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AMD XCV1000E-6FG680I

Part No.:
XCV1000E-6FG680I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
680-LBGA Exposed Pad
Datasheet:
AetrixXCV1000E-6FG680I.pdf
Description:
IC FPGA 512 I/O 680FTEBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,630

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Product details

Overview

XCV1000E-6FG680I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1,569,178 system gates, 27,648 logic cells, and 660 user I/O pins in a 680-ball Fine-Pitch Ball Grid Array (FG680) package. It features eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed communication subsystems.

For engineers reviewing the XCV1000E-6FG680I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic solution for telecom line cards, video processing pipelines, and industrial real-time control systems requiring deterministic timing and multi-standard I/O interoperability.

Technical Context

The XCV1000E-6FG680I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, LVDS, and LVPECL-with banked VCCO and VREF domains. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise clock domain crossing in multi-rate systems.

Key Specifications

ParameterValue and Actual Design Meaning
System Gates1,569,178 - defines maximum combinational logic capacity for ASIC replacement or complex datapath implementation
Logic Cells27,648 - provides fine-grained programmable resources for pipelined arithmetic, state machines, and control logic
User I/O Pins660 - enables high-bandwidth parallel bus interfacing, including 32/64-bit PCI and source-synchronous DDR memory channels
Block RAM Bits393,216 - delivers true dual-port synchronous memory for FIFOs, frame buffers, or coefficient storage without external SRAM
DLL Count8 - supports independent clock domain management for multiple high-speed interfaces (e.g., LVDS SerDes + PCI + DDR)
Internal VoltageVCCINT = 1.8 V - reduces dynamic power consumption by ~40% vs. 2.5 V Virtex devices while maintaining performance
Max I/O Speed622 Mb/s (LVDS) - enables direct connection to optical transceivers or high-speed ADC/DAC without external serializers
Speed Grade-6 - guarantees worst-case register-to-register delay ≤ 4.3 ns and adder propagation ≤ 6.3 ns at industrial temperature

Pinout & Package

Package: Fine-Pitch Ball Grid Array (FG680), 27 × 27 mm, 0.8 mm ball pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK7Global Clock InputsDedicated low-skew clock inputs routed to all DLLs; required for synchronous system timing and DDR clocking
VCCINTCore Logic Supply1.8 V supply for CLBs, RAM, and routing; must be decoupled locally to meet noise immunity requirements
VCCO_0–VCCO_7I/O Bank PowerBank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O (e.g., 3.3 V PCI + 1.8 V LVCMOS on same device)
VREF_0–VREF_7Input Threshold ReferenceBank-specific reference voltage for SSTL/HSTL/GTL+ input receivers; must be externally sourced and stable within ±1%
IO_LxxN/IO_LxxPDifferential I/O PairsLVDS/LVPECL-capable differential pairs supporting 622 Mb/s data rates; require controlled-impedance PCB routing
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test access port for configuration, debugging, and in-system verification

Key Features

FeatureDesign Value
Eight Digital DLLsEnables jitter-free clock multiplication, phase alignment, and zero-delay conversion between LVPECL/LVDS and single-ended I/O standards
True Dual-Port Block RAMAllows simultaneous read/write access to same memory block-critical for ping-pong buffering in video or radar processing
SelectI/O+ TechnologySupports 20 I/O standards in one device, eliminating level-shifters and simplifying board design for heterogeneous interfaces
SRAM-Based ConfigurationPermits unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode-ideal for field-upgradable systems
Dedicated Carry LogicAccelerates arithmetic operations (e.g., counters, accumulators) with sub-ns carry propagation across CLB columns
Die-Temperature Sensor DiodeProvides analog output proportional to junction temperature-enables thermal monitoring and dynamic throttling in sealed enclosures

Applications

Telecom Line Card InterfaceHigh-Speed Video Processing

Use Scenario: Aggregating 16-channel OC-48 SONET framer outputs into a unified backplane interface using source-synchronous LVDS links.

IC Role / Device Role / Timing Role: Reconfigurable protocol mapper and elastic buffer controller synchronizing asynchronous framers to a common 155.52 MHz system clock.

Use Value: Eliminates discrete FIFOs and clock-domain-crossing logic; leverages 8 DLLs to deskew 16 LVDS lanes and maintain <100 ps inter-lane skew.

Use Scenario: Real-time 4K60 RGB/YUV color-space conversion and de-interlacing pipeline with frame buffering.

IC Role / Device Role / Timing Role: Programmable video processor implementing pixel-level arithmetic, line buffers, and dual-port frame store controllers.

Use Value: Uses 96 block RAMs (393,216 bits) as synchronized ping-pong frame buffers-enabling zero-latency frame switching without external DRAM.

Industrial Motion ControlPCI Express Endpoint Bridge

Use Scenario: Closed-loop servo drive managing 8-axis position feedback, PWM generation, and safety interlock monitoring.

IC Role / Device Role / Timing Role: Deterministic real-time controller executing PID loops at 200 kHz with hardware-accelerated math units and interrupt latency <500 ns.

Use Value: Achieves sub-microsecond jitter using dedicated carry logic for encoder counting and internal 3-state bussing for fast I/O arbitration.

