB layout and termination. The XCV1000E-6BG560C does not support differential standards beyond LVDS, BLVDS, or LVPECL per its I/O specification.

Does XCV1000E-6BG560C support partial reconfiguration?

The XCV1000E-6BG560C does not support hardware-accelerated partial reconfiguration. Its SRAM-based configuration architecture permits full reprogramming via JTAG or SelectMAP™, but the device lacks the dedicated configuration logic, frame addressing, and security features required for dynamic module swapping. Partial reconfiguration capability was introduced in later Virtex-II and Virtex-4 families-not in the Virtex-E generation containing XCV1000E-6BG560C.

What is the function of the die-temperature sensor diode in XCV1000E-6BG560C?

The die-temperature sensor diode in XCV1000E-6BG560C provides an analog voltage output proportional to junction temperature, calibrated to ±5°C accuracy. It is intended for use with external ADC circuitry to monitor thermal conditions during operation-critical for fanless industrial deployments or high-power density line cards. This diode is not self-monitoring; it requires external biasing and measurement, and no on-die thermal shutdown logic is implemented in XCV1000E-6BG560C.

Can XCV1000E-6BG560C replace Virtex-E XCV1000E-6BG432C in an existing design?

No, XCV1000E-6BG560C cannot directly replace XCV1000E-6BG432C without PCB modification. Although both share the same logic resources and speed grade, the BG560 (560-ball) and BG432 (432-ball) packages have different ball counts, layouts, and pin mappings-confirmed in DS022-1 Table 3. Pinouts are not compatible, and critical signals (e.g., GCLK, VCCO, VREF) occupy different locations. Migration requires full schematic and layout revision.

Is XCV1000E-6BG560C compatible with Xilinx ISE 14.7 software?

No, XCV1000E-6BG560C is not supported in Xilinx ISE 14.7. It is a legacy Virtex-E device requiring Xilinx Foundation Series or Alliance Series software versions current circa 2002–2006-specifically ISE 6.x through ISE 8.2. ISE 14.7 dropped support for Virtex-E and earlier families; attempting synthesis or place-and-route will result in unrecognized part errors. Legacy tool archives must be sourced for XCV1000E-6BG560C development.