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AMD XCV1000E-6BG560I
- Part No.:
- XCV1000E-6BG560I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV1000E-6BG560I.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,587
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Product details
Overview
XCV1000E-6BG560I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1.57 million system gates, 27,648 logic cells, and 660 user I/O pins in a 560-ball BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces for high-speed data acquisition and telecom line-card control.
For engineers reviewing the XCV1000E-6BG560I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-voltage reconfigurable logic platform for synchronous system clocking up to 240 MHz, source-synchronous data transmission, and embedded memory-intensive signal processing.
Technical Context
The XCV1000E-6BG560I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.
Its IO subsystem supports 20 interface standards across eight I/O banks, with VCCO-supplied input buffers for LVTTL/LVCMOS/PCI and VREF-dependent standards like SSTL/HSTL. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication - all digitally controlled without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1.57 million - defines total logic capacity for complex digital systems including protocol engines and packet classifiers. |
| Logic Cells | 27,648 - provides fine-grained, register-rich resources for pipelined datapaths and state machines. |
| User I/O Pins | 660 - enables high-bandwidth parallel interfaces such as DDR SDRAM controllers and multi-lane SerDes bridging. |
| Block RAM Bits | 393,216 - supports true dual-port memory configurations for FIFOs, frame buffers, and lookup tables without external memory. |
| DLL Count | 8 - allows independent clock domain management for multiple high-speed interfaces (e.g., LVDS + PCI + DDR). |
| Max I/O Speed | 622 Mb/s (LVDS) - enables direct connection to optical transceivers and high-speed ADC/DACs without serialization. |
| VCCINT | 1.8 V - reduces dynamic power by ~40% vs. 2.5 V Virtex, critical for thermally constrained industrial and telecom modules. |
Pinout & Package
Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Inputs | Dedicated low-skew inputs feeding DLLs; support LVPECL/LVDS at >300 MHz for jitter-sensitive timing domains. |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; requires tight regulation (±3%) due to sensitivity to voltage droop. |
| VCCO_0–VCCO_7 | I/O Bank Supplies | Independent 1.5–3.3 V supplies per bank; enable mixed-voltage I/O (e.g., 3.3 V PCI + 1.8 V LVCMOS on same device). |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference for SSTL/HSTL/GTL; must be externally sourced and stable to ±1% for setup/hold compliance. |
| TDO/TDI/TCK/TMS | JTAG Boundary Scan | IEEE 1149.1-compliant test access port; enables in-system programming and post-configuration verification. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI) across 8 banks - eliminates level-shifter ICs in mixed-signaling systems. |
| SelectRAM+™ Memory Hierarchy | 393,216-bit block RAM + 393,216-bit distributed RAM - enables on-chip buffering for video pipelines and real-time DSP without external memory latency. |
| Digital DLLs | Eight fully digital delay-locked loops with 4× multiplication and duty-cycle correction - replaces analog PLLs and external clock synthesizers in DDR/SDR applications. |
| Carry Chain Arithmetic | Dedicated 2-bit-per-CLB carry logic with cascade chain - delivers sub-5 ns 16-bit adder performance for control-loop acceleration. |
| Configurable LUTs | Each 4-input LUT implements logic, 16×1 RAM, 16-bit shift register, or dual-port RAM - unifies logic, memory, and datapath functions in single resource. |
Applications
| Telecom Line Card | Industrial Motion Controller |
|---|---|
Use Scenario: High-density aggregation of T1/E1/J1 interfaces with framing, CRC, and channelized HDLC processing. IC Role / Device Role / Timing Role: Reconfigurable protocol engine implementing multiple serial PHYs, time-slot interchange, and backplane switching fabric. Use Value: 660 I/O pins and LVDS support enable direct connection to 32+ line-interface units; 8 DLLs synchronize multiple TDM clocks to a common reference. |
Use Scenario: Real-time closed-loop servo control for multi-axis CNC machines with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: Deterministic logic fabric executing PID algorithms, position interpolation, and safety monitoring at 200 kHz loop rates. Use Value: 27,648 logic cells and dedicated carry chains achieve <5 ns arithmetic latency; 393 kbit block RAM stores trajectory profiles and error logs. