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AMD XCV1000E-6FG680C

Part No.:
XCV1000E-6FG680C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
680-LBGA Exposed Pad
Datasheet:
AetrixXCV1000E-6FG680C.pdf
Description:
IC FPGA 512 I/O 680FTEBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,202

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Product details

Overview

XCV1000E-6FG680C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 1,569,178 system gates and 27,648 logic cells in a 64 × 96 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 660 user I/O pins in FG680 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and test equipment.

For engineers reviewing the XCV1000E-6FG680C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM capacity (393,216 bits), and fine-pitch BGA packaging for dense PCB layouts.

Technical Context

The XCV1000E-6FG680C implements a flexible, regular FPGA architecture with configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), interconnected via a hierarchical routing matrix. Its eight fully digital DLLs provide clock multiply/divide, zero-delay LVPECL/LVDS-to-I/O conversion, and 50% duty cycle synthesis for DDR applications.

It integrates 96 block SelectRAM modules (each 4096-bit true dual-port RAM), delivering up to 1.66 Tb/s memory bandwidth, alongside distributed RAM (393,216 bits) and dedicated carry logic for arithmetic acceleration. I/O banking enforces VCCO/VREF grouping across eight banks, supporting mixed standards like LVTTL, SSTL3, HSTL IV, and LVDS within compatible voltage domains.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates1,569,178 - defines maximum combinational logic density for ASIC replacement or complex protocol processing.
Logic Cells27,648 - provides granular, routable logic resources for pipelined datapaths and state machines.
Block RAM Bits393,216 - enables on-chip buffering for video frame stores, packet FIFOs, or coefficient tables without external memory.
DLL Count8 - allows independent clock domain management for multi-rate interfaces (e.g., PCIe gen1 + DDR2 + serial links).
Max I/O Pins660 - supports high-pin-count parallel buses (e.g., 32-bit ZBT SRAM interface at 200 MHz) and differential signaling.
Core Voltage (VCCINT)1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher integration in thermally constrained systems.
Speed Grade-6 - guarantees 130 MHz internal timing (4-LUT levels) and 240 MHz synchronous system clock under worst-case conditions.

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG680) with 0.8 mm pitch, 27 mm × 27 mm body size, and 680 solder balls. Designed for high-density interconnect and thermal dissipation in industrial and telecom modules.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK7Global Clock InputDedicated low-skew inputs feeding DLLs; supports LVPECL/LVDS clocks up to 300+ MHz.
VCCINTCore Power Supply1.8 V supply for CLBs, RAM, and routing; requires tight regulation (±3%) and local decoupling.
VCCO_0–VCCO_7I/O Bank PowerIndependent 1.5–3.3 V supplies per bank; determines supported output standards (e.g., VCCO=3.3 V enables PCI/LVTTL).
VREF_0–VREF_7I/O Threshold ReferenceExternal reference for SSTL/HSTL inputs; one per bank, shared across all VREF-dependent standards in that bank.
IO_LxxN/IO_LxxPDifferential I/O PairLVDS/BLVDS-capable pins; N/P pair must be routed as matched-length differential traces (≤5 mil skew).
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test interface for configuration verification and in-system debugging.

Key Features

Feature Design Value
SelectI/O+™ TechnologySupports 20 I/O standards (LVTTL, LVCMOS18, SSTL3, HSTL IV, LVDS, LVPECL) with per-bank VCCO/VREF control - enables mixed-voltage board design without level shifters.
SelectRAM+™ Hierarchy393,216 bits block RAM + 393,216 bits distributed RAM - delivers >100 Gb/s aggregate I/O bandwidth and true dual-port access for simultaneous read/write in DSP pipelines.
SelectLink™ DDR InterfaceHardened DDR link between FPGA fabric and external memory controllers - eliminates external PHY and reduces latency in memory-mapped peripherals.
Digital DLLsEight independent DLLs with 4× frequency multiplication and duty-cycle correction - enables precise clock deskew for source-synchronous interfaces (e.g., camera sensors, ADCs).
SRAM-Based ConfigurationUnlimited reprogrammability via JTAG, SelectMAP™, or master serial mode - supports field-upgradable logic and secure bitstream encryption (with external PROM).

Applications

High-Speed Test Equipment Optical Line Card Control

Use Scenario: Real-time pattern generation and error detection in 10 GbE BER testers.

IC Role / Device Role / Timing Role: FPGA acts as deterministic protocol engine and high-speed serializer/deserializer, synchronizing to 156.25 MHz reference via DLL.

Use Value: 622 Mb/s LVDS I/O and 8 DLLs enable precise timing alignment across 32-channel parallel test vectors with sub-nanosecond jitter.

Use Scenario: Forward error correction (FEC) and OTU2 framing in DWDM line cards.

IC Role / Device Role / Timing Role: Configurable logic processes 10.709 Gb/s OTN streams using distributed RAM for syndrome calculation and block RAM for interleaver buffers.

Use Value: 393,216-bit block RAM supports 2 kB FEC lookup tables; 1.8 V core reduces power in air-cooled 1RU chassis.

Industrial Machine Vision PCI Express Bridge Logic

Use Scenario: Multi-camera synchronization and real-time image preprocessing in factory automation.

