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AMD XCV1000E-6FG1156I
- Part No.:
- XCV1000E-6FG1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA
- Datasheet:
-
XCV1000E-6FG1156I.pdf
- Description:
- IC FPGA 660 I/O 1156FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,793
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Product details
Overview
XCV1000E-6FG1156I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1.57 million system gates, 27,648 logic cells, and 660 user I/O pins in an 1156-ball Fine-Pitch BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communication subsystems.
For engineers reviewing the XCV1000E-6FG1156I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic solution for telecom line cards, video processing pipelines, and industrial real-time control systems requiring deterministic timing and multi-standard I/O flexibility.
Technical Context
The XCV1000E-6FG1156I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL, HSTL, LVDS, and LVPECL-organized across eight voltage-banked I/O groups. All I/O buffers are powered by VCCO (not VCCINT), and each bank requires shared VCCO and at most one VREF voltage, enforcing strict banking rules for mixed-standard designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1.57 million - defines total combinational logic capacity for ASIC replacement sizing |
| Logic Cells | 27,648 - provides granular, routable logic resources with integrated LUTs and flip-flops |
| User I/O Pins | 660 - enables high-bandwidth parallel interfaces and multi-protocol connectivity |
| Block RAM Bits | 393,216 - delivers true dual-port memory for simultaneous read/write in video frame buffers or packet buffering |
| DLL Count | 8 - allows independent clock domain management for DDR interfaces, SerDes alignment, and jitter reduction |
| Max I/O Speed | 622 Mb/s (LVDS) - supports source-synchronous data capture in high-speed ADC/DAC links |
| VCCINT | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher density without thermal throttling |
| Speed Grade | -6 - guarantees worst-case internal register-to-register delay ≤ 4.3 ns (per DS022-1 Table 2) |
Pinout & Package
Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Dedicated Global Clock Inputs | Low-skew clock distribution inputs tied directly to DLLs; require external termination for LVPECL/LVDS |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; must be tightly regulated ±3% for timing closure |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Bank-specific 1.5–3.3 V supplies determining output swing and input threshold compatibility |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/LVCMOS inputs; must be stable ±1% for setup/hold compliance |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan Interface | IEEE 1149.1-compliant test access port for configuration verification and in-system debugging |
| PROGRAM_B / INIT_B / DONE | Configuration Control | Asynchronous reset, configuration status, and completion handshake for master serial or SelectMAP modes |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital DLLs | Enables zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication without external PLLs |
| SelectRAM+™ Hierarchy | Combines 393,216-bit true dual-port block RAM with distributed RAM for hierarchical memory architectures (e.g., cache + main buffer) |
| SelectI/O+™ Technology | Supports 20 I/O standards in same device; allows mixed-voltage banks with per-bank VCCO/VREF control |
| SRAM-Based Configuration | Unlimited in-system reprogramming via JTAG, slave serial, or SelectMAP; bitstream encryption optional |
| Dedicated Carry & Multiplier Logic | Accelerates arithmetic-intensive functions (FFT, FIR) with hardware carry chains and embedded AND gates per CLB |
| Die Temperature Sensor | Analog diode output enables real-time thermal monitoring for fan control or throttling in sealed industrial enclosures |
Applications
| Telecom Line Card Processing | High-Speed Video Frame Buffering |
|---|---|
Use Scenario: Aggregating and grooming multiple T1/E1 or SONET OC-3 streams in carrier-grade access equipment. IC Role / Device Role / Timing Role: Reconfigurable transport processor implementing HDLC framing, CRC generation, and time-slot interchange using synchronous logic and DLL-aligned clocks. Use Value: 660 I/O pins enable parallel bus interfacing to multiple PHYs; 622 Mb/s LVDS supports backplane SERDES links without external retimers. |
Use Scenario: Real-time 1080p60 video scaling, color space conversion, and overlay compositing in broadcast production switchers. IC Role / Device Role / Timing Role: Pixel-rate pipeline engine with dual-port block RAM acting as line buffers and frame stores synchronized to pixel and field clocks. Use Value: True dual-port RAM allows simultaneous write (ingest) and read (output) at full bandwidth; eight DLLs lock to independent video clock domains (e.g., 74.25 MHz & 148.5 MHz). |
| Industrial Motion Control | PCI Express Endpoint Bridge (Legacy) |
Use Scenario: Closed-loop servo drive coordination across 8+ axes with nanosecond-level encoder sampling and PWM update timing. IC Role / Device Role / Timing Role: Deterministic real-time controller executing PID loops and generating synchronized PWM waveforms using carry-chain arithmetic and precise DLL-delayed outputs. Use Value: Dedicated carry logic achieves sub-5 ns adder latency; die-temperature sensor feeds thermal derating algorithms to maintain timing margins under load. |
