AMD XCV1000E-6FG680C
- Part No.:
- XCV1000E-6FG680C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 680-LBGA Exposed Pad
- Datasheet:
-
XCV1000E-6FG680C.pdf
- Description:
- IC FPGA 512 I/O 680FTEBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,202
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Product details
Overview
XCV1000E-6FG680C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 1,569,178 system gates and 27,648 logic cells in a 64 × 96 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 660 user I/O pins in FG680 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and test equipment.
For engineers reviewing the XCV1000E-6FG680C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM capacity (393,216 bits), and fine-pitch BGA packaging for dense PCB layouts.
Technical Context
The XCV1000E-6FG680C implements a flexible, regular FPGA architecture with configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), interconnected via a hierarchical routing matrix. Its eight fully digital DLLs provide clock multiply/divide, zero-delay LVPECL/LVDS-to-I/O conversion, and 50% duty cycle synthesis for DDR applications.
It integrates 96 block SelectRAM modules (each 4096-bit true dual-port RAM), delivering up to 1.66 Tb/s memory bandwidth, alongside distributed RAM (393,216 bits) and dedicated carry logic for arithmetic acceleration. I/O banking enforces VCCO/VREF grouping across eight banks, supporting mixed standards like LVTTL, SSTL3, HSTL IV, and LVDS within compatible voltage domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1,569,178 - defines maximum combinational logic density for ASIC replacement or complex protocol processing. |
| Logic Cells | 27,648 - provides granular, routable logic resources for pipelined datapaths and state machines. |
| Block RAM Bits | 393,216 - enables on-chip buffering for video frame stores, packet FIFOs, or coefficient tables without external memory. |
| DLL Count | 8 - allows independent clock domain management for multi-rate interfaces (e.g., PCIe gen1 + DDR2 + serial links). |
| Max I/O Pins | 660 - supports high-pin-count parallel buses (e.g., 32-bit ZBT SRAM interface at 200 MHz) and differential signaling. |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher integration in thermally constrained systems. |
| Speed Grade | -6 - guarantees 130 MHz internal timing (4-LUT levels) and 240 MHz synchronous system clock under worst-case conditions. |
Pinout & Package
Package: Fine Pitch Ball Grid Array (FG680) with 0.8 mm pitch, 27 mm × 27 mm body size, and 680 solder balls. Designed for high-density interconnect and thermal dissipation in industrial and telecom modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew inputs feeding DLLs; supports LVPECL/LVDS clocks up to 300+ MHz. |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, RAM, and routing; requires tight regulation (±3%) and local decoupling. |
| VCCO_0–VCCO_7 | I/O Bank Power | Independent 1.5–3.3 V supplies per bank; determines supported output standards (e.g., VCCO=3.3 V enables PCI/LVTTL). |
| VREF_0–VREF_7 | I/O Threshold Reference | External reference for SSTL/HSTL inputs; one per bank, shared across all VREF-dependent standards in that bank. |
| IO_LxxN/IO_LxxP | Differential I/O Pair | LVDS/BLVDS-capable pins; N/P pair must be routed as matched-length differential traces (≤5 mil skew). |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration verification and in-system debugging. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVCMOS18, SSTL3, HSTL IV, LVDS, LVPECL) with per-bank VCCO/VREF control - enables mixed-voltage board design without level shifters. |
| SelectRAM+™ Hierarchy | 393,216 bits block RAM + 393,216 bits distributed RAM - delivers >100 Gb/s aggregate I/O bandwidth and true dual-port access for simultaneous read/write in DSP pipelines. |
| SelectLink™ DDR Interface | Hardened DDR link between FPGA fabric and external memory controllers - eliminates external PHY and reduces latency in memory-mapped peripherals. |
| Digital DLLs | Eight independent DLLs with 4× frequency multiplication and duty-cycle correction - enables precise clock deskew for source-synchronous interfaces (e.g., camera sensors, ADCs). |
| SRAM-Based Configuration | Unlimited reprogrammability via JTAG, SelectMAP™, or master serial mode - supports field-upgradable logic and secure bitstream encryption (with external PROM). |
Applications
| High-Speed Test Equipment | Optical Line Card Control |
|---|---|
Use Scenario: Real-time pattern generation and error detection in 10 GbE BER testers. IC Role / Device Role / Timing Role: FPGA acts as deterministic protocol engine and high-speed serializer/deserializer, synchronizing to 156.25 MHz reference via DLL. Use Value: 622 Mb/s LVDS I/O and 8 DLLs enable precise timing alignment across 32-channel parallel test vectors with sub-nanosecond jitter. |
Use Scenario: Forward error correction (FEC) and OTU2 framing in DWDM line cards. IC Role / Device Role / Timing Role: Configurable logic processes 10.709 Gb/s OTN streams using distributed RAM for syndrome calculation and block RAM for interleaver buffers. Use Value: 393,216-bit block RAM supports 2 kB FEC lookup tables; 1.8 V core reduces power in air-cooled 1RU chassis. |
| Industrial Machine Vision | PCI Express Bridge Logic |
Use Scenario: Multi-camera synchronization and real-time image preprocessing in factory automation. IC Role / Device Role / Timing Role: FPGA ingests four 720p@60 fps MIPI CSI-2 streams, performs edge detection, and feeds results to ARM host via AXI. Use Value: 660 I/O pins accommodate parallel sensor interfaces; LVDS support enables noise-immune cabling over 1 m distances. |