IC Role / Device Role / Timing Role: FPGA ingests four 720p@60 fps MIPI CSI-2 streams, performs edge detection, and feeds results to ARM host via AXI.

Use Value: 660 I/O pins accommodate parallel sensor interfaces; LVDS support enables noise-immune cabling over 1 m distances.

Use Scenario: Protocol translation between legacy PCI devices and modern PCIe endpoints in embedded servers.

IC Role / Device Role / Timing Role: FPGA implements PCI-to-PCIe bridge with DMA engines, handling 33/66 MHz PCI timing and 2.5 GT/s PCIe gen1 encoding.

Use Value: PCI-compliant 3.3 V I/O and 240 MHz system clock ensure full compliance with PCI SIG specifications without external glue logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV1000E-7FG680CSame architecture and pinout, but -7 speed grade (125 MHz internal, 220 MHz system clock) - slower timing margins, lower power consumption.Suitable for cost-sensitive designs where 130 MHz internal performance is not required, e.g., non-real-time control logic.Select when thermal budget is constrained and worst-case timing closure is challenging with -6 grade.
XCV1000E-6FG676CIdentical speed grade and logic resources, but FG676 package (676 balls, 25 mm × 25 mm) - 4 fewer I/O pins, smaller footprint, reduced thermal mass.Better suited for space-constrained applications like compact modular instrumentation where 656 I/O suffices.Choose for PCB area optimization when full 660 I/O count is unnecessary and layout density is critical.

Compared with XCV1000E-6FG680C, the -7 variant trades speed for lower static power and relaxed timing closure, while the FG676 variant maintains identical functionality in a smaller package at the expense of 4 I/O pins - both require no HDL or constraint file changes but demand package-specific PCB redesign.

Availability

XCV1000E-6FG680C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, industrial machine vision systems, and optical transport network equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV1000E-6FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined solutions for aerospace, defense, and high-performance computing.

The Virtex-E family was designed for high-bandwidth, low-latency system integration - targeting applications demanding both logic density and I/O flexibility, such as protocol bridging, signal processing, and real-time control.

FAQ

What is the maximum differential I/O pair count supported by XCV1000E-6FG680C?

XCV1000E-6FG680C supports up to 344 differential I/O pairs, as confirmed in DS022-1 Table 1. This enables implementation of 344 LVDS channels (688 pins total) for ultra-high-bandwidth data acquisition or parallel interface expansion, subject to I/O banking constraints and PCB routing capability.

Does XCV1000E-6FG680C support 5 V tolerant I/O?

No, XCV1000E-6FG680C does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin - a method validated in DS022-1 Section "Virtex-E Compared to Virtex Devices" but not recommended for high-speed or hot-swap applications.

How many DLLs are integrated into XCV1000E-6FG680C, and what clock frequencies do they support?

XCV1000E-6FG680C integrates eight fully digital Delay-Locked Loops (DLLs), each capable of clock multiplication up to 4× and supporting LVPECL/LVDS clock inputs exceeding 300 MHz. These DLLs provide zero-delay conversion to any I/O standard and generate 50% duty cycle clocks essential for DDR interfaces.

Is XCV1000E-6FG680C pin-compatible with earlier Virtex family devices?

XCV1000E-6FG680C is not pin-compatible with original Virtex devices. While some packages share ball counts (e.g., FG680), banking rules, VCCO/VREF pin assignments, and I/O buffer power domains differ significantly - DS022-1 explicitly states "The Virtex-E family is not bitstream-compatible with the Virtex family" and cites minor exceptions in pinout.

What is the block RAM configuration of XCV1000E-6FG680C, and how is it structured?

XCV1000E-6FG680C contains 96 block SelectRAM modules totaling 393,216 bits, organized as 4096-bit true dual-port RAMs. Each block supports independent read/write widths per port (e.g., 32-bit write / 64-bit read), enabling efficient bus-width conversion and simultaneous access in applications like video line buffers or packet classification tables.

XCV1000E-6FG680C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
680-LBGA Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
6144
Number of Logic Elements/Cells:
27648
Total RAM Bits:
393216
Number of I/O:
512
Number of Gates:
1569178
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
680-FTEBGA (40x40)

XCV1000E-6FG680C FAQ

1.How can I place an order for XCV1000E-6FG680C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV1000E-6FG680C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV1000E-6FG680C reliable?

The price and inventory of XCV1000E-6FG680C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-6FG680C is usually 5 days.

3.What payment methods are accepted for XCV1000E-6FG680C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-6FG680C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV1000E-6FG680C?

XCV1000E-6FG680C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV1000E-6FG680C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV1000E-6FG680C?

For technical support, including XCV1000E-6FG680C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-6FG680C requirements.

6.How does Aetrix verify that XCV1000E-6FG680C is sourced from the original manufacturer or authorized distributors?

All XCV1000E-6FG680C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-6FG680C meets industry standards.

7.What is the process for return or replacement of XCV1000E-6FG680C?

All XCV1000E-6FG680C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-6FG680C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV1000E-6FG680C part is unused and in its original packaging.

Return procedure for XCV1000E-6FG680C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV1000E-6FG680C Tags

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