Use Scenario: Bridging legacy PCI peripherals (e.g., data acquisition cards) into modern PCIe-based host systems via FPGA-based protocol translation. IC Role / Device Role / Timing Role: PCI 3.3 V/66 MHz compliant endpoint with configurable BARs, DMA engines, and interrupt mapping logic. Use Value: Native PCI compliance eliminates external glue logic; 3.3 V tolerant I/Os interface directly to legacy PCI slots without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000E-7FG1156I | Higher speed grade (-7): 3.8 ns register-to-register delay vs. 4.3 ns for -6 grade | Suitable for designs requiring tighter timing closure at 200+ MHz system clocks | Select when targeting >180 MHz internal logic frequency with minimal timing margin risk |
| XCV1000E-6FG676C | Same speed grade (-6) and logic density but 676-ball BGA package (vs. 1156); 404 user I/O | Lower I/O count and smaller footprint for cost-sensitive, space-constrained embedded control | Choose for reduced PCB layer count and assembly cost where 660 I/O is unnecessary |
Compared with XCV1000E-6FG1156I, the -7 variant trades power for higher timing margin in performance-critical paths, while the FG676C variant sacrifices I/O count and thermal headroom for lower bill-of-materials cost and simplified layout-neither is pin-compatible due to differing ball counts and I/O mappings.
Availability
XCV1000E-6FG1156I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial automation controllers, and legacy PCI system upgrades requiring stable component supply over extended product lifecycles.
Supply support for XCV1000E-6FG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic platforms for demanding system-on-chip applications.
The Virtex-E product line was designed specifically for high-speed, high-density reconfigurable computing in communications and signal processing, emphasizing I/O flexibility, embedded memory, and deterministic clock management.
FAQ
What is the maximum operating junction temperature for XCV1000E-6FG1156I?
The XCV1000E-6FG1156I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is confirmed in the DS022-1 Production Product Specification (v2.3, July 2002), and the device includes an on-die temperature sensor diode to monitor thermal conditions during runtime.
Does XCV1000E-6FG1156I support JTAG boundary scan testing?
Yes, XCV1000E-6FG1156I fully supports IEEE 1149.1 boundary scan testing. Its TCK, TMS, TDI, and TDO pins provide standardized access for configuration verification, interconnect testing, and in-system debugging-critical for high-reliability industrial and telecom applications where post-assembly validation is required.
Can XCV1000E-6FG1156I be configured via SPI flash memory?
No, XCV1000E-6FG1156I does not support direct SPI flash configuration. It supports master serial (via PROM), slave serial, SelectMAP, and JTAG modes. External configuration PROMs must use Xilinx-compatible serial PROMs (e.g., XC18V00 series) with proper address/data bus timing aligned to the device's CONFIG_RATE setting.
How many differential I/O pairs does XCV1000E-6FG1156I support?
XCV1000E-6FG1156I supports up to 281 differential I/O pairs, as specified in Table 1 of DS022-1. This capability enables high-speed differential signaling standards including LVDS, BLVDS, and LVPECL, with aggregate I/O bandwidth exceeding 100 Gb/s when fully utilized across all banks.
Is XCV1000E-6FG1156I pin-compatible with any Virtex family devices?
XCV1000E-6FG1156I is not bitstream-compatible with Virtex devices, but it is pin-compatible with other Virtex-E devices in the same FG1156 package (e.g., XCV2000E-6FG1156I), subject to minor exceptions documented in the pinout tables. It is not pin-compatible with original Virtex devices due to differences in power pin allocation and banking structure.
XCV1000E-6FG1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 1156-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 393216
- Number of I/O:
- 660
- Number of Gates:
- 1569178
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FBGA (35x35)
XCV1000E-6FG1156I FAQ
1.How can I place an order for XCV1000E-6FG1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000E-6FG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000E-6FG1156I reliable?
The price and inventory of XCV1000E-6FG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-6FG1156I is usually 5 days.
3.What payment methods are accepted for XCV1000E-6FG1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-6FG1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000E-6FG1156I?
XCV1000E-6FG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000E-6FG1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000E-6FG1156I?
For technical support, including XCV1000E-6FG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-6FG1156I requirements.
6.How does Aetrix verify that XCV1000E-6FG1156I is sourced from the original manufacturer or authorized distributors?
All XCV1000E-6FG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-6FG1156I meets industry standards.
7.What is the process for return or replacement of XCV1000E-6FG1156I?
All XCV1000E-6FG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-6FG1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000E-6FG1156I part is unused and in its original packaging.
Return procedure for XCV1000E-6FG1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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