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: Pixel stream aggregation from CT/MRI detector arrays, real-time histogram equalization, and DICOM compression preprocessing. IC Role / Device Role / Timing Role: High-throughput datapath processor handling parallel 16-bit pixel buses and burst-mode DDR2 memory access. Use Value: 622 Mb/s LVDS I/O captures 40+ sensor channels simultaneously; true dual-port block RAM enables ping-pong buffering during compression. |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B bus bridging in flight control computers with deterministic latency guarantees. IC Role / Device Role / Timing Role: Time-triggered communication controller managing multiple avionics networks with hardware timestamping and error injection testing. Use Value: 8 DLLs generate phase-aligned clocks for AFDX transmit/receive domains; IEEE 1149.1 boundary scan ensures DO-254 compliance verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000E-7BG560I | Higher speed grade (-7 vs. -6): 133 MHz register-to-register, 4.3 ns adder delay vs. 4.6 ns for -6. | Suitable for designs requiring tighter timing closure at 200+ MHz system clocks. | Select when worst-case timing margin is <0.5 ns or when targeting 240 MHz synchronous operation with minimal pipelining. |
| XCV1000E-6FG676I | Same speed grade and logic resources, but 676-ball Fine-Pitch BGA (FG676) package with 444 user I/O. | Better I/O density for space-constrained PCBs; supports higher pin-count memory interfaces (e.g., x72 DDR2). | Choose for compact form factors where board area is constrained but I/O count can be reduced by 33%. |
Compared with XCV1000E-6BG560I, the -7 variant improves timing margin for high-frequency control loops, while the FG676 variant trades I/O count for smaller footprint - neither offers pin compatibility, requiring layout revision for migration.
Availability
XCV1000E-6BG560I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for XCV1000E-6BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-E family was designed for high-performance, low-voltage reconfigurable computing in bandwidth-intensive applications such as wired communications, radar signal processing, and real-time video analytics.
FAQ
What is the maximum operating junction temperature for XCV1000E-6BG560I?
The XCV1000E-6BG560I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is validated under worst-case power dissipation and airflow conditions defined in DS022-3, and requires thermal design using the θJA value of 12.5°C/W for the BG560 package.
Does XCV1000E-6BG560I support JTAG configuration mode?
Yes, XCV1000E-6BG560I supports IEEE 1149.1 JTAG configuration mode for boundary-scan testing and in-system programming. The TDI, TDO, TCK, and TMS pins are dedicated and electrically compatible with standard JTAG adapters; configuration bitstream loading is supported via the JTAG instruction register.
How many differential I/O pairs does XCV1000E-6BG560I support?
XCV1000E-6BG560I supports up to 281 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capability enables implementation of 28+ LVDS channels for high-speed sensor interfaces or multi-lane display links without external serializers.
Is XCV1000E-6BG560I pin-compatible with earlier Virtex devices?
No, XCV1000E-6BG560I is not pin-compatible with original Virtex devices. While some BG560 packages appear in both families, banking rules, VCCO/VREF pin assignments, and global clock routing differ significantly - requiring full PCB redesign for migration from Virtex to Virtex-E.
What memory resources are available on XCV1000E-6BG560I?
XCV1000E-6BG560I provides 393,216 bits of synchronous block RAM organized in 96 true dual-port 4096-bit blocks, plus 393,216 bits of distributed RAM implemented in LUTs. This enables concurrent read/write access for applications like FFT buffers and video line stores without external memory access penalties.
XCV1000E-6BG560I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 393216
- Number of I/O:
- 404
- Number of Gates:
- 1569178
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV1000E-6BG560I FAQ
1.How can I place an order for XCV1000E-6BG560I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000E-6BG560I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000E-6BG560I reliable?
The price and inventory of XCV1000E-6BG560I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-6BG560I is usually 5 days.
3.What payment methods are accepted for XCV1000E-6BG560I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-6BG560I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000E-6BG560I?
XCV1000E-6BG560I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000E-6BG560I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000E-6BG560I?
For technical support, including XCV1000E-6BG560I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-6BG560I requirements.
6.How does Aetrix verify that XCV1000E-6BG560I is sourced from the original manufacturer or authorized distributors?
All XCV1000E-6BG560I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-6BG560I meets industry standards.
7.What is the process for return or replacement of XCV1000E-6BG560I?
All XCV1000E-6BG560I units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-6BG560I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000E-6BG560I part is unused and in its original packaging.
Return procedure for XCV1000E-6BG560I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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