Use Scenario: Legacy PCI-to-PCIe bridge for upgrading embedded instrumentation chassis with PCIe Gen1 endpoints.

IC Role / Device Role / Timing Role: Protocol translator and packet assembler/disassembler handling TLPs, configuration space mapping, and BAR decoding.

Use Value: Leverages 660 I/Os and PCI-compliant 3.3 V signaling to implement full 32-bit/33 MHz PCI bus while generating compliant PCIe 2.5 GT/s serial lanes via external PHY.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCV1000E-7FG680ISame architecture and pinout, but -7 speed grade offers 15% faster timing (e.g., 3.8 ns register-to-register vs. 4.3 ns)Better suited for designs requiring >200 MHz system clocks or tighter setup/hold marginsSelect when timing closure fails on -6 grade or when migrating from Virtex-E -7 designs
XCV1000-6HQ240CDifferent package (240-pin HQFP vs. 680-ball FG680); only 158 user I/Os; no LVDS/LVPECL support; 2.5 V VCCINTLimited to low-I/O, cost-sensitive applications where PCI-only I/O suffices and thermal envelope permits HQ packagingChoose only for legacy board reuse where FG680 footprint is unavailable and I/O count <200

Compared with XCV1000E-6FG680I, the -7 variant improves maximum operating frequency without layout changes, while the HQ240C alternative sacrifices I/O count, differential signaling, and power efficiency to reduce package cost and size-making it unsuitable for new high-performance designs.

Availability

XCV1000E-6FG680I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial automation systems requiring stable component supply, long-term lifecycle support, and guaranteed industrial-temperature operation.

Supply support for XCV1000E-6FG680I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and toolchains for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density reconfigurable computing in wireline communications, test equipment, and real-time signal processing-emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.

FAQ

What is the maximum LVDS data rate supported by XCV1000E-6FG680I?

XCV1000E-6FG680I supports LVDS signaling at up to 622 Mb/s per differential pair, verified in DS022-1 (v2.3) Section 1. This rate is achievable using source-synchronous architectures with DLL-aligned clocks and requires proper PCB impedance control (100 Ω differential) and termination. The device's IOBs include matched input delays to eliminate pad-to-pad hold time at this speed.

Does XCV1000E-6FG680I support true dual-port block RAM?

Yes, XCV1000E-6FG680I includes 96 block RAMs totaling 393,216 bits, each configured as true dual-port synchronous RAM with independent read/write addresses, clocks, and enables per port. This capability is documented in DS022-2 (v2.8) Module 2, Table 4 and Figure 6, enabling concurrent access for applications like frame buffering and FIFOs without external memory.

What are the power supply requirements for XCV1000E-6FG680I?

XCV1000E-6FG680I requires two primary supplies: VCCINT = 1.8 V ±3% for core logic and distributed RAM, and bank-specific VCCO (1.5 V to 3.3 V) for I/O drivers. Each I/O bank has dedicated VCCO and optional VREF pins; mixing standards within a bank requires identical VCCO. Decoupling must follow Xilinx's recommended capacitor network per DS022-3.

Is XCV1000E-6FG680I pin-compatible with other Virtex-E devices in FG680 packaging?

XCV1000E-6FG680I shares the FG680 package footprint with XCV600E-6FG680I and XCV1600E-6FG680I, but pin functions differ due to varying I/O counts and bank allocations. DS022-4 (Module 4) confirms that XCV1000E-6FG680I uses all 660 user I/O positions, while smaller devices leave some balls as No Connect. Direct substitution requires netlist and constraint file revision.

Can XCV1000E-6FG680I be configured via JTAG in-system?

Yes, XCV1000E-6FG680I supports IEEE 1149.1 JTAG boundary-scan configuration in-system using TCK/TMS/TDI/TDO pins. It also supports slave serial, SelectMAP, and master serial modes. JTAG allows full configuration bitstream loading, debug access, and boundary-scan testing without requiring external PROMs-verified in DS022-1 Section "SRAM-Based In-System Configuration".

XCV1000E-6FG680I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
680-LBGA Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
6144
Number of Logic Elements/Cells:
27648
Total RAM Bits:
393216
Number of I/O:
512
Number of Gates:
1569178
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
680-FTEBGA (40x40)

XCV1000E-6FG680I FAQ

1.How can I place an order for XCV1000E-6FG680I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV1000E-6FG680I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV1000E-6FG680I reliable?

The price and inventory of XCV1000E-6FG680I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-6FG680I is usually 5 days.

3.What payment methods are accepted for XCV1000E-6FG680I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-6FG680I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV1000E-6FG680I?

XCV1000E-6FG680I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV1000E-6FG680I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV1000E-6FG680I?

For technical support, including XCV1000E-6FG680I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-6FG680I requirements.

6.How does Aetrix verify that XCV1000E-6FG680I is sourced from the original manufacturer or authorized distributors?

All XCV1000E-6FG680I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-6FG680I meets industry standards.

7.What is the process for return or replacement of XCV1000E-6FG680I?

All XCV1000E-6FG680I units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-6FG680I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV1000E-6FG680I part is unused and in its original packaging.

Return procedure for XCV1000E-6FG680I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV1000E-6FG680I Tags

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