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AMD XCV1000E-6FG900C
- Part No.:
- XCV1000E-6FG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XCV1000E-6FG900C.pdf
- Description:
- IC FPGA 660 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,548
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Product details
Overview
XCV1000E-6FG900C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1.57 million system gates, 27,648 logic cells, and 660 user I/O pins in a 900-ball Fine-Pitch Ball Grid Array (FG900) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.
For engineers reviewing the XCV1000E-6FG900C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic solution for telecom line cards, video processing pipelines, and protocol bridging where deterministic timing, multi-standard I/O, and on-chip memory bandwidth >1.6 Tb/s are required.
Technical Context
The XCV1000E-6FG900C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four 4-input LUTs with dedicated carry chains, dual flip-flops per slice, and F5/F6 multiplexers enabling 5- to 6-input logic functions.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL-organized across eight voltage-banked I/O groups. Each bank requires shared VCCO and, where applicable, a single VREF; input buffers for LVTTL/LVCMOS/PCI are powered by VCCO (not VCCINT), enforcing strict banking rules for mixed-standard designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1.57 million - defines total logic capacity for complex RTL synthesis targeting telecom or imaging applications |
| Logic Cells | 27,648 - provides granular, routable logic resources with dedicated carry and arithmetic support |
| User I/O Pins | 660 - enables high-pin-count parallel bus interfacing (e.g., DDR SDRAM, ZBT SRAM, or custom ASIC glue logic) |
| Block RAM Bits | 393,216 - delivers true dual-port synchronous memory for FIFOs, frame buffers, or lookup tables without external memory |
| DLL Count | 8 - allows independent clock domain management for multiple high-speed interfaces (e.g., LVDS + PCI + DDR) |
| Max I/O Speed | 622 Mb/s (LVDS) - supports source-synchronous data capture for optical transport or test equipment front-ends |
| VCCINT | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher density at lower thermal load |
| Speed Grade | -6 - guarantees worst-case internal register-to-register delay ≤ 4.3 ns (per DS022-1 Table 2) |
Pinout & Package
Package: 900-ball Fine-Pitch Ball Grid Array (FG900), 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew clock inputs routed to all DLLs; required for synchronous system timing control |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, BRAM, and DLLs; must be filtered and decoupled per Xilinx layout guidelines |
| VCCO_0–VCCO_7 | I/O Bank Power | Independent 1.5–3.3 V supplies per I/O bank; determines compatible signaling standards within each bank |
| VREF_0–VREF_7 | Input Threshold Reference | Required only for SSTL/HSTL/GTL+ inputs; must be stable ±1% and shared across all pins in same bank |
| IO_LxxN/IO_LxxP | Differential I/O Pair | LVDS/BLEDS-capable pairs; N/P pins must be routed as matched-length differential traces |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration, debug, and in-system verification |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital DLLs | Enables zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication without external PLLs |
| True Dual-Port Block RAM | Allows simultaneous read/write access to same memory block-critical for real-time video frame buffering or packet inspection engines |
| SelectI/O+ Banking | Permits mixing of up to 20 I/O standards (e.g., LVDS + LVTTL + SSTL) across separate banks, simplifying multi-voltage board design |
| SRAM-Based Configuration | Supports unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode-ideal for field-upgradable systems |
| Dedicated Carry & Multiplier Logic | Accelerates arithmetic-intensive functions (e.g., FIR filters, CRC generators) without consuming LUT resources |
| Die-Temperature Sensor Diode | Provides analog output proportional to junction temperature-enables thermal monitoring and throttling in dense compute modules |
Applications
| Telecom Line Card Processing | High-Speed Video Frame Buffering |
|---|---|
Use Scenario: Aggregating and grooming OC-48/STM-16 traffic in metro edge routers using SerDes-to-FPGA parallel bridging. IC Role / Device Role / Timing Role: Reconfigurable protocol mapper and header processor with deterministic latency <5 ns between parallel I/O and internal logic paths. Use Value: 660 I/O pins enable full-width 32-bit × 200 MHz DDR SDRAM interface plus 48 LVDS lanes for SerDes alignment, eliminating external glue logic. | Use Scenario: Real-time 4K60 RGB/YUV conversion pipeline with on-the-fly chroma subsampling and scaling. IC Role / Device Role / Timing Role: Pixel-rate logic fabric with synchronized dual-port BRAM blocks acting as line buffers and frame stores. Use Value: 393,216 bits of true dual-port BRAM allow concurrent write (sensor stream) and read (display engine) at 200 MHz, sustaining >3.2 Gb/s throughput. |
| PCI Express Gen1 Bridge Logic | Test Equipment Pattern Generator |
Use Scenario: Converting legacy parallel bus peripherals (e.g., GPIB, VXI) to PCIe endpoint devices in automated test systems. IC Role / Device Role / Timing Role: High-fanout, low-latency bridge with PCI 3.3 V 66 MHz compliance and integrated DLL-controlled clock domain crossing. Use Value: Eight DLLs manage independent clocks for PCI, local bus, and PCIe reference, while 27,648 logic cells implement DMA controllers and descriptor fetch engines. | Use Scenario: Generating multi-channel, jitter-tolerant digital stimulus patterns for ATE platforms testing high-speed SerDes PHYs. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with LVDS outputs synchronized to 300+ MHz LVPECL clocks via DLL zero-delay conversion. Use Value: LVPECL clock inputs and 622 Mb/s LVDS outputs ensure sub-100 ps edge placement accuracy, meeting JEDEC JESD65B timing margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000E-7FG900C | Same architecture and pinout; -7 speed grade offers 15% faster internal timing (e.g., 3.7 ns register-to-register vs. 4.3 ns) | Suitable for designs requiring tighter setup/hold margins or higher clock frequencies (>160 MHz system clock) | Select when timing closure fails on -6 grade or when migrating from -7 to -6 is not acceptable for performance headroom |
| XCV1000E-6FG680C | Same speed grade and logic resources; FG680 package has 680 balls, 512 user I/O (vs. 660 in FG900) | Appropriate for space-constrained PCBs where I/O count can be reduced by >7% without sacrificing logic density | Choose when board layout prioritizes smaller footprint over maximum I/O expansion capability |
Compared with XCV1000E-6FG900C, the -7 variant improves worst-case timing margin for high-frequency control paths, while the FG680 variant trades 148 I/O pins for reduced package area and lower BOM cost-neither is pin-compatible with FG900, requiring PCB redesign.