Use Scenario: Protocol translation between legacy PCI devices and modern PCIe endpoints in embedded servers. IC Role / Device Role / Timing Role: FPGA implements PCI-to-PCIe bridge with DMA engines, handling 33/66 MHz PCI timing and 2.5 GT/s PCIe gen1 encoding. Use Value: PCI-compliant 3.3 V I/O and 240 MHz system clock ensure full compliance with PCI SIG specifications without external glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000E-7FG680C | Same architecture and pinout, but -7 speed grade (125 MHz internal, 220 MHz system clock) - slower timing margins, lower power consumption. | Suitable for cost-sensitive designs where 130 MHz internal performance is not required, e.g., non-real-time control logic. | Select when thermal budget is constrained and worst-case timing closure is challenging with -6 grade. |
| XCV1000E-6FG676C | Identical speed grade and logic resources, but FG676 package (676 balls, 25 mm × 25 mm) - 4 fewer I/O pins, smaller footprint, reduced thermal mass. | Better suited for space-constrained applications like compact modular instrumentation where 656 I/O suffices. | Choose for PCB area optimization when full 660 I/O count is unnecessary and layout density is critical. |
Compared with XCV1000E-6FG680C, the -7 variant trades speed for lower static power and relaxed timing closure, while the FG676 variant maintains identical functionality in a smaller package at the expense of 4 I/O pins - both require no HDL or constraint file changes but demand package-specific PCB redesign.
Availability
XCV1000E-6FG680C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, industrial machine vision systems, and optical transport network equipment requiring stable component supply across extended product lifecycles.
Supply support for XCV1000E-6FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined solutions for aerospace, defense, and high-performance computing.
The Virtex-E family was designed for high-bandwidth, low-latency system integration - targeting applications demanding both logic density and I/O flexibility, such as protocol bridging, signal processing, and real-time control.
FAQ
What is the maximum differential I/O pair count supported by XCV1000E-6FG680C?
XCV1000E-6FG680C supports up to 344 differential I/O pairs, as confirmed in DS022-1 Table 1. This enables implementation of 344 LVDS channels (688 pins total) for ultra-high-bandwidth data acquisition or parallel interface expansion, subject to I/O banking constraints and PCB routing capability.
Does XCV1000E-6FG680C support 5 V tolerant I/O?
No, XCV1000E-6FG680C does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin - a method validated in DS022-1 Section "Virtex-E Compared to Virtex Devices" but not recommended for high-speed or hot-swap applications.
How many DLLs are integrated into XCV1000E-6FG680C, and what clock frequencies do they support?
XCV1000E-6FG680C integrates eight fully digital Delay-Locked Loops (DLLs), each capable of clock multiplication up to 4× and supporting LVPECL/LVDS clock inputs exceeding 300 MHz. These DLLs provide zero-delay conversion to any I/O standard and generate 50% duty cycle clocks essential for DDR interfaces.
Is XCV1000E-6FG680C pin-compatible with earlier Virtex family devices?
XCV1000E-6FG680C is not pin-compatible with original Virtex devices. While some packages share ball counts (e.g., FG680), banking rules, VCCO/VREF pin assignments, and I/O buffer power domains differ significantly - DS022-1 explicitly states "The Virtex-E family is not bitstream-compatible with the Virtex family" and cites minor exceptions in pinout.
What is the block RAM configuration of XCV1000E-6FG680C, and how is it structured?
XCV1000E-6FG680C contains 96 block SelectRAM modules totaling 393,216 bits, organized as 4096-bit true dual-port RAMs. Each block supports independent read/write widths per port (e.g., 32-bit write / 64-bit read), enabling efficient bus-width conversion and simultaneous access in applications like video line buffers or packet classification tables.
XCV1000E-6FG680C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 680-LBGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 393216
- Number of I/O:
- 512
- Number of Gates:
- 1569178
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 680-FTEBGA (40x40)
XCV1000E-6FG680C FAQ
1.How can I place an order for XCV1000E-6FG680C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000E-6FG680C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000E-6FG680C reliable?
The price and inventory of XCV1000E-6FG680C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-6FG680C is usually 5 days.
3.What payment methods are accepted for XCV1000E-6FG680C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-6FG680C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000E-6FG680C?
XCV1000E-6FG680C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000E-6FG680C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000E-6FG680C?
For technical support, including XCV1000E-6FG680C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-6FG680C requirements.
6.How does Aetrix verify that XCV1000E-6FG680C is sourced from the original manufacturer or authorized distributors?
All XCV1000E-6FG680C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-6FG680C meets industry standards.
7.What is the process for return or replacement of XCV1000E-6FG680C?
All XCV1000E-6FG680C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-6FG680C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000E-6FG680C part is unused and in its original packaging.
Return procedure for XCV1000E-6FG680C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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