Availability
XCV1000E-6FG900C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and automated test equipment requiring stable component supply across extended production lifecycles.
Supply support for XCV1000E-6FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and delivers programmable silicon solutions for adaptive computing across aerospace, communications, and industrial markets.
The Virtex-E family was designed specifically for high-bandwidth, low-latency reconfigurable systems demanding multi-standard I/O, embedded memory bandwidth >1 Tb/s, and deterministic clock management-targeting next-generation networking and signal processing.
FAQ
What is the maximum supported LVDS data rate for XCV1000E-6FG900C?
The XCV1000E-6FG900C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Section "Features" and validated by source-synchronous timing measurements in Table 2. This rate applies to differential I/O pairs configured in LVDS mode with proper termination and PCB layout; actual achievable rate depends on board-level signal integrity and clock stability.
Does XCV1000E-6FG900C support true dual-port block RAM operation?
Yes, XCV1000E-6FG900C includes 96 block SelectRAM units, each providing true dual-port synchronous 4096-bit RAM with independent read/write addresses, clocks, and enables per port. This capability is documented in DS022-2 Module 2, Table 4 and Figure 6, enabling concurrent access for applications like ping-pong frame buffering or real-time packet inspection.
How many digital DLLs are integrated into XCV1000E-6FG900C?
XCV1000E-6FG900C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 Module 1 "Features" and DS022-2 Module 2 "Architectural Description". These DLLs provide clock multiply/divide, zero-delay conversion, and 50% duty cycle synthesis-critical for DDR interfaces and multi-domain synchronization.
Is XCV1000E-6FG900C pin-compatible with other Virtex-E devices in FG900 packaging?
No, XCV1000E-6FG900C is not pin-compatible with smaller Virtex-E devices (e.g., XCV600E or XCV400E) in FG900 packages. Per DS022-1 Module 1, "The same device in the same package for the Virtex-E and Virtex families are pin-compatible with some minor exceptions", but pinouts differ across device densities-even within FG900-due to varying I/O bank allocations and dedicated resource placement.
What I/O standards does XCV1000E-6FG900C support natively without external components?
XCV1000E-6FG900C natively supports LVTTL, LVCMOS2, LVCMOS18, SSTL3, SSTL2, HSTL, GTL, GTL+, CTT, AGP-2X, PCI33_3, PCI66_3, BLVDS, LVDS, and LVPECL per DS022-2 Table 1. No external level shifters are needed; however, VCCO and (where required) VREF voltages must be supplied per I/O bank, and termination resistors may be needed for stub-matched buses.
XCV1000E-6FG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 393216
- Number of I/O:
- 660
- Number of Gates:
- 1569178
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XCV1000E-6FG900C FAQ
1.How can I place an order for XCV1000E-6FG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000E-6FG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000E-6FG900C reliable?
The price and inventory of XCV1000E-6FG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-6FG900C is usually 5 days.
3.What payment methods are accepted for XCV1000E-6FG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-6FG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000E-6FG900C?
XCV1000E-6FG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000E-6FG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000E-6FG900C?
For technical support, including XCV1000E-6FG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-6FG900C requirements.
6.How does Aetrix verify that XCV1000E-6FG900C is sourced from the original manufacturer or authorized distributors?
All XCV1000E-6FG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-6FG900C meets industry standards.
7.What is the process for return or replacement of XCV1000E-6FG900C?
All XCV1000E-6FG900C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-6FG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000E-6FG900C part is unused and in its original packaging.
Return procedure for XCV1000E-6FG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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